公开(公告)号：EP2266149B1

公开(公告)日：2017-08-23

申请号：EP09722834.0

申请日：2009-03-13

申请人： Koninklijke Philips N.V. ,  Philips Lumileds Lighting Company LLC

发明人： BASIN, Grigoriy ,  DIANA, Frederic ,  MARTIN, Paul, S. ,  SIMONIAN, Dima

IPC分类号： H01L33/54 ,  H01L33/56 ,  H01L33/00

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

公开(公告)号：EP2266149A1

公开(公告)日：2010-12-29

申请号：EP09722834.0

申请日：2009-03-13

申请人： Koninklijke Philips Electronics N.V. ,  Philips Lumileds Lighting Company LLC

发明人： BASIN, Grigoriy ,  DIANA, Frederic ,  MARTIN, Paul, S. ,  SIMONIAN, Dima

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： An underfill technique for LEDs (10, 12) uses compression molding (50) to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer (22). The molding process causes liquid or softened underfill material (41) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material (54) over the top and sides of the LED dies is removed using microbead blasting (58). The exposed growth substrate (12) is then removed from all the LED dies by laser lift-off (60), and the underfill supports the brittle epitaxial layers (10) of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从裸露的生长衬底去除所有的LED管芯，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分割。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。