公开(公告)号：EP2057567B1

公开(公告)日：2018-10-31

申请号：EP07823353.3

申请日：2007-07-26

申请人： Compagnie Générale des Etablissements Michelin

发明人： FEVRIER, Pierre ,  MARTIN, Hervé ,  FANDARD, Gérard

IPC分类号： B60C99/00 ,  G06F17/50

CPC分类号： G06F17/5009 ,  B60C99/006 ,  G06F17/5095 ,  G06F2217/80

公开(公告)号：EP3384408A1

公开(公告)日：2018-10-10

申请号：EP16715798.1

申请日：2016-03-18

申请人： Hewlett-Packard Development Company, L.P.

发明人： LOPEZ, Miguel Angel ,  SANCHEZ RIBES, Salvador ,  GARCIA, Luis

IPC分类号： G06F17/50 ,  B29C67/00 ,  B22F3/105

CPC分类号： G06F17/50 ,  B22F3/1055 ,  B22F2003/1057 ,  B29C64/135 ,  B29C64/386 ,  B33Y50/00 ,  G06F17/5009 ,  G06F17/5086 ,  G06F2217/12 ,  G06F2217/80 ,  Y02P10/295 ,  Y02P90/265

摘要： In an example, a method includes analysing, using at least one processor, object model data representing at least a portion of an object to be generated by an additive manufacturing apparatus by fusing a build material to determine at least one predicted object generation temperature. The method may further include identifying, using at least one processor and from said analysing, a feature of the at least a portion of the object associated with a predicted object generation temperature which is below a fusing temperature of build material to be used in object generation. The method may further include determining, using at least one processor, modification data to be used in object generation, the modification data being to increase a temperature of the feature in object generation.

公开(公告)号：EP3366392A1

公开(公告)日：2018-08-29

申请号：EP17157618.4

申请日：2017-02-23

申请人： Siemens Aktiengesellschaft

发明人： Lebed, Yaroslav

IPC分类号： B22F3/105 ,  G06F17/50

CPC分类号： B22F3/1055 ,  B22F2003/1056 ,  B22F2999/00 ,  G06F17/5018 ,  G06F2217/80 ,  Y02P10/295 ,  B22F2203/11

摘要： A build platform (10, 10a, 10b, 10c) for additive manufacturing, such as for selective laser melting, is presented. The build platform comprises an build surface (BS) and a stabilising frame, wherein the stabilising frame defines inner regions (5) of the build platform in which a platform material is spared and wherein the stabilising frame comprises a support structure (11) for mechanically reinforcing a structure of the build platform from distortions during an additive manufacturing process and during a post-buildup heat treatment.

公开(公告)号：EP3340004A1

公开(公告)日：2018-06-27

申请号：EP17209206.6

申请日：2017-12-21

申请人： Commissariat à l'Energie Atomique et aux Energies Alternatives

发明人： VALLEE, Mathieu ,  BAVIERE, Roland

IPC分类号： G05D23/19 ,  G06F17/50

CPC分类号： G05D23/1917 ,  G06F17/5009 ,  G06F2217/80

摘要： Un aspect de l'invention concerne un procédé de détermination de la capacité de délestage K d'un bâtiment, ledit bâtiment comprenant un système de chauffage comportant un circuit de chauffage, ledit système étant alimenté par une puissance P ch , le procédé comprenant une étape (E1) de détermination d'un modèle initial de fonctionnement du bâtiment caractérisant l'état d'équilibre dudit bâtiment ; ledit procédé étant caractérisé en ce qu'il comprend une étape (E2) de perturbation de la puissance P ch d'alimentation du système de chauffage dudit bâtiment, une étape (E3) de mesure de la réponse dudit bâtiment à ladite perturbation, ladite étape (E3) de mesure ne comprenant pas de mesure de la température intérieure du bâtiment ; une étape (E4) de détermination des paramètres du modèle initial de fonctionnement du bâtiment à partir de la mesure de la réponse dudit bâtiment, ladite détermination étant fonction du modèle initial de fonctionnement du bâtiment ; et une étape (E5) de détermination de la capacité de délestage K du bâtiment à partir des paramètres du modèle initial, ladite détermination étant fonction du modèle initial de fonctionnement du bâtiment.

公开(公告)号：EP3301620A1

公开(公告)日：2018-04-04

申请号：EP16192073.1

申请日：2016-10-03

申请人： Bartucci S.p.A.

发明人： BARTUCCI, Giovanni ,  FARELLA, Giorgia

IPC分类号： G06Q10/06

CPC分类号： G06Q10/0631 ,  G06F2217/80 ,  G06Q10/06 ,  Y02P90/82

摘要： The present invention relates to a method and relevant computer system for implementing such method directed to the computerized selection of technologies to be applied in order to improve the energy efficiency of a plant by a multi-technology and multi-scenario approach. The method provides to acquire input data of the plant (402), to define a target function to be optimized and to acquire a set of technologies applicable to the plant (601), each technology comprising at least one apparatus characterized by its own consumptions and technical characteristics. Then an optimization process is implemented (305) which determines an optimal set of apparatuses optimizing the target function. The applicable technologies are selected in a wider group of investigable technologies by simulating (503) the use in the plant of the apparatuses of such technologies and by selecting (504) as the applicable technology the set of apparatuses of the investigable technology that are consistent with plant consumptions and constraints.

摘要翻译： 本发明涉及用于实施这种方法的方法和相关计算机系统，该方法涉及计算机化技术的选择，以便通过多技术和多场景方法来提高工厂的能源效率。 该方法提供获取工厂（402）的输入数据，定义要优化的目标函数并获取适用于工厂（601）的一组技术，每种技术包括至少一个以其自身消耗为特征的装置，以及 技术特点。 然后执行优化过程（305），其确定优化目标函数的最优装置组。 通过模拟（503）在工厂中使用这些技术的装置并通过选择（504）作为可应用技术的可调查技术的装置集合来适用的技术在更广泛的可调查技术组中被选择 工厂消费和限制。

公开(公告)号：EP2711126B1

公开(公告)日：2018-01-17

申请号：EP12786586.3

申请日：2012-05-16

申请人： JTEKT Corporation

发明人： SASAKI Yuji ,  IWAI Hideki ,  SAKURAI Yasumasa ,  ONISHI Kimihiro ,  WAKAZONO Yoshio ,  YAMAMOTO Yoshiji

IPC分类号： G05B19/404 ,  B23Q15/18 ,  G06F1/20 ,  B23Q11/00 ,  G06F17/50

CPC分类号： G06F1/206 ,  B23Q11/0007 ,  G05B19/404 ,  G05B2219/35017 ,  G05B2219/49206 ,  G05B2219/49209 ,  G05B2219/49212 ,  G06F17/5018 ,  G06F2217/80

摘要： Provided are a thermal displacement compensating device and a thermal displacement compensating method for a machine tool, capable of performing a structural analysis by a finite element method at a high speed and hence, of performing a thermal displacement compensation accurately on a real time basis. A block temperature obtaining section obtains temperatures of respective blocks based on temperature information detected by temperature sensors wherein temperatures in each of the respective blocks into which a column is divided to be pluralized are defined as a uniform value. An FEM analysis section performs a structural analysis by a finite element method based on the temperatures of the respective blocks obtained by the block temperature obtaining section and infers thermal displacement amounts of the column. A compensation value calculation section calculates a compensation value for a machining command position based on the thermal displacement amounts of the column inferred by the finite element method analysis section. A compensation section compensates the machining command position by the compensation value obtained by the compensation value calculation section.

公开(公告)号：EP2859446A1

公开(公告)日：2015-04-15

申请号：EP13731565.1

申请日：2013-06-07

申请人： Qualcomm Incorporated

发明人： GUPTA, Sudhendra Kumar ,  SHAHIDI, Reza ,  RAMACHANDRAN, Shyamal

IPC分类号： G06F9/48

CPC分类号： G06F9/44 ,  G06F1/206 ,  G06F9/4893 ,  G06F2217/80 ,  H04L12/10 ,  H04L2012/2845 ,  H04M7/0009 ,  H04Q2213/13199 ,  H04Q2213/13334 ,  H04W52/028 ,  H04W88/16 ,  Y02D10/24 ,  Y02D70/1224 ,  Y02D70/1226 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/142 ,  Y02D70/146 ,  Y02D70/164

摘要： A wireless communication device for thermal mitigation with multiple processors is described. The wireless communication device includes a first communications processor that processes a data call. The wireless communication device also includes a second communications processor coupled to the first communications processor. The first communications processor performs a thermal mitigation operation by sending instructions to the second communications processor when at least one thermal threshold is reached. The second communications processor receives and executes the instructions.

摘要翻译： 描述了一种用于具有多个处理器的热缓解的无线通信设备。 无线通信设备包括处理数据呼叫的第一通信处理器。 无线通信设备还包括耦合到第一通信处理器的第二通信处理器。 当达到至少一个热阈值时，第一通信处理器通过向第二通信处理器发送指令来执行热缓解操作。 第二通信处理器接收并执行指令。

公开(公告)号：EP2790118A2

公开(公告)日：2014-10-15

申请号：EP14161197.0

申请日：2014-03-21

申请人： FUJITSU LIMITED

发明人： Kobayashi, Sachio ,  Kobayashi, Hiroki ,  Ikeda, Hiroshi ,  Hashima, Masayoshi ,  Sato, Yuichi

IPC分类号： G06F17/50

CPC分类号： G01K13/02 ,  G06F17/5022 ,  G06F2217/16 ,  G06F2217/80

摘要： A thermo-fluid analysis program causes an information processing apparatus (1) to perform a principal component analysis using a plurality of analysis results in a thermo-fluid analysis area and compute an approximate solution approximate to a final solution by summing analysis patterns obtained by the principal component analysis under a new analysis condition. The thermo-fluid analysis program causes the information processing apparatus (1) to perform a thermo-fluid analysis using the computed approximate solution as an initial state under the new analysis condition.

摘要翻译： 热流体分析程序使得信息处理装置（1）使用热流体分析区域中的多个分析结果来执行主成分分析，并且通过对由最终解决方案获得的分析模式进行求和来计算近似于最终解的近似解 在新分析条件下进行主成分分析。 热流体分析程序使得信息处理装置（1）使用计算出的近似解作为新分析条件下的初始状态进行热流体分析。

公开(公告)号：EP2750847A1

公开(公告)日：2014-07-09

申请号：EP12770329.6

申请日：2012-08-31

申请人： Siemens Product Lifecycle Management Software Inc.

发明人： LI, Zhi ,  WANG, Jingmei

IPC分类号： B29C33/38 ,  G06F17/50

CPC分类号： G06F17/5086 ,  B29C33/04 ,  B29C33/3835 ,  G06F2217/34 ,  G06F2217/80 ,  Y10S715/964

摘要： A method includes receiving ( 805) a CAD mode! (200) inc!uding a p!urality of intersecting fluid channels; determining (820) a fluid inlet for the fluid channels; displaying (825) possible fluid flow directions at an intersection of fluid channels; automatically adding (835) a cooling fitting to at least one of the fluid channels of the CAD model in response to a user selection of one of the possible fluid flow directions, Disclosed embodiments enable users to finish complicated cooling design quickly and easily, and can validate and manage the cooling design results.

公开(公告)号：EP2711126A1

公开(公告)日：2014-03-26

申请号：EP12786586.3

申请日：2012-05-16

申请人： JTEKT Corporation

发明人： SASAKI Yuji ,  IWAI Hideki ,  SAKURAI Yasumasa ,  ONISHI Kimihiro ,  WAKAZONO Yoshio ,  YAMAMOTO Yoshiji

IPC分类号： B23Q15/18 ,  G05B19/404

CPC分类号： G06F1/206 ,  B23Q11/0007 ,  G05B19/404 ,  G05B2219/35017 ,  G05B2219/49206 ,  G05B2219/49209 ,  G05B2219/49212 ,  G06F17/5018 ,  G06F2217/80

摘要： Provided are a thermal displacement compensating device and a thermal displacement compensating method for a machine tool, capable of performing a structural analysis by a finite element method at a high speed and hence, of performing a thermal displacement compensation accurately on a real time basis.
A block temperature obtaining section obtains temperatures of respective blocks based on temperature information detected by temperature sensors wherein temperatures in each of the respective blocks into which a column is divided to be pluralized are defined as a uniform value. An FEM analysis section performs a structural analysis by a finite element method based on the temperatures of the respective blocks obtained by the block temperature obtaining section and infers thermal displacement amounts of the column. A compensation value calculation section calculates a compensation value for a machining command position based on the thermal displacement amounts of the column inferred by the finite element method analysis section. A compensation section compensates the machining command position by the compensation value obtained by the compensation value calculation section.

摘要翻译： 提供一种用于机床的热位移补偿装置和热位移补偿方法，其能够通过有限元法高速执行结构分析，因此能够实时准确地进行热位移补偿。 块温度获取部分基于温度传感器检测到的温度信息获得各个块的温度，其中将被分割为多个的各个块的每个块中的温度定义为均匀值。 有限元分析部分通过基于由块温度获取部获得的相应块的温度的有限元法进行结构分析，并推断柱的热位移量。 补偿值计算部根据由有限元法分析部推断出的列的热位移量来计算加工指令位置的补偿值。 补偿部通过由补偿值计算部获得的补偿值来补偿加工指令位置。