公开(公告)号：EP3173508B1

公开(公告)日：2020-10-28

申请号：EP15825092.8

申请日：2015-07-15

申请人： Maxell Holdings, Ltd.

发明人： KITO, Akiko ,  YUSA, Atsushi ,  USUKI, Naoki ,  YAMAMOTO, Satoshi ,  GOTO, Hideto ,  SUENAGA, Masashi

IPC分类号： C23C18/30 ,  B29C45/00 ,  C23C18/20 ,  C23C18/16 ,  C23C18/40 ,  C23C18/28

公开(公告)号：EP3451802A1

公开(公告)日：2019-03-06

申请号：EP17789618.0

申请日：2017-04-26

申请人： Maxell Holdings, Ltd.

发明人： YUSA, Atsushi ,  YAMAMOTO, Satoshi ,  KITO, Akiko ,  OTA, Hironori ,  GOTO, Hideto ,  USUKI, Naoki

IPC分类号： H05K1/02 ,  B29C45/14 ,  B29C45/26 ,  H01L33/64 ,  H05K1/05 ,  B29L31/34

摘要： Provided is a three-dimensional molded circuit component that has high heat dissipation properties and that also has high producibility and is easily molded. A three-dimensional molded circuit component that has: a base material that includes a metal part and a resin part; a circuit pattern that is formed upon the resin part; and a mounted component that is mounted upon the base material and that is electrically connected to the circuit pattern. One portion of the resin part is a resin thin film that is 0.01-0.5 mm thick, includes a thermoplastic resin, and is formed upon the metal part. The mounted component is arranged upon the metal part with the resin thin film therebetween.