公开(公告)号：EP0196642B1

公开(公告)日：1991-10-02

申请号：EP86104313.1

申请日：1986-03-27

申请人： MITSUBISHI MATERIALS CORPORATION ,  Japan Silicon Co., Ltd.

发明人： Shoji, Tsuruta ,  Hideaki, Minami ,  Yoshinori, Ohhata ,  Shinsuke, Sakai

IPC分类号： B24B53/00 ,  B24B21/00

CPC分类号： B24B27/0616 ,  B24B53/00

公开(公告)号：EP1301311B1

公开(公告)日：2005-09-14

申请号：EP01934059.5

申请日：2001-05-16

申请人： Exact Tools Oy

发明人： MAKKONEN, Seppo

IPC分类号： B24B27/06 ,  B23D21/08

CPC分类号： B24B27/0616 ,  B23D21/04 ,  B23D45/126 ,  B23D47/02

摘要： The invention relates to an apparatus for machining, especially cutting tubular or round section bodies (1), said apparatus comprising a gripping mechanism (2), which is adapted to be braced on said machinable body (1) rotatably around the same and which gripping mechanism (2) is provided with a machining unit (3) fitted with adjusting means (4) for moving said machining unit (3) relative to the gripping mechanism (2) towards or away from the machinable body (1), and which gripping mechanism (2) includes a frame section (5) and first and second arms (6, 7) extending therefrom, the gripping mechanism (2) being adapted to brace against the machinable body (1) by means of bracing elements (14, 15, 16) mounted on the frame section (5) and the arms (6, 7). The arms (6, 7) are at one end articulated to the frame section (5) of the gripping mechanism (2) and the bracing elements (15, 16) included in the arms (6, 7) are mounted on the free ends of the arms. The frame section (5) of the gripping mechanism (2) is rotatably and axially immovably fitted with a threaded shaft (20), having at its first end a right hand thread with a first nut (21) and at its second end a left hand thread with a second nut (22), and said threaded shaft (20) being provided with an element (23) for rotating the threaded shaft (20). The first arm (6) and the first nut (21) are articulated to each other by means of a first bracket (24) and the second arm (7) and the second nut (22) are articulated to each other by means of a second bracket (25).

公开(公告)号：EP1301311A1

公开(公告)日：2003-04-16

申请号：EP01934059.5

申请日：2001-05-16

申请人： Exact Tools Oy

发明人： MAKKONEN, Seppo

IPC分类号： B24B27/06 ,  B23D21/08

CPC分类号： B24B27/0616 ,  B23D21/04 ,  B23D45/126 ,  B23D47/02

摘要： The invention relates to an apparatus for machining, especially cutting tubular or round section bodies (1), said apparatus comprising a gripping mechanism (2), which is adapted to be braced on said machinable body (1) rotatably around the same and which gripping mechanism (2) is provided with a machining unit (3) fitted with adjusting means (4) for moving said machining unit (3) relative to the gripping mechanism (2) towards or away from the machinable body (1), and which gripping mechanism (2) includes a frame section (5) and first and second arms (6, 7) extending therefrom, the gripping mechanism (2) being adapted to brace against the machinable body (1) by means of bracing elements (14, 15, 16) mounted on the frame section (5) and the arms (6, 7). The arms (6, 7) are at one end articulated to the frame section (5) of the gripping mechanism (2) and the bracing elements (15, 16) included in the arms (6, 7) are mounted on the free ends of the arms. The frame section (5) of the gripping mechanism (2) is rotatably and axially immovably fitted with a threaded shaft (20), having at its first end a right hand thread with a first nut (21) and at its second end a left hand thread with a second nut (22), and said threaded shaft (20) being provided with an element (23) for rotating the threaded shaft (20). The first arm (6) and the first nut (21) are articulated to each other by means of a first bracket (24) and the second arm (7) and the second nut (22) are articulated to each other by means of a second bracket (25).

公开(公告)号：EP0417644B1

公开(公告)日：1994-07-27

申请号：EP90117173.6

申请日：1990-09-06

申请人： TOKYO SEIMITSU CO.,LTD.

发明人： Katayama, Ichiro

IPC分类号： B28D5/02 ,  B28D1/00 ,  B23P23/02 ,  B24B7/16 ,  B23Q15/04 ,  G05B19/18 ,  B24B49/02

CPC分类号： B24B49/02 ,  B23D59/001 ,  B24B1/00 ,  B24B7/16 ,  B24B7/228 ,  B24B27/0616 ,  B28D1/003 ,  B28D5/028

公开(公告)号：EP0513524A2

公开(公告)日：1992-11-19

申请号：EP92106109.9

申请日：1992-04-09

申请人： Georg Fischer Rohrleitungssysteme AG

发明人： Fahr, Markus

IPC分类号： B24B27/06 ,  B23D45/00 ,  B23D45/12

CPC分类号： B24B27/0616 ,  B23D45/126 ,  B23D47/04

摘要： Die Rohrtrennvorrichtung weist einen aus zwei Rahmen-Teilen (1a, 1b) zusammenspannbaren Rahmen (1) auf, welcher Führungen (4) für ein um das zu trennende Rohr (5) bewegbare Schneidvorrichtung (3) aufweist. An einem Rahmen-Teil (1a) ist eine Rohr-Spannvorrichtung (2) mit das Rohr in zentrischer Lage zum Rahmen (1) spannenden Spannbacken (12) angeordnet.

摘要翻译： 管切断装置具有框架（1），其可以从两个框架部分（1a，1b）夹紧在一起，并且具有可以围绕管（5）移动的用于切割装置（3）的引导件（4） 被切断 具有夹钳（12）的管夹紧装置（2）在相对于框架（1）的同心位置处夹紧，布置在框架部分（1a）上。

公开(公告)号：EP0417644A2

公开(公告)日：1991-03-20

申请号：EP90117173.6

申请日：1990-09-06

申请人： TOKYO SEIMITSU CO.,LTD.

发明人： Katayama, Ichiro

IPC分类号： B28D5/02 ,  B28D1/00 ,  B23P23/02 ,  B24B7/16 ,  B23Q15/04 ,  G05B19/18 ,  B24B49/02

CPC分类号： B24B49/02 ,  B23D59/001 ,  B24B1/00 ,  B24B7/16 ,  B24B7/228 ,  B24B27/0616 ,  B28D1/003 ,  B28D5/028

摘要： A slicing method by use of a slicing machine in which, after a cylindrical material (18) is moved by a predetermined amount of indexing, the cylindrical material (18) is moved to a rotating blade (20) in he slicing direction of the blade (20) and is sliced into a wafer having a predetermined thickness, and at the same time the end face of the cylindrical material (18) is ground. In the slicing method according to the invention, the grinding position and the amount of indexing of the cylindrical material (18) can be corrected in accordance with the actually measured data of the thicknesses of the wafer after sliced, the data of axial displacements of the blade detected during slicing, and the actually measured data of the shapes of the end face of the cylindrical material (18) after slicing of the wafer. Thanks to this, the grinding position can be calculated accurately, the loss of the cylindrical material (18) can be minimized, and the slicing can be carried out in accurate amount of indexing, so that the wafer can be manufactured with high accuracy.

摘要翻译： 使用切片机的切片方法，其中，在圆柱形材料（18）移动预定量的分度之后，圆柱形材料（18）沿叶片的切片方向移动到旋转叶片（20） （20），并切割成具有预定厚度的晶片，同时研磨圆柱形材料（18）的端面。 在根据本发明的切片方法中，可以根据切片后的晶片的厚度的实际测量数据来校正圆柱形材料（18）的研磨位置和分度量，其中轴向位移的数据 在切片期间检测到的刀片以及在切割晶片之后圆柱形材料（18）的端面的形状的实际测量数据。 由此，可以精确地计算磨削位置，可以使圆柱形材料（18）的损失最小化，并且可以以精确的分度量进行切片，从而可以高精度地制造晶片。