POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, AND PRINTED CIRCUIT BOARD

    公开(公告)号:EP4438656A1

    公开(公告)日:2024-10-02

    申请号:EP24163502.8

    申请日:2024-03-14

    IPC分类号: C08G73/10 C08G73/16 H05K1/00

    摘要: The present invention is related to providing a polyamic acid that can form a polyimide exhibiting a low dielectric property and a low hygroscopic property, and a polyamic acid composition, polyimide, polyimide film, and printed circuit board that are produced by using the polyamic acid. A polyamic acid that is a product obtained by polyaddition reaction between an ester-type acid dianhydride (A) and at least two diamines (B), wherein a dimer diamine (B1) is contained at a molar ratio of 0.3 or more relative to an entirety of the diamine component.

    CARBOXYL GROUP-CONTAINING POLYIMIDE, HEAT-CURABLE RESIN COMPOSITION, AND FLEXIBLE METAL-CLAD LAMINATE
    8.
    发明公开
    CARBOXYL GROUP-CONTAINING POLYIMIDE, HEAT-CURABLE RESIN COMPOSITION, AND FLEXIBLE METAL-CLAD LAMINATE 有权
    羧甲基纤维素聚氧乙烯纤维,柔软的金属拉丁字母

    公开(公告)号:EP2716674A1

    公开(公告)日:2014-04-09

    申请号:EP12793349.7

    申请日:2012-05-30

    申请人: Toyobo Co., Ltd.

    发明人: KAWAKUSU, Tetsuo

    摘要: The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide.

    摘要翻译: 本发明的目的在于提供含羧基的聚酰亚胺及其预聚物,其同时赋予固化产物高度满足热固性,耐PCT性,耐溶剂性和剥离强度。 本发明涉及含有末端含酸酐基团的酰亚胺预聚物,其特征在于通过使二羧酸二异氰酸酯化合物中的四羧​​酸二酸酐中的酸酐基与异氰酸酯基反应而制得,以及含羧基的聚酰亚胺,其特征在于 具有通过多元醇化合物延伸所述含末端含酸酐基的酰亚胺预聚物的链的结构。 本发明还涉及使用这种含羧基的聚酰亚胺的热固性树脂组合物和柔性覆金属层压板。