专利检索 ap:("LG Electronics Inc.") AND inv:"WOO, Jaechun" 第 1 页

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发明公开
SUPPORT MANUFACTURING METHOD, SUPPORT, AND SUPPORT MANUFACTURING APPARATUS USING MOLD 审中-实审

公开(公告)号：EP4431260A1

公开(公告)日：2024-09-18

申请号：EP21964188.3

申请日：2021-11-16

申请人： LG Electronics Inc.

发明人： LEE, Youngil , NA, Siwang , KIM, Taeho , KIM, Taegeun , WOO, Jaechun , KIM, Sangsik

IPC分类号： B29C45/14 , B29C45/26 , B29C45/04

CPC分类号： B29C45/14 , B29C45/26 , B29C45/04

摘要： According to embodiments, provided is a support manufacturing method comprising the steps of: forming a first injection-molded product by using a first material; injecting a second material into at least a portion of the first injection-molded product; forming a second injection-molded product including a hollow by discharging the second material from the first injection-molded product; and forming a third injection-molded product by covering at least a portion of the outer surface of the second injection-molded product with a third material.