公开(公告)号：EP3931364A1

公开(公告)日：2022-01-05

申请号：EP20717352.7

申请日：2020-02-26

Applicant: Indium Corporation

Inventor： GENG, Jie ,  ZHANG, Hongwen ,  LEE, Ning-Cheng

IPC: C22C13/02 ,  B23K35/26 ,  B23K35/02

公开(公告)号：EP1977022A2

公开(公告)日：2008-10-08

申请号：EP06848579.6

申请日：2006-12-13

Applicant: Indium Corporation of America

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: C22C13/00

CPC classification number: C22C13/00 ,  C22C13/02

Abstract: Lead- free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt . % of Ag, 0.01-1.5 wt . % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt.%, Y in an amount of 0.001-1.0 wt.%, Ti in an amount of 0.001-0.8 wt.%, and Bi in an amount of 0.01-1.0 wt.%, and the remainder of Sn.

公开(公告)号：EP4142978A1

公开(公告)日：2023-03-08

申请号：EP21726777.2

申请日：2021-04-29

Applicant: Indium Corporation

Inventor： ZHANG, Hongwen ,  LYTWYNEC, Samuel ,  WANG, Huaguang ,  GENG, Jie ,  MUTUKU, Francis M. ,  LEE, Ning-Cheng

IPC: B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01L21/00

公开(公告)号：EP2747933B1

公开(公告)日：2018-05-02

申请号：EP12775400.0

申请日：2012-10-01

Applicant: Indium Corporation

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: B23K26/26 ,  C22C13/00 ,  H05K3/34

CPC classification number: C22C13/00 ,  B22F1/0003 ,  C22C9/00 ,  H01L23/49816 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/01327 ,  H01L2924/15311 ,  H05K3/3463 ,  H01L2924/00

Abstract: A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or equal to about 0.7 wt.% and less than or equal to about 2.0 wt.% Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt.% Mn; and a remainder of Sn.

公开(公告)号：EP4509622A2

公开(公告)日：2025-02-19

申请号：EP24223871.5

申请日：2016-05-05

Applicant: Indium Corporation

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: C22C13/02

Abstract: A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt.% of Bi and/or 0.1-4.5 wt.% of In may be included in the solder alloy.

公开(公告)号：EP3972776A1

公开(公告)日：2022-03-30

申请号：EP20729424.0

申请日：2020-05-08

Applicant: Indium Corporation

Inventor： ZHANG, Hongwen ,  CHEN, Fen ,  MUTUKU, Francis ,  GENG, Jie ,  LEE, Ning-Cheng

IPC: B23K35/02 ,  B23K35/26 ,  H05K3/34

公开(公告)号：EP1685586A2

公开(公告)日：2006-08-02

申请号：EP04810184.4

申请日：2004-11-02

Applicant: Indium Corporation of America

Inventor： HUANG, Benlih ,  LEE, Ning-Cheng

IPC: H01L21/00

CPC classification number: C22C13/00 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.

公开(公告)号：EP3838473A1

公开(公告)日：2021-06-23

申请号：EP21156332.5

申请日：2016-05-05

Applicant: Indium Corporation

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: B23K35/26 ,  C22C13/02

Abstract: A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt.% of Bi and/or 0.1-4.5 wt.% of In may be included in the solder alloy.

公开(公告)号：EP3291942A1

公开(公告)日：2018-03-14

申请号：EP16724200.7

申请日：2016-05-05

Applicant: Indium Corporation

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: B23K35/26 ,  C22C13/02

CPC classification number: B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014

Abstract: A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt.% of Bi and/or 0.1-4.5 wt.% of In may be included in the solder alloy.

公开(公告)号：EP3117692A1

公开(公告)日：2017-01-18

申请号：EP15712239.1

申请日：2015-03-13

Applicant: Indium Corporation

Inventor： HU, Ming ,  LEE, Ning-Cheng

IPC: H05K3/34 ,  B23K1/20 ,  C08K5/09 ,  H01L23/00

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K35/3612 ,  B23K35/3613 ,  B23K2201/42 ,  C08K5/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/10126 ,  H01L2224/11011 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/041 ,  H05K2203/043 ,  H01L2924/014

Abstract: Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.

Abstract translation: 使用的可辐射固化，可热固化的焊剂，或双重固化型焊剂形成焊料凸块或接头的方法是游离缺失光盘。 该方法包括施加液体助焊剂所做的是辐射可固化的或可热固化的基板检查没有焊剂覆盖接触焊盘在基板上; 放置在覆盖有辐射固化或热固化的焊剂接触焊盘的焊料球; 加热加入焊球接触焊盘，从而形成焊锡凸块或焊点的基底; 并且通过施加辐射或热量到基板，由此形成固体电影固化所述液体焊剂。 助焊剂包括可辐射固化的，热固化的，或双固化材料做助剂形成的焊料凸块或焊点的焊剂被固化之前的; 和可固化以形成通过辐射或热的施加的固体材料。