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    COOLING CIRCUIT DESIGN
    1.
    发明公开
    COOLING CIRCUIT DESIGN 审中-公开
    草案冷却回路

    公开(公告)号：EP2750847A1

    公开(公告)日：2014-07-09

    申请号：EP12770329.6

    申请日：2012-08-31

    申请人： Siemens Product Lifecycle Management Software Inc.

    发明人： LI, Zhi ,  WANG, Jingmei

    IPC分类号： B29C33/38 ,  G06F17/50

    CPC分类号： G06F17/5086 ,  B29C33/04 ,  B29C33/3835 ,  G06F2217/34 ,  G06F2217/80 ,  Y10S715/964

    摘要： A method includes receiving ( 805) a CAD mode! (200) inc!uding a p!urality of intersecting fluid channels; determining (820) a fluid inlet for the fluid channels; displaying (825) possible fluid flow directions at an intersection of fluid channels; automatically adding (835) a cooling fitting to at least one of the fluid channels of the CAD model in response to a user selection of one of the possible fluid flow directions, Disclosed embodiments enable users to finish complicated cooling design quickly and easily, and can validate and manage the cooling design results.