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公开(公告)号：EP0544741B1
公开(公告)日：1995-10-18
申请号：EP91914915.3
申请日：1991-08-14
IPC分类号： C09J179/04 , C08L79/04 , C08G73/06
CPC分类号： C08G73/0655 , C09J7/10 , H05K3/321 , Y10T428/2839 , Y10T428/2878 , Y10T428/2896
摘要： The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the reaction product of an admixture of an effective amount of a curable cyanate ester resin, a thermoplastic polymer, and a curing catalyst. The catalyst may be, for example, thermally or photochemically activated.
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公开(公告)号：EP0544741A1
公开(公告)日：1993-06-09
申请号：EP91914915.0
申请日：1991-08-14
IPC分类号： C08G73 , C08L69 , C08L79 , C08L101 , C09J7 , C09J9 , C09J129 , C09J167 , C09J171 , C09J177 , C09J179 , C09J183 , C09J201 , H05K3
CPC分类号： C08G73/0655 , C09J7/10 , H05K3/321 , Y10T428/2839 , Y10T428/2878 , Y10T428/2896
摘要： The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the reaction product of an admixture of an effective amount of a curable cyanate ester resin, a thermoplastic polymer, and a curing catalyst. The catalyst may be, for example, thermally or photochemically activated.
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