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    Method and apparatus for inserting leads of electrical components into corresponding holes according to different spacings of said holes
    1.
    发明公开
    Method and apparatus for inserting leads of electrical components into corresponding holes according to different spacings of said holes 失效
    将电气元件的引线插入相应孔中的方法和装置，根据不同的孔的不同间距

    公开(公告)号：EP0158756A3

    公开(公告)日：1986-09-10

    申请号：EP84402104

    申请日：1984-10-19

    申请人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)

    发明人： Zemek, Albert W. ,  Orzelek, Frank J. ,  Dunlap, Charles

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0439 ,  Y10T29/49153 ,  Y10T29/53183

    摘要： This invention concerns a method and an apparatus for mounting components on circuit boards by means of tool sections movable toward and away from opposite sides of a mid-plane, said components comprising a body and leads extending in opposite directions, said circuit boards having holes with different center-to-center spacings for mounting of different components, and said tooling sections comprising lead formers and means for driving a formed lead into a corresponding hold. According to the invention, each of said driving means are spaced by spacing means from an adjacent outside former (149) and inwardly toward said mid-plane when mounting components via holes having spacings greater than the smallest hole spacing, so as to avoid a lead misinsertion by forcing a formed lead from driving engagement with a blade (145) of said driving means during an operation of clinching inserted leads to an underside of said circuit board.

    Apparatus for inserting leads of electrical components into corresponding holes according to different spacings of said holes
    3.
    发明公开
    Apparatus for inserting leads of electrical components into corresponding holes according to different spacings of said holes 失效
    在根据这些孔之间的不同距离的匹配孔插入电气元件的引线的装置。

    公开(公告)号：EP0158756A2

    公开(公告)日：1985-10-23

    申请号：EP84402104.8

    申请日：1984-10-19

    申请人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)

    发明人： Zemek, Albert W. ,  Orzelek, Frank J. ,  Dunlap, Charles

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0439 ,  Y10T29/49153 ,  Y10T29/53183

    摘要： This invention concerns a method and an apparatus for mounting components on circuit boards by means of tool sections movable toward and away from opposite sides of a mid-plane, said components comprising a body and leads extending in opposite directions, said circuit boards having holes with different center-to-center spacings for mounting of different components, and said tooling sections comprising lead formers and means for driving a formed lead into a corresponding hold.
    According to the invention, each of said driving means are spaced by spacing means from an adjacent outside former (149) and inwardly toward said mid-plane when mounting components via holes having spacings greater than the smallest hole spacing, so as to avoid a lead misinsertion by forcing a formed lead from driving engagement with a blade (145) of said driving means during an operation of clinching inserted leads to an underside of said circuit board.

    摘要翻译： 本发明涉及一种方法和中间平面的装置用于通过工具部分朝向可动，并从一个相对侧离开的方式安装在电路板上的部件，所述部件包括主体和在相反方向上引线延伸，具有与所述通孔的电路板 不同的中心到中心的间距，用于安装不同的组件，并且所述工具区段包括铅膜剂和装置，用于驱动所形成的导线插入相应的保持状态。 ...间距。根据本发明，每个所述驱动装置的通过从在邻近外部变压器（149）间隔装置隔开并且向内朝向所述中间平面在通过具有间隔比最小的孔更大的孔的安装部件，所以 通过从驱动接合的在所述电路板的下侧的操作钳紧插入导致的手段中所述驱动的刀片（145）迫使形成引线以避免铅误插入。