公开(公告)号：EP2868778A2

公开(公告)日：2015-05-06

申请号：EP14191883.9

申请日：2014-11-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Woertink, Julia ,  Qin, Yi ,  Prange, Jonathan D. ,  Lopez Montesinos, Pedro O.

IPC分类号： C25D7/12 ,  C25D3/32 ,  C25D3/60

CPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/123 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H05K3/3473 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01025 ,  H01L2924/014 ,  H01L2924/01322 ,  H01L2924/01026

摘要： Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.

摘要翻译： 具有某些增亮剂和非离子表面活性剂的锡电镀浴提供了具有良好形态，减少的空隙形成和提高的模内均匀性的含锡焊料沉积物。

公开(公告)号：EP2868778A3

公开(公告)日：2015-08-12

申请号：EP14191883.9

申请日：2014-11-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Woertink, Julia ,  Qin, Yi ,  Prange, Jonathan D. ,  Lopez Montesinos, Pedro O.

IPC分类号： C25D7/12 ,  C25D3/32 ,  C25D3/60

CPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/123 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H05K3/3473 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01025 ,  H01L2924/014 ,  H01L2924/01322 ,  H01L2924/01026

摘要： Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.

公开(公告)号：EP2868775A3

公开(公告)日：2015-08-12

申请号：EP14191882.1

申请日：2014-11-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Woertink, Julia ,  Qin, Yi ,  Prange, Jonathan D. ,  Lopez Montesinos, Pedro O.

IPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/12

CPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/12 ,  C25D7/123

摘要： Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.

公开(公告)号：EP2868775A2

公开(公告)日：2015-05-06

申请号：EP14191882.1

申请日：2014-11-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Woertink, Julia ,  Qin, Yi ,  Prange, Jonathan D. ,  Lopez Montesinos, Pedro O.

IPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/12

CPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/12 ,  C25D7/123

摘要： Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.

摘要翻译： 具有某些增亮剂组合的含锡电镀浴提供含有减少的空隙形成和光滑形态的含锡焊料沉积物。