公开(公告)号：EP2747933A1

公开(公告)日：2014-07-02

申请号：EP12775400.0

申请日：2012-10-01

Applicant: Indium Corporation

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: B23K26/26 ,  C22C13/00 ,  H05K3/34

CPC classification number: C22C13/00 ,  B22F1/0003 ,  C22C9/00 ,  H01L23/49816 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/01327 ,  H01L2924/15311 ,  H05K3/3463 ,  H01L2924/00

Abstract: A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or equal to about 0.7 wt.% and less than or equal to about 2.0 wt.% Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt.% Mn; and a remainder of Sn.

Abstract translation: 公开了一种Sn-Ag-Cu系无铅焊料合金及其焊接接头，具有出色的冲击可靠性。 焊料包含大于0重量％至小于或等于约1.5重量％的Ag; 大于或等于约0.7重量％且小于或等于约2.0重量％的Cu; 大于或等于约0.001和小于或等于约0.2重量％的Mn; 和Sn的剩余部分。