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公开(公告)号:EP2183769B8
公开(公告)日:2017-08-23
申请号:EP08797141.2
申请日:2008-08-04
发明人: RICHARDSON, Thomas, B. , ZHANG, Yun , WANG, Chen , PANECCASIO, Vincent , WANG, Cai , LIN, Xuan , HURTUBISE, Richard , ABYS, Joseph, A.
IPC分类号: C25D5/02 , H01L21/288
CPC分类号: H01L21/76898 , C25D3/38 , C25D5/02 , C25D7/123 , H01L21/2885
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公开(公告)号:EP3839103B1
公开(公告)日:2023-07-19
申请号:EP21155629.5
申请日:2016-06-30
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23.
公开(公告)号:EP3502159B1
公开(公告)日:2023-05-31
申请号:EP19150308.5
申请日:2011-10-31
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24.
公开(公告)号:EP3059277B2
公开(公告)日:2022-03-30
申请号:EP15156059.6
申请日:2015-02-23
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公开(公告)号:EP2358926B1
公开(公告)日:2021-08-25
申请号:EP09760054.8
申请日:2009-11-19
IPC分类号: C25D3/38 , C25D7/12 , H01L21/288 , C25D5/02 , H01L21/768
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公开(公告)号:EP3631050A2
公开(公告)日:2020-04-08
申请号:EP18809323.1
申请日:2018-05-24
发明人: SANTOS, Cherry, S. , BAMKER, Tyler , SWANSON, John , XU, Fengting , LONG, Ernest
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公开(公告)号:EP3516096A1
公开(公告)日:2019-07-31
申请号:EP17853869.0
申请日:2017-09-21
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29.
公开(公告)号:EP2632969B1
公开(公告)日:2019-02-27
申请号:EP11782715.4
申请日:2011-10-31
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公开(公告)号:EP2494094B1
公开(公告)日:2018-12-05
申请号:EP10773811.4
申请日:2010-10-28
发明人: YAU, Yung-Herng , WANG, Xingping , WANG, Cai , FARRELL, Robert , YE, Pingping , KUDRAK, Edward, J., Jr. , WENGENROTH, Karl, F. , ABYS, Joseph, A.
CPC分类号: C23C18/54 , C23C18/48 , Y10T428/12715
摘要: A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
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