摘要:
The present invention is related to providing a polyamic acid that can form a polyimide exhibiting a low dielectric property and a low hygroscopic property, and a polyamic acid composition, polyimide, polyimide film, and printed circuit board that are produced by using the polyamic acid. A polyamic acid that is a product obtained by polyaddition reaction between an ester-type acid dianhydride (A) and at least two diamines (B), wherein a dimer diamine (B1) is contained at a molar ratio of 0.3 or more relative to an entirety of the diamine component.
摘要:
A copolyester which comprises repeating units derived from an aliphatic glycol, terephthalic acid, and the monomer of formula (I):
wherein n = 2, 3 or 4, Z is C=O , and wherein comonomer (I) constitutes a proportion of the glycol fraction of the copolyester and is present in an amount of from about 5 mol% to about 15 mol% of the glycol fraction of the copolyester; wherein said copolyester is semi-crystalline.
摘要:
A film comprising a copolyester wherein said copolyester comprises repeating units derived from an aliphatic glycol, an aromatic dicarboxylic acid, and a comonomer (M) selected from the group consisting of N,N '-bis-(2-hydroxyalkyl)-bicyclo-[2,2,2]-oct-7- ene-2,3,5,6-tetracarboxylic diimide(BODI)and 2-hydroxyalkyl-2-[p-(2- hydroxyethoxycarbonyl)phenyl]-1,3-dioxo-2H-isoindole-5-carboxylate (DOIC), wherein the number of carbon atoms is the 2-hydroxyalkyl group is 2, 3 or 4, and wherein comonomer (M) constitutes a proportion of the glycol fraction of the copolyester.
摘要:
The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide.
摘要:
The present disclosure relates to a high molecular weight, monoesterified polyimide polymer. One method as described herein relates to making the high molecular weight, monoesterified polyimide polymer. According to its broadest aspect, the method for making the high molecular weight, monoesterified polyimide polymer comprises the following steps: (a) preparing a polyimide polymer comprising carboxylic acid functional groups from a reaction solution comprising monomers and at least one solvent; and (b) treating the polyimide polymer with a diol at esterification conditions in the presence of dehydrating conditions to form a monoesterified polyimide polymer, wherein the dehydrating conditions at least partially remove water produced during step (b). Such high molecular weight, monoesterified polyimide polymers are useful in forming crosslinked polymer membranes for the separation of fluid mixtures.