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    OPTOELEKTRONISCHES HALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
    5.
    发明公开
    OPTOELEKTRONISCHES HALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开
    光电子半导体元件及其制造方法

    公开(公告)号：EP3251156A1

    公开(公告)日：2017-12-06

    申请号：EP15820083.2

    申请日：2015-12-16

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： LINKOV, Alexander ,  HERRMANN, Siegfried

    IPC分类号： H01L33/50

    摘要： The invention relates to a semiconductor component, comprising a semiconductor chip (1), which emits electromagnetic radiation of a first wavelength range from a radiation emission surface (5). The semiconductor component also comprises a first conversion layer (11) on a lateral flank (6) of the semiconductor chip (1), which first conversion layer is suitable for converting electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, and a second conversion layer (12) on the radiation emission surface (5) of the semiconductor chip (1), which second conversion layer is suitable for converting electromagnetic radiation of the first wavelength range into electromagnetic radiation of the second or of a third wavelength range. The first conversion layer (11) is different from the second conversion layer (12). The invention further relates to a method for producing such a semiconductor component.

    VERFAHREN ZUR HERSTELLUNG EINER VIELZAHL VON OPTOELEKTRONISCHEN BAUELEMENTEN
    8.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINER VIELZAHL VON OPTOELEKTRONISCHEN BAUELEMENTEN 有权

    公开(公告)号：EP2294614A2

    公开(公告)日：2011-03-16

    申请号：EP09771994.2

    申请日：2009-06-18

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： HERRMANN, Siegfried

    IPC分类号： H01L25/075 ,  H05B33/10

    CPC分类号： H01L25/0753 ,  H01L27/156 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The invention relates to a method for producing a plurality of optoelectronic components. A semiconductor element support (10) comprises on a first main surface (12) a plurality of semiconductor elements (14) which have respective contact structures (20) and an active layer (16) for generating electromagnetic radiation. A planar filling structure is formed on the first main surface (12), said planar filling structure (42, 44) at least partially covering areas of the contact structure (20) and the semiconductor element support without covering the semiconductor body (14).

    摘要翻译： 一种用于制造多个光电子部件的方法包括提供半导体本体载体，其在半导体层序列中包括在第一主区域上的多个半导体主体，每个半导体主体具有接触结构并具有产生电磁辐射的有源层，以及 在第一主区域上形成平面填充结构，使得平面填充结构至少部分地覆盖接触结构的区域和半导体本体载体，而不覆盖半导体本体。