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    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
    1.
    发明公开
    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method 审中-公开
    一种用于通过加成法的装置，印刷电路板和与该方法获得的多层印刷电路板制造电路板的方法

    公开(公告)号：EP2592912A1

    公开(公告)日：2013-05-15

    申请号：EP13000238.9

    申请日：2009-04-30

    申请人： Panasonic Corporation

    发明人： Yoshioka, Shingo ,  Fujiwara, Hiroaki

    IPC分类号： H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

    CPC分类号： H05K3/107 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/111 ,  H05K1/162 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0565 ,  H05K2203/161

    摘要： The present invention relates to a circuit board comprising:
    a circuit groove having at least one land region for surface mounting of electronic parts and at least one circuit wiring region formed integrally with the land region, and
    a partial reinforcing structure formed in the land region of the circuit groove,
    wherein the partial reinforcing structure is at least one structure selected from a group consisting of:
    an irregular shape having a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surface in the land region,
    a groove shape having the groove depth in the land region larger than that of the circuit wiring region to form a plated film having thickness in the land region thicker than that of the circuit wiring region, and
    a structure formed by forming at least one protrusion on the periphery of the groove in the land region.

    摘要翻译： 本发明涉及一种电路板，包括：具有用于电子部件表面安装的至少一个国家区域和与国家，地区一体形成的至少一个电路布线区域，并在土地区域形成的局部加固结构的电路槽 所述电路凹槽，worin的局部加固结构是从以下一组中选出的至少一种结构：具有0.1微米至20微米的十点平均粗糙度（Rz）在陆地区域形成的凹槽表面上的不规则形状，一个 具有在陆地区域比电路布线区域的较大的槽深的槽形状，以形成在该国区域比电路布线区域的较厚的电镀具有膜厚，并通过形成在所述至少一个突起形成的结构 在陆地区域中的槽的周边上。

    A process for the electroless deposition of metal on a substrate
    6.
    发明公开
    A process for the electroless deposition of metal on a substrate 失效
    一种用于在基板上无电金属沉积方法

    公开(公告)号：EP0708581A2

    公开(公告)日：1996-04-24

    申请号：EP95307184.2

    申请日：1995-10-11

    申请人： AT&T Corp.

    发明人： Evans, Michael D. ,  Law, Henry Hon ,  Kim, Tae Yong ,  Wu, Te-Sung

    IPC分类号： H05K3/18 ,  C23C18/16 ,  C23C18/18

    CPC分类号： C23C18/1851 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/1865 ,  C23C18/1889 ,  C23C18/32 ,  C23C18/38 ,  C23C18/50 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/167 ,  H05K3/184 ,  H05K3/24 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0347 ,  H05K2203/0565 ,  H05K2203/1105

    摘要： A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface. The substrate surface is then exposed to an electroless plating bath to form nickel onto those portions of the substrate surface that were treated with the sensitizing and activating solutions. The substrate is then heated to at least 180°C. Additional layers of metal are formed on the substrate. After the additional layers are so formed, the substrate is again heated to a temperature of at least about 180°C after each layer is so formed.

    A process for the electroless deposition of metal on a substrate
    9.
    发明公开
    A process for the electroless deposition of metal on a substrate 失效
    Verfahren zur stromlosen Metallabscheidung auf einem Substrat

    公开(公告)号：EP0708581A3

    公开(公告)日：1997-10-29

    申请号：EP95307184.2

    申请日：1995-10-11

    申请人： AT&T Corp.

    发明人： Evans, Michael D. ,  Law, Henry Hon ,  Kim, Tae Yong ,  Wu, Te-Sung

    IPC分类号： H05K3/18 ,  C23C18/16 ,  C23C18/18

    CPC分类号： C23C18/1851 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/1865 ,  C23C18/1889 ,  C23C18/32 ,  C23C18/38 ,  C23C18/50 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/167 ,  H05K3/184 ,  H05K3/24 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0347 ,  H05K2203/0565 ,  H05K2203/1105

    摘要： A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface. The substrate surface is then exposed to an electroless plating bath to form nickel onto those portions of the substrate surface that were treated with the sensitizing and activating solutions. The substrate is then heated to at least 180°C. Additional layers of metal are formed on the substrate. After the additional layers are so formed, the substrate is again heated to a temperature of at least about 180°C after each layer is so formed.

    摘要翻译： 公开了一种用于基板金属化的方法。 金属在整个基板上形成涂层，或者在图案上沉积在基板表面上。 通过在衬底上形成抗蚀剂材料图案并将材料沉积在由图案限定的间隙中或通过在金属层上形成图案化的抗蚀剂层并使用常规技术将图案转移到衬底中来将金属图案化地形成在衬底上 。 使用常规技术在衬底上形成图案化的抗蚀剂层。 用促进金属在基材表面上的化学镀的试剂处理基材。 如果抗蚀剂材料已经预先形成在基板表面上，则基板表面然后被干燥。 然后将剩余的抗蚀剂从基材表面上除去。 然后将基材表面暴露于无电镀浴中，以在用敏化和活化溶液处理的基材表面的那些部分上形成镍。 然后将衬底加热至至少180℃。在衬底上形成额外的金属层。 在附加层如此形成之后，在形成每个层之后，将衬底再次加热至至少约180℃的温度。

    Method for the manufacture of printed circuit boards
    10.
    发明公开
    Method for the manufacture of printed circuit boards 失效
    Verfahren zur Herstellung von Leiterplatten

    公开(公告)号：EP0762813A1

    公开(公告)日：1997-03-12

    申请号：EP96305400.2

    申请日：1996-07-23

    申请人： MACDERMID INCORPORATED

    发明人： Kukanskis, Peter

    IPC分类号： H05K3/42

    CPC分类号： H05K3/428 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K2203/0565 ,  H05K2203/0571 ,  H05K2203/072 ,  Y10T29/49165

    摘要： A process for producing circuit boards, which process comprises the steps of:

    1. forming circuitry on the outer surfaces of a copper clad laminte;
    2. applying a desense mask to the surfaces;
    3. drilling holes in a desired array;
    4. activating the holes to accept plating therein;
    thereafter
    5. stripping the desense mask from the surfaces;
    6. applying a plating mask to the surfaces;
    7. optionally, cleaning the surfaces not covered by the plating mask;
    and
    8. plating the hole surfaces and any other surfaces not covered by the plating mask with a metallic coating.

    摘要翻译： 一种制造电路板的方法，该方法包括以下步骤：1.在铜包覆层压板的外表面上形成电路; 2.将面膜涂抹于表面; 3.以所需阵列钻孔; 4.激活孔以接受电镀; 然后5.从表面剥离去皮面罩; 6.将电镀掩模施加到表面; 7.可选地，清洁未被电镀掩模覆盖的表面; 以及8.用金属涂层电镀孔表面和未被电镀掩模覆盖的任何其它表面。