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    LOOP-TYPE HEAT PIPE AND METHOD OF MANUFACTURING LOOP-TYPE HEAT PIPE
    97.
    发明公开
    LOOP-TYPE HEAT PIPE AND METHOD OF MANUFACTURING LOOP-TYPE HEAT PIPE 审中-实审

    公开(公告)号：EP4350272A1

    公开(公告)日：2024-04-10

    申请号：EP23200921.7

    申请日：2023-09-29

    申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

    发明人： MACHIDA, Yoshihiro

    IPC分类号： F28D15/04 ,  F28D15/02

    摘要： An evaporator (21) includes a first metal layer (31) having a first inner surface (31A) and a first outer surface (31B), a second metal layer (32) having a second inner surface (32A) and a second outer surface (32B), and a porous body (21s) provided between the first outer surface (31B) and the second outer surface (32B). The porous body (21s) includes a first bottomed hole (41) provided in the first inner surface, a second bottomed hole (51) provided in the second inner surface (32A), a first fine pore (61), wherein the first bottomed hole (41) and the second bottomed hole (51) partially communicate with each other through the first fine pore (61), a first groove portion (42) provided in the first inner surface (31A) and configured to communicate with the first bottomed hole (41), and a second groove portion (52) provided in the second inner surface (32A) and configured to communicate with the second bottomed hole (51). The first outer surface (31B) and the second outer surface (32B) serve as an outer surface of the evaporator (21).

    EVAPORATOR
    98.
    发明公开
    EVAPORATOR 审中-实审

    公开(公告)号：EP4343261A1

    公开(公告)日：2024-03-27

    申请号：EP22827081.5

    申请日：2022-03-19

    申请人： ZTE Corporation

    发明人： LI, Biying ,  SUN, Zhen ,  XU, Qingsong

    IPC分类号： F28D15/04

    摘要： Embodiments of the disclosure provide an evaporator, which is applied to a loop thermosyphon device. The evaporator includes a liquid working medium 15 is disposed at a bottom of a housing 11, a gas outlet nozzle 13 is disposed at a top of the housing 11, a liquid return nozzle 14 is disposed at any position except a zone corresponding to a heat source, and a multi-scale structure 12 arranged on an inner wall of a heating surface 111. The heating surface 111 is a surface of the housing 11 making contact with a heat source device 3. The liquid working medium 15 is configured to absorb heat and then evaporate into gas. The heat is output to a condenser via the gas outlet nozzle 13, and the liquid working medium is condensed and returned to the bottom of the housing 11 via the liquid return nozzle 14. This can solve the problem in the related art of how to ensure that the heat source is located in an effective heat transfer zone constantly when the evaporator is in a vertical state and how to improve boiling heat transfer efficiency for the loop thermosyphon device. The liquid replenishing performance of the evaporator in a vertical state along gravity can be optimized, and it can be ensured that a heat input zone corresponding to the heat source is located in the effective heat transfer zone constantly.