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公开(公告)号：EP1533075B1
公开(公告)日：2007-07-18
申请号：EP04256800.6
申请日：2004-11-04
IPC分类号： B24B37/04
CPC分类号： B24B37/26 , Y10S451/921
摘要： A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the grooves contain a slurry (236) that facilitates polishing. Each groove includes a plurality of mixing structures (220) configured to cause mixing of slurry located in a lower portion (240) of the groove with slurry located in the upper portion (244) of the groove.
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公开(公告)号：EP1601497A1
公开(公告)日：2005-12-07
申请号：EP04709285.3
申请日：2004-02-09
发明人： PRASAD, Abaneshwar
CPC分类号： B24B37/205 , B24D3/34 , Y10S451/921
摘要： The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises 20 wt.% or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of 5 to 1000 nm, and wherein the transparent window has a total light transmittance of 30 % or more at at least one wavelength in the range of 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic/organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.
摘要翻译： 本发明涉及包括透明窗的化学机械抛光垫。 在一个实施例中，透明窗包括无机材料和有机材料，其中无机材料包含20重量％或更多的透明窗。 在另一个实施例中，透明窗包括无机材料和有机材料，其中无机材料分散在整个有机材料中并具有5-1000nm的尺寸，并且其中透明窗具有30％的总透光率或 更多地处于200至10,000nm范围内的至少一个波长。 在又一个实施例中，透明窗包括无机/有机杂化溶胶 - 凝胶材料。 在另一个实施方案中，透明窗包含聚合物树脂和澄清材料，其中透明窗的总透光率显着高于仅包含聚合物树脂的窗口。
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公开(公告)号：EP1126950B1
公开(公告)日：2002-11-20
申请号：EP99911324.4
申请日：1999-03-12
摘要： The present disclosure relates to a polishing pad (20) inlcuding a pad structure having at least first and second polishing regions (22, 24, 26) defined along a polishing surface (36) of the pad structure. The first polishing region of the pad structure is less compressible than the second polishing region of the pad structure. The present disclosure also relates to a polish platen (46) including a platen structure having at least first and second regions adapted for supporting a polishing pad (20). The first region of the platen structure is less compressible than the second region of the platen structure.
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公开(公告)号：EP0919336A2
公开(公告)日：1999-06-02
申请号：EP98309317.0
申请日：1998-11-13
申请人： Speedfam Co., Ltd.
发明人： Arai, Hatsuyuki , Wang, Xu Jin
CPC分类号： B24B37/22 , B24B37/26 , B24D3/22 , H01L21/302 , Y10S451/921
摘要： A polishing pad (10A,10B) consists of a hard upper-layer member 11 having a lower compressibility and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, which are adhered to each other by an adhesive layer 13. A plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm and that groove depth is at least half or more the thickness of the upper-layer member. This allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighbourhood of its outer circumference.
摘要翻译： 抛光垫（10A，10B）由具有较低压缩性的硬上层构件11构成，并且由研磨液可渗透的材料组成，具有较高压缩率的软下层构件12由 抛光液可透过的材料通过粘合剂层13彼此粘合。多个窄槽14，用于促进抛光液渗透到下层构件12中并将垫的表面分隔成 可以局部变形的多个小区域15以小区域的一侧的最大长度为10mm的间隔切割到焊盘表面，并且槽深度为上部区域的厚度的至少一半以上， 层成员。 这允许抛光液体均匀地渗透整个焊盘，同时使晶片能够均匀地抛光到其外圆周附近。
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公开(公告)号：EP0439124A2
公开(公告)日：1991-07-31
申请号：EP91100770.6
申请日：1991-01-22
发明人： Tuttle, Mark E.
IPC分类号： B24B37/04
CPC分类号： B24B37/26 , B24B7/228 , B24B13/01 , B24D11/00 , Y10S451/921
摘要： A polishing pad for semiconductor wafers (P), having a face (25) shaped by a series of voids (27, 37, 33). The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece (P) such as a semiconductor wafer, in order to effect improved planarity of the workpiece.
摘要翻译： 一种用于半导体晶片（P）的抛光垫，具有由一系列空隙（27,37,33）形成的面（25）。 空隙基本上相同的尺寸，但空隙的频率随着径向距离的增加而增加，以向诸如半导体晶片的工件（P）提供恒定的或接近恒定的表面接触速率，以便实现改进的平面度 工件。
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公开(公告)号：EP0272085A3
公开(公告)日：1989-07-12
申请号：EP87311025.8
申请日：1987-12-15
发明人： Wylde, Stephen Jack
IPC分类号： B24B13/01
CPC分类号： B24B13/01 , Y10S451/921
摘要： A lens lapping pad (10) comprising a zinc alloy foil (16) having a thickness of about 0.1 mm, and a backing of cloth (20) impregnated with a pressure sensitive adhesive, to give an overall pad thickness of substantially 0.5 mm. A peelable cover (18) may protect the cloth backing (20).
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公开(公告)号：EP0272085A2
公开(公告)日：1988-06-22
申请号：EP87311025.8
申请日：1987-12-15
发明人： Wylde, Stephen Jack
IPC分类号： B24B13/01
CPC分类号： B24B13/01 , Y10S451/921
摘要： A lens lapping pad (10) comprising a zinc alloy foil (16) having a thickness of about 0.1 mm, and a backing of cloth (20) impregnated with a pressure sensitive adhesive, to give an overall pad thickness of substantially 0.5 mm. A peelable cover (18) may protect the cloth backing (20).
摘要翻译： 包括厚度为约0.1mm的锌合金箔（16）和浸渍有压敏粘合剂的布（20）的背衬的透镜研磨垫（10），以使整体垫厚度基本上为0.5mm。 可剥离盖（18）可以保护布背衬（20）。
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8.发明公开Method and apparatus for grinding and polishing lenses on same machine spindle 失效用于研磨和在同一台机器主轴抛光镜片的方法和设备。
公开(公告)号：EP0259187A2
公开(公告)日：1988-03-09
申请号：EP87307851.3
申请日：1987-09-04
申请人： FERRO CORPORATION
发明人： Braun, Gary A.
IPC分类号： B24B13/00
CPC分类号： B24B13/01 , B24B13/00 , Y10S451/921
摘要： Both the surface grinding, or fining, and the polishing of a lens are accomplished on the same surfacing machine spindle, precisely reproducing the curvature and alignment from fining to polishing, thereby resulting in improved surface quality and optical properties. The fine grinding and polishing are accomplished using plain water by sequentially securing to and releasing from the lap, via a high shear-low peel strength adhesive, (a) a fixed abrasive fining pad, and then (b) a polishing pad consisting of a water soluble matrix containing the polishing particles.
摘要翻译： 两者的表面研磨，或澄清，和透镜的抛光在同一端面加工机器的主轴来实现，精确地再现来自澄清到抛光，从而在改善的表面质量和光学性质引起的曲率和对准。 精磨和抛光通过顺序固定，并从圈释放使用普通水通过高剪切低剥离强度粘合剂来完成，（a）一种固定的磨料澄清垫，然后（b）一种研磨垫的由...组成 水溶性基质含有研磨颗粒。
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公开(公告)号：EP2204261A3
公开(公告)日：2017-09-06
申请号：EP09155074.9
申请日：2009-03-13
IPC分类号： B24B37/04
CPC分类号： B24B37/26 , Y10S451/921
摘要： The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: r TR = 0.7 r * to 1.3 r *
where r * = R C R R C 2 - cos 2 θ c 0 - sin 2 θ c 0 R / R C cosθ c 0 2 - 1 ;
with the inner region originating continuous grooves that extend uninterrupted to the outer region.摘要翻译： 本发明提供了一种抛光垫，用于在具有抛光垫的抛光介质存在下抛光磁性，光学和半导体基底中的至少一个。 抛光垫包括中心，围绕中心的内部区域，连接从内部区域到围绕内部区域的外部区域的沟槽的过渡区域。 外部区域具有多个具有高速率路径的凹槽。 过渡区域与外部区域相邻，并且在距中心的半径内定义如下：rTR = 0.7r *至1.3r *其中r * = RCRRC2-cos2θc0-sin2θc0R/RCcosθc02-1; 其内部区域始发不间断地延伸到外部区域的连续凹槽。
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10.发明授权Polierwerkzeug zur Bearbeitung von optischen Flächen, insbesondere Freiformflächen 有权抛光工具用于加工的光学表面，尤其自由曲面
公开(公告)号：EP2384854B1
公开(公告)日：2015-10-28
申请号：EP11164042.1
申请日：2011-04-28
发明人： Nowak, Gerd , Zaiser, Michael
CPC分类号： B24D3/00 , B24B13/00 , Y10S451/921
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