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公开(公告)号：EP3862159A1
公开(公告)日：2021-08-11
申请号：EP19869137.0
申请日：2019-10-01
IPC分类号： B29C33/68 , C08J5/18 , H01L21/60 , H01L21/603
摘要： A heat-resistant release sheet of the present disclosure includes a heat-resistant release sheet to be disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, wherein surface hardness, as expressed in an indentation degree A 300 given by an equation A 300 (%) = (d 300/ t 0 ) × 100, of the heat-resistant release sheet at 300°C is 15% or less, where t 0 is a thickness of the heat-resistant release sheet at ordinary temperature (20°C) and d 300 is an indentation depth evaluated for the heat-resistant release sheet at 300°C using a penetration probe by thermomechanical analysis (TMA) under the following measurement conditions: [Measurement conditions] • Measurement mode: penetration mode, temperature rise measurement • Shape and tip diameter of penetration probe: columnar shape and 1 mmϕ • Applied pressure: 1 MPa • Starting temperature and temperature increase rate: 20°C and 10°C/min. The heat-resistant release sheet of the present disclosure can more reliably adapt to an expected further increase in thermocompression bonding temperature.
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公开(公告)号：EP3862161A1
公开(公告)日：2021-08-11
申请号：EP19869354.1
申请日：2019-10-01
IPC分类号： B29C33/68 , C08J5/18 , H01L21/60 , H01L21/603
摘要： A heat-resistant release sheet of the present disclosure is a sheet formed of a single-layer heat-resistant resin film having a thickness of 35 µm or less, wherein the sheet is disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, and a heat-resistant resin forming the heat-resistant resin film has a melting point of 310°C or higher and/or a glass transition temperature of 210°C or higher. A use temperature of this heat-resistant release sheet can be, for example, 250°C or higher. The heat-resistant release sheet of the present disclosure can more reliably meet a demand for an increase in thermocompression bonding temperature.
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