摘要:
To provide a substrate storage container that can inhibit a container body, door and other parts from being electrified to attract particles, hence can prevent particles from staining substrates. In a substrate storage container which includes: a container body 1 that stores semiconductor wafers W being supported by pairs of left and right supporting pieces 2; a removable door 10 that opens and closes an open front of container body 1; and an interface portions 40 that is provided in container body 1 and door 10 and are connected to a load port apparatus 31 of processing equipment, door 10 is positioned and connected to load port apparatus 31 when the open front of container body 1 is opened and closed by door 10. Container body 1, its paired supporting pieces 2, door 10 and interface portions 40 are all formed of conductive materials so that their surface resistance values are specified to fall within the range of 10 3 to 10 12 Q, to thereby inhibit adherence of particles to these due to electrification of static electricity.
摘要:
To provide a retainer and a substrate storage container which can prevent contamination and damage accompanying the turning of substrates, alleviate impacts acting on the substrates to thereby eliminate the risk of the substrates from dislodging and being broken and which can simplify the task of attaching the retainer-equipped door to the container body. A retainer 20 is formed of a frame 21 attached to the backside central part 13 of a door 10 of a substrate storage container, a pair of first elastic parts 29 projected from a pair of opposing parts 22 of frame 21 so as to approach each other and a second elastic part 31 that is supported at bent free ends 30 of the paired first elastic parts 29 to hold a semiconductor wafer W. Further, the outside end 32 of the second elastic part 31 is positioned outside free end 30 of first elastic part 29 and closer to the opposing part 22 of frame 21, and a multiple number of first and second holds 33 and 34 for holding the rim on the front side of semiconductor wafer W are formed apart from each other, the second hold 34 being positioned closer to the outside end 32 side of the second elastic part 31 than the first hold 33 is.