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    METHOD AND ARRANGEMENT FOR DEPOSITING A METAL COATING
    3.
    发明公开
    METHOD AND ARRANGEMENT FOR DEPOSITING A METAL COATING 有权
    方法和系统分离金属镀层

    公开(公告)号：EP2591142A2

    公开(公告)日：2013-05-15

    申请号：EP11738182.2

    申请日：2011-07-06

    申请人： Atotech Deutschland GmbH

    发明人： BRUCKNER, Helmut ,  SKUPIN, Andreas ,  LOWINSKI, Christian ,  SCHACHTNER, Bernhard

    IPC分类号： C23C18/54

    CPC分类号： B05C11/00 ,  B05D1/18 ,  C23C18/1617 ,  C23C18/54

    摘要： For the purpose of simplifying the processing of a bath a method for depositing a coating of a first metal onto a workpiece 12 which exposes a second metal is proposed which method comprises the following method steps: a) providing a bath liquid 16 containing bath components containing ions of the first metal to be deposited, at least one complexing agent for the second metal and at least one acid, b) depositing the coating of the first metal from the bath liquid 16 onto the workpiece 12, c) feeding the bath liquid 16 into a settling tank 18, d) cooling the bath liquid 16 in the settling tank 18 for the generation of a precipitate and of a filtrate, the precipitate being comprised of the second metal and the at least one complexing agent, f) returning the filtrate to the bath liquid 16 and g) replenishing bath components to the bath liquid 16. The method in accordance with the invention is characterised in that with respect to the separation of the precipitate from the filtrate a pressure difference is generated by the filter.

    Method for removing impurities from plating solution
    4.
    发明公开
    Method for removing impurities from plating solution 有权
    从电镀液中去除杂质的方法

    公开(公告)号：EP2471977A2

    公开(公告)日：2012-07-04

    申请号：EP11195167.9

    申请日：2011-12-22

    申请人： Rohm and Haas Electronic Materials LLC

    发明人： Hakiri, Yoshiyuki

    IPC分类号： C25D21/18

    CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/31 ,  C23C18/52

    摘要： To provide a method of regenerating plating solution by removing impurities from electroless tin plating solution, especially by reducing the copper concentration, as well as a plating method using this.
    Impurities are removed from plating solution by generating precipitate through the addition of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to electroless tin plating solution comprising thiourea or thiourea compounds.

    摘要翻译： 提供一种通过从化学镀锡溶液中除去杂质，特别是通过降低铜浓度来再生镀液的方法，以及使用它的镀敷方法。 通过将苯磺酸，苯磺酸水合物或其盐加入到包含硫脲或硫脲化合物的无电镀锡溶液中而产生沉淀物，从而从电镀溶液中去除杂质。

    METHOD OF ELECTROLYTICALLY DISSOLVING NICKEL INTO ELECTROLESS NICKEL PLATING SOLUTIONS
    8.
    发明公开
    METHOD OF ELECTROLYTICALLY DISSOLVING NICKEL INTO ELECTROLESS NICKEL PLATING SOLUTIONS 有权
    方法镍的免费电镀镍电解解散

    公开(公告)号：EP2242871A1

    公开(公告)日：2010-10-27

    申请号：EP09720501.7

    申请日：2009-01-30

    申请人： MacDermid, Incorporated

    发明人： MICYUS, Nicole, J. ,  STENINECKER, Carl, P. ,  BECKETT, Duncan, P.

    IPC分类号： C23C18/31 ,  C23C18/34

    CPC分类号： C23C18/1617 ,  C23C18/1676 ,  C23C18/36

    摘要： A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.