公开(公告)号：EP2162713A1

公开(公告)日：2010-03-17

申请号：EP08753764.3

申请日：2008-05-09

申请人： Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO

发明人： TURK, Raymond ,  ENTING, Hendrik ,  TACKEN, Roland Anthony ,  RENDERING, Hendrik ,  HOUBEN, René Jos

IPC分类号： G01L1/22

CPC分类号： G01L1/2287

摘要： The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of: (a) providing a device; (b) optionally applying an isolating layer on a surface of the device; (c) establishing a distribution of particles of a first metal on the isolating layer obtained in step (b); and (d) depositing a layer of a second metal on at least part of the distribution of the particles of the first metal as obtained in step (c) by means of an electroless plating process or electro-deposition process.

公开(公告)号：EP2172088A1

公开(公告)日：2010-04-07

申请号：EP08766807.5

申请日：2008-06-16

申请人： Nederlandse Centrale Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO

发明人： TACKEN, Roland Anthony ,  DE ZWART, Renatus Marius ,  MEINDERS, Erwin Rinaldo ,  PETER, Maria

IPC分类号： H05K3/10

CPC分类号： H05K3/184 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/025 ,  H05K2203/0565 ,  H05K2203/0713 ,  H05K2203/1415 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155

摘要： The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step. (b); and (d) depositing by means of an electroless process a layer of a second metal or alloy thereof on the distribution of the particles of the first metal or alloy thereof as obtained in step (c), whereby the inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the particles of the first metal or alloy thereof that are distributed on the pattern obtained in step (b).