-
公开(公告)号：EP4435516A1
公开(公告)日：2024-09-25
申请号：EP24161393.4
申请日：2024-03-05
CPC分类号： G03F7/094 , G03F7/0752 , G03F7/11
摘要： The present invention is a method for forming a resist underlayer film, including the steps of: (i) coating a substrate with a composition for forming a resist underlayer film containing a metal compound having a metal-oxygen covalent bond and an organic solvent; (ii) forming a cured film by heating the coated substrate at a temperature of 100°C or higher and 600°C or lower for 10 seconds to 7,200 seconds for curing; and (iii) forming a resist underlayer film by irradiating the cured film with plasma, where a compound containing at least one crosslinking group represented by the following general formulae (a-1) to (a-4), (b-1) to (b-4), and (c-1) to (c-3) is used as the metal compound. This provides: a method for forming a resist underlayer film that contains metal and that exhibits both high filling property and high dry etching resistance; and a patterning process using the method.
-
2.发明公开
公开(公告)号：EP4428615A1
公开(公告)日：2024-09-11
申请号：EP24161082.3
申请日：2024-03-04
摘要： The present invention is a material for forming an adhesive film for an adhesive film formed directly under a resist upper layer film, includes: (A) a resin having a structural unit containing an acid-dissociable group and having two or more units represented by the formula (1) where R1 represents a hydrogen atom or a methyl group, and R2 represents a group selected from the formulae (1-1) to (1-3); and (C) an organic solvent, and the material comprises (B) a photo-acid generator and/or the resin (A) having the photo-acid generating unit. This provides a material for forming an adhesive film in a fine patterning process by a multilayer resist method, where the material gives an adhesive film with high adhesiveness to a resist upper layer film, suppresses fine pattern collapse, and can form an excellent pattern profile; a patterning process using the material; and a method for forming the adhesive film.
-
公开(公告)号：EP3854591B1
公开(公告)日：2024-07-31
申请号：EP21162555.3
申请日：2018-03-30
IPC分类号： B41C1/10 , B41N3/00 , G03F7/00 , G03F7/004 , G03F7/027 , G03F7/033 , G03F7/09 , G03F7/11 , B41N1/08 , B41N3/03
CPC分类号： G03F7/00 , G03F7/004 , G03F7/027 , G03F7/033 , G03F7/09 , G03F7/11 , B41C1/1016 , B41C1/1008 , B41N3/034 , B41N1/083 , B41C2210/0620130101 , B41C2210/0820130101 , B41C2210/1020130101 , B41C2210/2020130101 , B41C2210/2420130101 , B41C2210/2620130101 , B41C2210/0420130101 , B41C2201/0220130101 , B41C2201/1020130101 , B41C2201/1420130101 , B41C2201/0620130101
-
4.发明公开
公开(公告)号：EP4397502A1
公开(公告)日：2024-07-10
申请号：EP22864452.2
申请日：2022-08-26
申请人： FUJIFILM Corporation
发明人： WATANABE Shumpei , SAKAGUCHI Akira
摘要： The present invention provides an on-press development type lithographic printing plate precursor including, in the following order, a support, an image-recording layer, and a protective layer, in which the image-recording layer contains a) a polymerizable compound, b) an infrared absorber, c) a polymerization initiator, and d) a color forming substance precursor, and the protective layer contains an ultraviolet absorber, and a method of preparing a printing plate.
-
公开(公告)号：EP4394511A1
公开(公告)日：2024-07-03
申请号：EP22861015.0
申请日：2022-07-20
发明人： ABURA, Tsutomu
摘要： An object of the present invention is to provide a photosensitive resin printing plate precursor including an infrared-sensitive layer having excellent scratch resistance. The present invention is a photosensitive resin printing plate precursor including: a support; and a photosensitive resin layer, an interlayer, and an infrared-sensitive layer in this order on the support, wherein the interlayer contains a polyvinyl alcohol having a degree of saponification of 60 to 100 mol% and an average degree of polymerization of 1,200 to 3,000.
-
公开(公告)号：EP3385067A2
公开(公告)日：2018-10-10
申请号：EP18164972.4
申请日：2018-03-29
CPC分类号： G03F7/422 , B05D1/327 , B29D11/00317 , G02B1/11 , G02B1/14 , G02C7/021 , G03F7/0005 , G03F7/031 , G03F7/033 , G03F7/038 , G03F7/039 , G03F7/11 , G03F7/16 , G03F7/167 , G03F7/2004
摘要： A method for producing an optical component (1) having a processed pattern (15b) formed thereon and includes: a resist pattern forming step (S2) of forming a resist pattern (21) containing a water-soluble polymer (21) on a lens substrate (11); a water-insoluble layer forming step (S3) of forming a water-insoluble layer (15) on the lens substrate (11) on which the resist pattern (21) is formed; and a removing step (S4) of removing the water-insoluble layer (15) formed on the resist pattern (21) by removing the resist pattern (21) with an water-based solvent to form a processed pattern (15b).
-
7.发明公开
公开(公告)号：EP3199367A4
公开(公告)日：2018-06-27
申请号：EP15844261
申请日：2015-08-14
申请人： FUJI FILM CORP
CPC分类号： B41C1/1008 , B41C1/10 , B41C2210/04 , B41C2210/08 , B41M1/06 , B41N1/14 , B41N3/08 , B41P2200/20 , G03F7/00 , G03F7/11
摘要： Provided is a planographic printing plate precursor including: a support; and an image recording layer formed on the support, in which the content of fine particles per unit area in a region on a plate surface on the image recording layer side from an end portion of the planographic printing plate precursor to a portion inside the end portion by 5 mm is greater than the content of the fine particles per unit area in a region other than the region by an amount of 10 mg/m 2 or greater, edge stains are not generated therein, and transferring of the image recording layer is prevented even in a case where planographic printing plate precursors are stored in a stacked state. Further, provided are a method of producing the same and a printing method using the same.
-
公开(公告)号：EP2813890B1
公开(公告)日：2018-05-30
申请号：EP14171729.8
申请日：2014-06-10
发明人： Hatakeyama, Jun , Kori, Daisuke , Ogihara, Tsutomu
CPC分类号： H01L21/0276 , C08G8/04 , G03F7/0752 , G03F7/091 , G03F7/094 , G03F7/11 , G03F7/425 , H01L21/266
摘要： In lithography, a composition comprising a novolak resin comprising recurring units derived from a naphtholphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO 2 substrates.
-
9.发明授权Protective film-forming composition for immersion exposure and pattern-forming method using the same 有权浸渍曝光用保护膜形成用组合物及使用其的图案形成方法
公开(公告)号：EP1610179B1
公开(公告)日：2018-05-16
申请号：EP05012622.6
申请日：2005-06-13
申请人： FUJIFILM Corporation
发明人： Kanda, Hiromi
CPC分类号： G03F7/2041 , G03F7/0046 , G03F7/11
摘要： A protective film-forming composition for immersion exposure comprises a water-insoluble and alkali-soluble resin comprising a repeating unit derived from a monomer having an acid dissociation constant pKa of 8 or more.
-
10.发明公开
公开(公告)号：EP3179308A4
公开(公告)日：2018-04-18
申请号：EP15829358
申请日：2015-07-31
IPC分类号： G03F7/11 , C07C261/02 , G03F7/004 , G03F7/26 , H01L21/027
CPC分类号： G03F7/11 , C07C261/02 , C09D7/001 , C09D7/20 , C09D179/04 , G03F7/0045 , G03F7/0046 , G03F7/0392 , G03F7/0397 , G03F7/0752 , G03F7/091 , G03F7/094 , G03F7/162 , G03F7/168 , G03F7/2037 , G03F7/322 , G03F7/38 , H01L21/027 , H01L21/0274 , H01L21/3081 , H01L21/3086 , H01L21/31116 , H01L21/31144
摘要： The composition for forming an underlayer film for lithography according to the present invention contains a compound represented by a specific formula (1) and 20 to 99% by mass of a solvent component (S), in which 27 to 100% by mass of the compound represented by the formula (1) is included in a component (A) other than the solvent component (S).
-
-
-
-
-
-
-
-
-
搜索结果
1161 条记录 (耗时 0.019 秒)
