摘要:
The fuse circuit comprises a fuse (F) and a transistor (Tr4) connected in series with an impedance element (Tr1, R) between a negative and a positive voltage supply sources (V ss , V DD ). A potential (Vp) is generated at the junction point between the transistor (Tr4) and the impedance element (Trl, R) and is applied to an inverter for indicating the fuse state. The impedance element including a transistor (Tr1) forms a constant-current source, and the internal resistance of transistor (Tr4) varies as a function of the fuse resistance. Due to the provision of the impedance element, a predetermined threshold resistor value can be provided which allows a correct detection of the fuse condition, even when the fuse is in "regrown fuse" or "grown-back" fuse state due to leakage between the fuse terminals after blowing of the fuse.
摘要:
A semiconductor integrated circuit device comprising a bias generating circuit having an operational amplifier connected to receive an input voltage at its inverting input terminal to produce a gate voltage, a field effect transistor having its gate connected to receive the gate voltage from said operational amplifier and its drain connected to a resistor and to a noniverting input terminal of said operational amplifier, and further field effect transistor having its gate connected to receive the gate voltage from said operational amplifier to produce a current corresponding to the input voltage, one group of current sources responsive to an output voltage of said bias generating circuit to produce a plurality of currents of an equal magnitude and one switching circuit responsive to an input digital value to selectively output the currents from said group of current sources to its common output.
摘要:
A D/A converter, especially a cyclic type D/A converter, having an error detection and correction system including: a code conversion circuit (101) for converting a binary code (C) to a multi-states code; a digital-to-analog conversion circuit (102) connected to the code conversion circuit (101) for converting the multi-states code to an analog value; a detection circuit (103) operatively connected to the digital-to-analog conversion circuit for converting the analog value to a digital code; and a control circuit (104) operatively connected to the code conversion circuit (101), digital-to analog conversion circuit (102) and detection circuit (103) for calculating a voltage difference between the analog value at a predetermined code value and another analog value adjacent to the predetermined code value, and for calculating a differential non-linearity error from the voltage difference based on the digital code, in order to obtain error and correction values of capacitors forming the digital-to-analog conversion circuit.
摘要:
@ A semiconductor integrated circuit including: an inverter circuit (1) including first and second transistors (T 7 , T 8 ) of different conductivities, and a level shift circuit (2), the first transistor (T 7 ) being supplied with an input signal (IN) via the level shift circuit (2), the second transistor (T 8 ) being supplied with the input signal (IN) directly, and the level shift circuit (2) having an amount of level shift such that, when an input signal (IN) corresponding to an «H» logic level is received, the level of the input signal supplied via the level shift circuit (V A ) is shifted near to the threshold level of the first transistor (T 7 ), to ensure correct switching of the first transistor (T 7 ). The level shift circuit (2) may be formed by a level divider circuit (T 1 , T 2 , T 3 ) and a source follower circuit (T 4 , T 5 ).
摘要:
In a comparator circuit comprising a first power supply terminal means and a second power supply terminal means, a differential stage connected between the first power supply terminal means and the second power supply terminal means, a first input signal having a reference level and a second input signal having a level which is compared with the reference level being input to each of a pair of input terminals of the differential stage, respectively, an output signal having a level which is determined in accordance with the level of the second input signal being output from an output terminal of the differential stage, and an output stage connected to the output terminal of the differential stage, through which output stage the output signal of the differential stage is amplified; a bypass circuit through which a predetermined constant current flows is connected between the output terminal of the differential stage and the second power supply terminal means. The bypass circuit may be always closed or may be closed only when the output level of the output stage has reached the predetermined value.
摘要:
The semiconductor integrated circuit comprises a first power supply terminal (V cc ) and a second power supply terminal; a first transistor (T 5 ) and a second transistor (T 8 ) having gates (or bases) connected in common; an input terminal (IN) and an output terminal (OUT) connected to each source (or each emitter) of the first and second transistors (T 5 ,T 8 ) respectively, an output voltage level (V out ) being obtained from the output terminal (OUT) in accordance with an input signal voltage level (V in ) supplied to the input terminal (IN); and a current mirror circuit (3) operating so that a first current flows through the first transistor (T 5 ) in proportion to a second current flowing through the second transistor (T a ), the value of the second current being determined in accordance with the output voltage level (V out ) and a value of a load (L) connected between the output terminal (OUT) and the second power supply terminal; and thereby, a voltage level supplied to the gates (or bases) of the first and second transistors (T 5 ,T 8 ) is varied in accordance with the value of the second current. Also, the above semiconductor integrated circuit may be used as a constant current output circuit by providing an output terminal (OUT) in one of the transistors (T 9 ) comprising the current mirror circuit (3), for supplying a predetermined constant current, and connecting a variable resistor (R cnt ) instead of the above load (L).
摘要:
In a semiconductor integrated circuit (10) comprising an internal circuit (9), an oscillating circuit (1) generating a basic clock signal for operating the internal circuit (9) when the internal circuit is operated in a usual mode, a pair of terminals (Toscin, Toscout) connected to the input side and output side of the oscillating circuit (1), respectively, an oscillator (8) being connected between the above pair of terminals (Toscin, Toscout) when the internal circuit (9) is , operated in a usual mode, a reset terminal (Treset) through which a reset signal for resetting the internal circuit is supplied from outside the integrated circuit (10) to the internal circuit, and a test circuit (3, 4, 5) for operating the internal circuit (9) in a test mode; the test circuit supplies a clock signal for testing from outside the integrated circuit to the internal circuit (9) through one of the above pair of terminals (Toscout) when signals of a predetermined level are supplied from outside of the chip to the test circuit through each of the other one of the above pair of terminals (Toscin) and the reset terminal (Treset).
摘要:
A method is provided to manufacture a semiconductor device which is capable of using multiple (three or more) power supplies by forming gate insulating films having different thicknesses. The method has the steps of: defining first, second and third active regions (AR1-3) on a surface of a semiconductor substrate (31); forming an insulating film (32) on the surfaces of the first, second and third active regions (AR1-3); removing the insulating film (32) on the surface of the second active region (AR2); forming an insulating film (34) on the surface of the second active region (AR2) and thickening the insulating films (32a) on the surfaces of the first and third active regions (AR1, AR3); removing the insulating film (32a) on the surface of the third active region (AR3); and forming an insulating film (36) on the surface of the third active region (AR3) and thickening the insulating films (32b, 34a) on the surfaces of the first and second active regions (AR1, AR2).