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公开(公告)号：EP4512217A1
公开(公告)日：2025-02-26
申请号：EP23722626.1
申请日：2023-04-12
Applicant: Safran Electronics & Defense
Inventor： CHETANNEAU, Patrice , LEFEVRE, Bruno , GUILLOT, François
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公开(公告)号：EP4472365A3
公开(公告)日：2025-02-26
申请号：EP24207730.3
申请日：2021-03-08
Applicant: Samsung Electronics Co., Ltd
Inventor： JANG, Hyukjun , LEE, Kyehoon
IPC: G02F1/13357 , H05K1/02 , H05K3/28 , H10H20/855
Abstract: Provided is a light apparatus including: a reflective sheet in which a hole is formed; and a light source module exposed through the hole. The light source module may include a board aligned in parallel with the reflective sheet, wherein a first surface of the board is toward the reflective sheet, a light emitting diode positioned in an area defined by the hole on the first surface of the board, a feed pad positioned on the first surface of the board and contacting the light emitting diode, an insulating dome positioned in the area defined by the hole on the first surface of the board and covering the light emitting diode, and at least one antistatic pad positioned in the area defined by the hole on the first surface of the board, without contacting the light emitting diode.
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公开(公告)号：EP4510786A1
公开(公告)日：2025-02-19
申请号：EP24169598.0
申请日：2024-04-11
Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
Inventor： LIU, Zhaofeng , XU, Cuncun , LI, Haiyue , WANG, Xin
Abstract: A foldable electronic device (100) includes a rotation shaft (1), a housing assembly (2) and a flexible circuit board (3). The housing assembly (2) includes a first housing (21) and a second housing (22), and the first housing (21) and the second housing (22) are rotatably connected to both sides of the rotation shaft (1), respectively. The first housing (21) has a first arc-shaped surface (212), and in a process of switching from a folded state to a flattened state, the first arc-shaped surface (212) abuts against the bending part (32), to guide the bending part (32) to bend into a preset shape; and/or the second housing (22) has a second arc-shaped surface (222), and in a process of switching from a folded state to a flattened state, the second arc-shaped surface abuts against the bending part, to guide the bending part to bend into a preset shape.
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公开(公告)号：EP4507458A1
公开(公告)日：2025-02-12
申请号：EP23799537.8
申请日：2023-02-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： PARK, Dohyeong , PARK, Junghoon , CHUNG, Myungkyoon
Abstract: An interposer Printed Circuit Board (PBC) according to an embodiment may include: an insulating layer which includes a first face and a second face opposite to the first face; a first via group which penetrates the insulating layer to connect the first face and the second face, and includes a plurality of first vias formed spaced apart from each other, the plurality of first vias included in the first via group being used as a first transmission path through which a first signal passes; a first conductive pad which is disposed on the first face to cover first holes of the plurality of first vias, formed on the first face, and is electrically coupled to the plurality of first vias; and a first solder layer which is disposed on the first conductive pad, wherein the first conductive pad extends by a first width in a first direction along the first face of the insulating layer, and wherein the first solder layer extends by a second width smaller than the first width in the first direction.
Various other embodiments understood through the specification are also possible.-
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Patent Agency Ranking
公开(公告)号：EP3249686B1
公开(公告)日：2025-02-12
申请号：EP16171013.2
申请日：2016-05-24
Inventor： MRAD, Roberto , MOLLOV, Stefan , EWANCHUK, Jeffrey
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7.发明公开
公开(公告)号：EP4503870A1
公开(公告)日：2025-02-05
申请号：EP24190895.3
申请日：2024-07-25
Applicant: IMH Inc.
Inventor： LEE, Jong Eun
IPC: H05K3/00 , H01L23/373 , H05K1/02 , H01L23/473 , H01L21/48 , H01L23/367 , H05K1/00 , H01L23/427
Abstract: A manufacturing method of a heat dissipation device-integrated heat dissipation substrate for a semiconductor includes a base processing step of preparing a first base plate and a second base plate in the form of metal plates that overlap each other and constitute a part of a metal base, and providing a first base and a second base in which a three-dimensional structure forming the heat media circulation space is formed on an inner surface of at least one of the first base plate and the second base plate, a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other to form heat dissipation device-integrated base, an electrode metal plate preparation step of processing an electrode metal plate to form a groove pattern, and preparing an electrode metal plate configured to cover an area corresponding to at least one circuit unit, and an electrode metal plate bonding step of bonding, via insulating resin, the electrode metal plate to an upper surface of the heat dissipation device-integrated base.
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公开(公告)号：EP4503865A1
公开(公告)日：2025-02-05
申请号：EP23780320.0
申请日：2023-03-27
Applicant: Kyocera Corporation
Inventor： KAWASE, Aki , SHIROSHITA, Makoto
Abstract: A wiring board according to the present disclosure includes an insulating layer, a conductive layer including a signal conductor, a ground conductor, and a power supply conductor, a plurality of via hole conductors, and a via hole conductor connecting portion. The part of the signal conductor includes a first wiring group having a plurality of wiring lines extending in a region between a first connecting portion and a second connecting portion, and a second wiring group having a plurality of wiring lines extending in a region between the second connecting portion and a third connecting portion. The first wiring group includes a first portion extending from a region between the second connecting portion and the fifth connecting portion to a region between the fifth connecting portion and the sixth connecting portion, and a second portion extending to a region between the fourth connecting portion and the fifth connecting portion. The second wiring group includes a third portion extending in a region between the fifth connecting portion and the sixth connecting portion, and a fourth portion extending in a region between the third connecting portion and the sixth connecting portion.
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公开(公告)号：EP4498764A1
公开(公告)日：2025-01-29
申请号：EP23830245.9
申请日：2023-06-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： ZHANG, Tong , JIANG, Fan , WEI, Dan , SHI, Lin
Abstract: This application discloses a flexible printed circuit, a circuit board assembly, and an electronic device. The flexible printed circuit includes a bending portion and a soldering portion connected to the bending portion. The flexible printed circuit includes a plurality of conductive layers and a plurality of insulation layers, and the insulation layer is disposed between two adjacent conductive layers. The plurality of conductive layers include a first soldering layer, a second soldering layer, and a trace layer. Both the first soldering layer and the second soldering layer are located in the soldering portion. The first soldering layer is one surface layer of the soldering portion, and the first soldering layer is formed by a plurality of first pads that are spaced from each other. The second soldering layer is the other surface layer of the soldering portion, and the second soldering layer is formed by a plurality of second pads that are spaced from each other. The trace layer is located between the first soldering layer and the second soldering layer, and extends from the soldering portion to the bending portion. The first pad and the second pad are connected by using a through hole conductor, and are connected to the trace layer. A pad spacing in the soldering portion of the flexible printed circuit is relatively small, so that a surface area of the soldering portion can be reduced, facilitating miniaturization.
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