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1783 条记录 (耗时 0.023 秒)

    RECESS-BASED PICK AND PLACE FOR HETEROGENEOUS INTEGRATION
    3.
    发明公开
    RECESS-BASED PICK AND PLACE FOR HETEROGENEOUS INTEGRATION 审中-公开

    公开(公告)号：EP4394851A1

    公开(公告)日：2024-07-03

    申请号：EP22217347.8

    申请日：2022-12-30

    申请人： ASML Netherlands B.V.

    发明人： PARAYIL VENUGOPALAN, Syam ,  WARNAAR, Patrick ,  DE JAGER, Pieter, Willem, Herman ,  JANSEN, Bas ,  JANSSENS, Stef, Marten, Johan

    IPC分类号： H01L21/67 ,  H01L21/677

    CPC分类号： H01L21/67144 ,  H01L21/67259 ,  H01L21/67721

    摘要： An apparatus for die placement comprising a first stage comprising a plurality of recesses, the plurality of recesses configured to accept a plurality of donor dies; a second stage comprising a support for one or more targets; and a measurement system, functionally coupled to the first stage, and configured to: obtain locations of the plurality of donor dies in the plurality of recesses of the first stage, and based at least on the obtained locations, provide output signals to adjust the locations of the plurality of donor dies supported by the first stage to correspond to locations of the one or more targets, and based at least in part on the adjusted locations, provide output signals to place the plurality of donor dies on the one or more targets supported by the second stage by relative movement between the first stage and the second stage.

    WAFER CLEANING DEVICE AND WAFER TRANSFER APPARATUS THEREOF
    8.
    发明公开
    WAFER CLEANING DEVICE AND WAFER TRANSFER APPARATUS THEREOF 审中-实审

    公开(公告)号：EP4365934A1

    公开(公告)日：2024-05-08

    申请号：EP22831824.2

    申请日：2022-06-23

    申请人： Beijing NAURA Microelectronics Equipment Co., Ltd.

    发明人： MA, Hongshuai ,  ZHAO, Hongyu ,  WANG, Ruiting

    IPC分类号： H01L21/677 ,  H01L21/67

    摘要： The present disclosure provides a wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts. The distance between any two neighboring wafer support brackets is the same. With the above technical solution, the problem that the distance between the neighboring wafers cannot be changed when the wafer transfer device transfers the wafer can be solved.