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公开(公告)号：EP2218118B1
公开(公告)日：2018-05-30
申请号：EP08861500.0
申请日：2008-11-19
IPC分类号： H01L33/48 , H01L33/44 , H01L25/16 , H01L25/075
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
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公开(公告)号：EP2130072B1
公开(公告)日：2018-10-24
申请号：EP08706792.2
申请日：2008-01-23
CPC分类号： G02B6/0055 , G02B6/0018 , G02B6/0051 , G02B6/0073 , G02B6/0076
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3.发明公开
公开(公告)号：EP2191324A1
公开(公告)日：2010-06-02
申请号：EP08801344.6
申请日：2008-09-26
发明人： SORG, Jörg , GRUBER, Stefan
IPC分类号： G02F1/13357 , H01L33/00 , G02B6/00
CPC分类号： G02B6/0073 , G02B6/0021 , G02B6/0065 , G02B6/0083 , G02B6/0091 , H01L2224/16225
摘要： The invention relates to a light-emitting surface element and a method for producing said surface element, which comprises at least one planar light-conducting element, a connection device, and a light-producing element. The light-producing element comprises at least two electrical connections that are connected in an electrically conductive fashion to associated connection lines on the connection device. The planar light-conducting element is formed in an injection molding method such that the arrangement comprising the connection device and light-producing element is embedded.
摘要翻译： 发光表面元件包括连接装置，其具有至少两个电连接导电连接到连接装置上分配的连接线光产生元件，和至少一个平面光导元件通过注射成型在形成的 方式至少部分地嵌入在平面光导元件连接装置和光生成元件组成的布置。
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4.发明授权
公开(公告)号：EP1794787B1
公开(公告)日：2009-11-04
申请号：EP05773768.6
申请日：2005-08-08
IPC分类号： H01L21/48 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/495 , H01L23/49562 , H01L2924/0002 , Y10T29/49174 , H01L2924/00
摘要： The invention relates to a conductor frame (1) for at least one electronic component, comprising at least two electric connection parts (2) with respectively at least one electric connection strip (3) and at least one retaining strip (4). The connection frame (1) is characterized in that an indentation is provided between the at least one retaining strip (4) and connection part (2), creating a parallel offset between the retaining strip (4) and adjacent area of the connection part (2), and in that another parallel offset is created between the connection part (2) and electrical connection strip (3) such that the retaining strip (4) and electric connection strip (3) are located on a common plane. The retaining strip (4) can be removed easily through the indentation (8) without having to create a disadvantageous stamping gap between the connection part (2) and the retaining strip (4).
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公开(公告)号：EP2281315B1
公开(公告)日：2018-10-17
申请号：EP09753511.6
申请日：2009-04-20
发明人： ZEILER, Thomas , WINDISCH, Reiner , GRUBER, Stefan , KIRSCH, Markus , MUSCHAWECK, Julius , BAADE, Torsten , BRUNNER, Herbert , KÖHLER, Steffen
CPC分类号： H01L33/54 , H01L25/042 , H01L25/0753 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00
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公开(公告)号：EP2054949B1
公开(公告)日：2017-01-25
申请号：EP07817805.0
申请日：2007-11-16
CPC分类号： H01L33/44 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
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公开(公告)号：EP2223336B1
公开(公告)日：2016-07-20
申请号：EP08865050.2
申请日：2008-12-09
发明人： SORG, Jörg Erich , GRUBER, Stefan , BOGNER, Georg
IPC分类号： H01L25/075 , H01L25/16 , H01L27/15 , H01L23/60
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
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8.发明公开
公开(公告)号：EP2596534A1
公开(公告)日：2013-05-29
申请号：EP11739022.9
申请日：2011-07-15
发明人： WEIDNER, Karl , RAMCHEN, Johann , KALTENBACHER, Axel , WEGLEITER, Walter , BARCHMANN, Bernd , GRUBER, Stefan , BOGNER, Georg
IPC分类号： H01L33/38 , H01L33/58 , G02B6/00 , G02F1/13357 , H01L33/20 , H01L33/60 , H01L25/075 , H01L33/46 , H01L33/40
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a radiation-emitting component comprising a semiconductor chip (2), which has a first main surface (25), a second main surface (26) located opposite of the first main surface, and an active region (23) provided for generating radiation; a substrate (5), on which the semiconductor chip is fastened on the side of the second main surface (26); and a decoupling layer (4), which is disposed on the first main surface (25) of the semiconductor chip (2) and forms lateral decoupling surfaces (40) spaced apart from the semiconductor chip (2) in the lateral direction, wherein a recess (45) tapering toward the semiconductor chip (2) is formed in the decoupling layer (4), said recess deflecting radiation exiting the first main surface (25) in the direction of the lateral decoupling surface (40) during operation. The invention further relates to a method for producing a radiation-emitting component.
摘要翻译： 发射辐射的元件包括半导体芯片，其具有第一主表面，在相对的一侧从第一主表面和在有源区上的第二主表面上并产生辐射率; 在其上的半导体芯片被固定在所述第二主面侧的载体; 到配置在半导体芯片的第一主表面和形成在横向方向上的半导体芯片间隔开的横向输出表面上输出层，凹部逐渐变细，在半导体芯片的存在的方向，形成在输出层和偏转辐射 从第一主表面新兴手术进入侧输出表面的方向中。
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9.发明授权
公开(公告)号：EP2436242B1
公开(公告)日：2013-01-09
申请号：EP10721292.0
申请日：2010-04-28
发明人： BOGNER, Georg , GRUBER, Stefan
CPC分类号： H05K1/183 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/10106 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2924/00014
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公开(公告)号：EP2130072A2
公开(公告)日：2009-12-09
申请号：EP08706792.2
申请日：2008-01-23
CPC分类号： G02B6/0055 , G02B6/0018 , G02B6/0051 , G02B6/0073 , G02B6/0076
摘要： The invention relates to an arrangement comprising a semiconductor chip (1) which is designed to emit light during operation as well as a cover layer (2) that lies across from a light-emitting surface of the semiconductor chip (1) such that light emitted by the semiconductor chip (1) penetrates into the cover layer (2). According to the invention, said arrangement is characterized in that a light-deflecting structure is provided in an area of the cover layer (2) that overlaps the chip (1). Said light-deflecting structure deflects the light that penetrates into the cover layer (2) in the direction of the longitudinal extension of the cover layer (2). Furthermore, the coating (2) acts as an optical waveguide and is designed to emit the light in a distributed manner across the top surface of the cover layer (2).
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