摘要:
The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.
摘要:
A method includes casting a friction reducing layer on a carrier, and casting an adhesive layer overlying the friction reducing layer to form a multilayer cast film. The method further includes laminating the multilayer cast film to the load bearing substrate with the load bearing substrate to form a composite and shaping the composite. The load bearing substrate is closer to the adhesive layer than to the friction reducing layer.
摘要:
A method includes casting a friction reducing layer on a carrier, and casting an adhesive layer overlying the friction reducing layer to form a multilayer cast film. The method further includes laminating the multilayer cast film to the load bearing substrate with the load bearing substrate to form a composite and shaping the composite. The load bearing substrate is closer to the adhesive layer than to the friction reducing layer.