公开(公告)号：EP2471977A3

公开(公告)日：2012-08-08

申请号：EP11195167.9

申请日：2011-12-22

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hakiri, Yoshiyuki

IPC分类号： C25D21/18 ,  C23C18/16 ,  C23C18/31

CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/31 ,  C23C18/52

摘要： To provide a method of regenerating plating solution by removing impurities from electroless tin plating solution, especially by reducing the copper concentration, as well as a plating method using this.
Impurities are removed from plating solution by generating precipitate through the addition of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to electroless tin plating solution comprising thiourea or thiourea compounds.

公开(公告)号：EP2471977A2

公开(公告)日：2012-07-04

申请号：EP11195167.9

申请日：2011-12-22

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hakiri, Yoshiyuki

IPC分类号： C25D21/18

CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/31 ,  C23C18/52

摘要： To provide a method of regenerating plating solution by removing impurities from electroless tin plating solution, especially by reducing the copper concentration, as well as a plating method using this.
Impurities are removed from plating solution by generating precipitate through the addition of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to electroless tin plating solution comprising thiourea or thiourea compounds.

摘要翻译： 提供一种通过从化学镀锡溶液中除去杂质，特别是通过降低铜浓度来再生镀液的方法，以及使用它的镀敷方法。 通过将苯磺酸，苯磺酸水合物或其盐加入到包含硫脲或硫脲化合物的无电镀锡溶液中而产生沉淀物，从而从电镀溶液中去除杂质。

公开(公告)号：EP2481834B1

公开(公告)日：2017-06-28

申请号：EP11195166.1

申请日：2011-12-22

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hakiri, Yoshiyuki

IPC分类号： C23C18/16 ,  C23C18/31

CPC分类号： C23C18/1617 ,  C23C18/31

公开(公告)号：EP2481834A1

公开(公告)日：2012-08-01

申请号：EP11195166.1

申请日：2011-12-22

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hakiri, Yoshiyuki

IPC分类号： C23C18/16 ,  C23C18/31

CPC分类号： C23C18/1617 ,  C23C18/31

摘要： A method of regenerating an electroless tin or tin alloy plating solution contaiing thiourea or thiourea compounds by reducing impurities by adding organosulfonic acid, organosulfonic acid compound, or salts thereof in certain amounts and then cooling the solution to form precipitates. The precipitates are then removed from the tin or tin alloy solution.

摘要翻译： 一种通过以一定量加入有机磺酸，有机磺酸化合物或其盐然后冷却该溶液以形成析出物来再生含有硫脲或硫脲化合物的无电镀锡或锡合金电镀液的方法。 然后从锡或锡合金溶液中除去沉淀物。

公开(公告)号：EP2471977B1

公开(公告)日：2017-01-25

申请号：EP11195167.9

申请日：2011-12-22

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hakiri, Yoshiyuki

IPC分类号： C25D21/18 ,  C23C18/16 ,  C23C18/31

CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/31 ,  C23C18/52

公开(公告)号：EP2826886A1

公开(公告)日：2015-01-21

申请号：EP14177591.6

申请日：2014-07-18

申请人： Rohm and Haas Electronic Materials LLC

发明人： Yoshida, Katsuhiro ,  Hakiri, Yoshiyuki ,  Kondo, Makoto

IPC分类号： C23C18/38

CPC分类号： C23C18/40 ,  C23C18/1633 ,  C23C18/38

摘要： Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

摘要翻译： 提供了与树脂表面的粗糙度无关地形成高粘合性导电膜的化学镀铜溶液，并且还具有快速沉积速率。 本发明的无电镀铜溶液的特征在于含有鸟苷。 本发明的化学镀铜溶液优选还含有铜离子，还原剂，铜离子络合剂和pH调节剂。