摘要:
After forming a TiN film on a semiconductor substrate, a surface treatment agent in a gas phase, which is obtained by bubbling trimethylsilyl methylsulfonate with a nitrogen gas, is supplied onto the TiN film. The TiN film is then coated with a chemically amplified positive resist including an acid generator and a compound which can attain alkali solubility through the function of an acid, and a pre-bake process is subsequently conducted, thereby forming a resist film. The resist film is then exposed with a KrF excimer laser by using a desired mask. Through this exposure, an acid is generated from the acid generator included in the resist film. Since sulfonic acid produced from trimethylsilyl methylsulfonate weakens the function as a base of a nitrogen atom having a lone pair, the acid generated from the acid generator is not deactivated at the bottom of the resist film. As a result, a resist pattern with a satisfactory shape free from footing can be formed.
摘要:
The present invention discloses a cleaning solution used to wash a semiconductor substrate surface. This cleaning solution contains these components: a liquid mixture of sulfuric acid and hydrogen peroxide to remove organic and inorganic residues; fluorosulfuric acid for generation of fluorine which serves as an etchant to remove other residues and particles; and water.
摘要:
A photosensitive resin composition is disclosed, comprising a polymer and a diazonium salt whose counter anion is a sulfonic group-containing compound represented by formulae (I) and/or (II): wherein R is a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkoxy group, a phenyl group, a halogen atom, a hydroxyl group, or a carboxyl group; X is a hydrogen atom, a lithium atom, a sodium atom, a potassium atom, or an ammonium group; and m and n are each an integer of from 0 to 5, provided that the sum of m and n is not higher than 5, wherein R and X are the same as defined above, and mʹ and nʹ are each an integer of from 0 to 7, provided that the sum of mʹ and nʹ is not higher than 7. A method for producing fine patterns by use of the foregoing photosensitive resin composition is also disclosed.
摘要:
A photosensitive resin composition is disclosed, comprising a polymer and a diazonium salt whose counter anion is a sulfonic group-containing compound represented by formulae (I) and/or (II): wherein R is a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkoxy group, a phenyl group, a halogen atom, a hydroxyl group, or a carboxyl group; X is a hydrogen atom, a lithium atom, a sodium atom, a potassium atom, or an ammonium group; and m and n are each an integer of from 0 to 5, provided that the sum of m and n is not higher than 5, wherein R and X are the same as defined above, and mʹ and nʹ are each an integer of from 0 to 7, provided that the sum of mʹ and nʹ is not higher than 7. A method for producing fine patterns by use of the foregoing photosensitive resin composition is also disclosed.