公开(公告)号：EP0919336A3

公开(公告)日：2000-09-27

申请号：EP98309317.0

申请日：1998-11-13

申请人： Speedfam Co., Ltd.

发明人： Arai, Hatsuyuki ,  Wang, Xu Jin

IPC分类号： B24D13/14 ,  B24D13/12 ,  B24B37/04

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/22 ,  H01L21/302 ,  Y10S451/921

摘要： A polishing pad (10A,10B) consists of a hard upper-layer member 11 having a lower compressibility and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, which are adhered to each other by an adhesive layer 13. A plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm and that groove depth is at least half or more the thickness of the upper-layer member. This allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighbourhood of its outer circumference.

公开(公告)号：EP0919336A2

公开(公告)日：1999-06-02

申请号：EP98309317.0

申请日：1998-11-13

申请人： Speedfam Co., Ltd.

发明人： Arai, Hatsuyuki ,  Wang, Xu Jin

IPC分类号： B24D13/14 ,  B24D13/12 ,  B24B37/04

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/22 ,  H01L21/302 ,  Y10S451/921

摘要： A polishing pad (10A,10B) consists of a hard upper-layer member 11 having a lower compressibility and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, which are adhered to each other by an adhesive layer 13. A plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm and that groove depth is at least half or more the thickness of the upper-layer member. This allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighbourhood of its outer circumference.

摘要翻译： 抛光垫（10A，10B）由具有较低压缩性的硬上层构件11构成，并且由研磨液可渗透的材料组成，具有较高压缩率的软下层构件12由 抛光液可透过的材料通过粘合剂层13彼此粘合。多个窄槽14，用于促进抛光液渗透到下层构件12中并将垫的表面分隔成 可以局部变形的多个小区域15以小区域的一侧的最大长度为10mm的间隔切割到焊盘表面，并且槽深度为上部区域的厚度的至少一半以上， 层成员。 这允许抛光液体均匀地渗透整个焊盘，同时使晶片能够均匀地抛光到其外圆周附近。