公开(公告)号：EP1637261A1

公开(公告)日：2006-03-22

申请号：EP04736126.6

申请日：2004-06-04

申请人： Sumitomo Electric Industries, Ltd.

发明人： OKUDA, Yasuhiro ,  HAYASHI, Fumihiro ,  HAGA, Tsuyoshi ,  FUJITA, Taro ,  UENOYAMA, Mayo ,  MASUDA, Yasuhito ,  IDOMOTO, Yuichi

IPC分类号： B23B35/00 ,  B23Q3/08 ,  H05K3/00 ,  H05K3/42

CPC分类号： B29C44/5618 ,  B29C67/202 ,  H05K3/0011 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2203/0565 ,  H05K2203/0769 ,  H05K2203/1147 ,  Y10T29/49167

摘要： A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a plurality of perforations extending through from the first surface of the porous resin base having the solid substance within the porous structure to the second surface in the porous resin base; and Step 4 of melting or dissolving the solid substance to remove it from the interior of the porous structure, and a production process of a porous resin base with the inner wall surfaces of the perforations made conductive, comprising the step of selectively applying a catalyst only to the inner wall surfaces of the perforations to apply a conductive metal to the inner wall surfaces.

摘要翻译： 穿孔的多孔树脂基材的制造方法，包括浸渍有液体或溶液的多孔树脂基材的多孔结构的步骤1; 形成从浸渍的液体或溶液的固体物质的步骤2; 形成穿孔从具有多孔结构，以在该多孔树脂基材的第二表面内的固体物质的多孔树脂基体的所述第一表面延伸穿过的多个步骤3; 和熔融的步骤4或固体物质溶解以从多孔结构内部删除它，并与由导电穿孔的内壁表面的多孔树脂基材的制造方法，其包括选择性地施加催化剂的步骤仅 到穿孔的内壁表面的导电金属施加到内壁表面。