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公开(公告)号：EP4375976A3
公开(公告)日：2024-08-07
申请号：EP24169684.8
申请日：2018-09-04
发明人： TAKEYA, Motonobu , SON, Sung Su , LEE, Jong Ik , HONG, Seung Sik
IPC分类号： H01L25/075 , H01L33/38 , H01L33/58 , H01L33/62 , H01L33/56 , H01L33/00 , H01L33/48 , G09F13/22
CPC分类号： H01L25/075 , H01L33/00 , H01L33/38 , H01L33/48 , H01L33/56 , H01L33/58 , H01L33/62 , H01L25/0753 , H01L33/0095 , H01L2933/006620130101
摘要： The present invention relates to a display device and a method for manufacturing the same. A display device according to an embodiment of the present invention may comprise: multiple light-emitting modules having multiple signal lines and multiple common lines arranged therein, and having multiple light-emitting diodes mounted on the respective upper sides thereof, the multiple light-emitting diodes being electrically connected to the multiple signal lines and the multiple common lines, respectively; a motherboard to which the multiple light-emitting modules are coupled; and an adhesion part which is electroconductive and couples each of the multiple light-emitting modules to the motherboard, wherein: multiple signal line terminals electrically connected to the multiple signal lines, and multiple common line terminals electrically connected the multiple common lines are formed on the lower sides of the multiple light-emitting modules, respectively; and multiple board signal line terminals are formed and positioned to correspond to the multiple signal line terminals formed on the multiple light-emitting modules, and multiple board common line terminals are formed and positioned to correspond to the multiple common line terminals, on the upper surface of the motherboard.
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公开(公告)号：EP4358145A1
公开(公告)日：2024-04-24
申请号：EP22825280.5
申请日：2022-06-14
发明人： LEE, Woo Gun , GO, Young Il , KI, Youngsik , HONG, Seung Sik
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/58 , H01L33/56 , H01L24/98 , H01L2224/9220130101
摘要： A display panel is provided. A display panel according to one embodiment comprises: a panel substrate; a plurality of micro LEDs arranged on the panel substrate; and a molding part that covers the plurality of micro LEDs, wherein the molding part includes a first molding part and a second molding part disposed in an area surrounded by the first molding part, wherein the second molding part has a different composition or shape from the first molding part, and surrounds a side surface of at least one of the plurality of micro LEDs.
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公开(公告)号：EP3308407B1
公开(公告)日：2018-12-12
申请号：EP16730172.0
申请日：2016-06-06
申请人： Lumileds LLC
CPC分类号： H01L33/56 , H01L33/502 , H01L2933/005
摘要： Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.
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4.发明公开
公开(公告)号：EP3405983A1
公开(公告)日：2018-11-28
申请号：EP17741742.5
申请日：2017-01-19
IPC分类号： H01L33/48 , H01L33/00 , H01L31/00 , H01L27/14 , H01L27/15 , H01L51/42 , H01L33/56 , H01L33/64 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14685 , H01L33/486 , H01L33/56 , H01L33/648
摘要： An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.
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公开(公告)号：EP3222689B1
公开(公告)日：2018-11-28
申请号：EP17160514.0
申请日：2017-03-13
IPC分类号： C09D183/06 , C08G77/20 , C08L83/06 , H01L23/00 , H01L51/00 , C08G77/00 , C09D183/10 , C08G77/42 , C08L83/10
CPC分类号： C08F230/08 , C08G77/20 , C08G77/42 , C08G77/80 , C08K5/0025 , C08L83/06 , H01L33/56
摘要： A UV curable silicone composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by formula (1) wherein n represents a number satisfying 1 ‰¤ n ‰¤ 100, Ar represents an aromatic group, each of F 1 and F 2 is selected from groups of formulae (2) and (3), and a ratio of the number of terminal groups of the formula (3) to a total number of all the terminal groups is not lower than 20%, wherein each R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, wherein m represents a number satisfying 0 ‰¤ m ‰¤ 10, each R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, R 2 represents an oxygen atom or an alkylene group, and R 3 represents an acryloyl group, a methacryloyl group, an acryloyloxyalkyl group or a methacryloyloxyalkyl group; and (B) 0.1 to 10 parts by mass of a photopolymerization initiator.
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公开(公告)号：EP3404727A1
公开(公告)日：2018-11-21
申请号：EP18174685.0
申请日：2015-05-22
IPC分类号： H01L33/62 , H01L23/495 , H01L23/00 , H01L33/48 , H01L33/60
CPC分类号： H01L33/62 , H01L23/49541 , H01L23/49562 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe as provided has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.
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7.发明授权
公开(公告)号：EP2618391B1
公开(公告)日：2018-11-21
申请号：EP13012005.8
申请日：2013-01-22
发明人： Kotani, Hiroshi
IPC分类号： H01L33/54 , H01L25/075 , H01L33/50
CPC分类号： H01L33/50 , B60Q1/04 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/73253
摘要： A semiconductor light-emitting device, a method for manufacturing the same and a vehicle headlight can include the light-emitting device, which is composed of a light-emitting structure including a transparent plate, at least one semiconductor light-emitting chip and a wavelength converting layer between the transparent plate and the light-emitting chip to emit various colored lights including white light. The light-emitting device can also include a mounting board mounting the light-emitting structure and a frame thereon, a reflective material disposed between the frame and the light-emitting structure and the transparent material located on the reflective material to prevent an occurrence of oil-bleeding phenomenon. Thus, the disclosed subject matter can provide the light-emitting device having a high reliability for the vehicle headlight and the like, which can be maintained at a high quality even when they have been used for a long time under harsh conditions, and methods of manufacturing such devices.
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8.发明公开
公开(公告)号：EP3395905A1
公开(公告)日：2018-10-31
申请号：EP16878513.7
申请日：2016-12-14
发明人： HOTTA, Shohei , TAKASHIMA, Masayuki
摘要： Provided is a silicone resin composition useful for production of a cured product of a silicone resin composition having high UV stability.
A silicone resin composition comprising at least one silicone resin, satisfying the following requirements (i) to (iii) :
(i) silicon atoms contained therein essentially consist of at least one kind of silicon atoms selected from the group consisting of A1 silicon atoms and A2 silicon atoms, and A3 silicon atoms, and a ratio of the content of the A3 silicon atoms to the total content of the A1 silicon atoms, the A2 silicon atoms and the A3 silicon atoms is 50 mol% or more and 99 mol% or less;
(ii) side chains bonding to the silicon atoms are alkyl groups having 1 to 3 carbons, alkoxy groups having 1 or 2 carbons or hydroxyl groups, a molar ratio of the alkoxy groups is less than 5 to 100 of the alkyl groups, and a molar ratio of the hydroxyl groups is 10 or more to 100 of the alkyl groups; and
(iii) a metallic catalyst is not substantially contained.-
公开(公告)号：EP2963685B1
公开(公告)日：2018-10-24
申请号：EP15173592.5
申请日：2015-06-24
申请人： Nichia Corporation
发明人： Miyoshi, Tomonori , Ozeki, Kenji
IPC分类号： H01L25/075 , H01L33/48 , H01L33/64 , H01L33/56 , H01L33/62
CPC分类号： H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/08 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/16225 , H01L2924/19107 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2933/0091
摘要： A light emitting device (10) has: a plurality of light emitting elements (1), a base (2) having a first main surface and a second main surface on the opposite side from the first main surface, the base (2) having conductive patterns (3a) disposed on the first main surface on which the light emitting elements (1) are mounted, conductive patterns (3b) disposed on the second main surface, and a groove (2a) provided on the second main surface of the base (2) corresponding to a space between the light emitting elements (1), and a light reflecting member (5) that integrally covers side surfaces (4a) of the plurality of light emitting elements (1).
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公开(公告)号：EP2662413B1
公开(公告)日：2018-09-19
申请号：EP12732210.5
申请日：2012-01-06
申请人： LG Chem, Ltd.
发明人： CHOI, Bum Gyu , KO, Min Jin , MOON, Myung Sun , JUNG, Jae Ho , KANG, Dae Ho , KIM, Min Kyoun , CHO, Byung Kyu
IPC分类号： C08L83/04 , C08K5/5415 , C08G77/04 , H01L23/29 , G02F1/13357 , C08K5/5419
CPC分类号： H01L33/56 , C08G77/12 , C08G77/14 , C08G77/20 , C08K5/5415 , C08K5/5419 , C08L83/04 , G02F2001/133614 , G02F2202/023 , H01L23/296 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
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