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    COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF
    25.
    发明公开
    COPPER ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF 审中-公开
    材料AUS KUPFERLEGIERUNG UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2752498A1

    公开(公告)日：2014-07-09

    申请号：EP12828596.2

    申请日：2012-08-29

    申请人： Furukawa Electric Co., Ltd.

    发明人： MATSUO, Ryosuke ,  KANEKO, Hiroshi

    IPC分类号： C22C9/00 ,  C22C1/10 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  H01B5/02 ,  H01B13/00 ,  C22F1/00

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01B1/026

    摘要： {Problems} To provide a copper alloy material that is excellent in bending property, 0.2% yield stress, electrical conductivity, and stress relaxation resistance, and that is suitable in lead frames, connectors, terminal materials, and the like of, for example, parts to be mounted on vehicles and surrounding infrastructures primarily for EVs and HEVs, and solar photovoltaic power generation systems.
    {Means to solve} A copper alloy material, containing 0.1 to 0.8 mass% of Cr, and 0.01 to 0.5 mass% in total of at least one selected from the group consisting of an additional alloying element group 1 and an additional alloying element group 2 described below, with the balance being copper and unavoidable impurities, wherein in a crystal orientation analysis of a rolled face in an electron backscatter diffraction analysis, the area ratio of grains having an orientation in which a deviation from the Cube orientation {001} is within 15° is 3% or more, and wherein the ratio of coincidence grain boundary Σ3 in grain boundaries is 20% or more:
    an additional alloying element group 1: at least one selected from the group consisting of Mg, Ti and Zr in an amount of 0.01 to 0.5 mass% in total; and
    an additional alloying element group 2: at least one selected from the group consisting of Zn, Fe, Sn, Ag, Si and P in an amount of 0.005 to 0.5 mass% in total.

    摘要翻译： {问题}提供弯曲性优异的0.2％屈服应力，导电性和耐应力松弛性的铜合金材料，适用于例如引线框架，连接器，端子材料等， 主要用于EV和HEV的车辆和周边基础设施部件以及太阳能光伏发电系统。 {解决方案}一种铜合金材料，其含有0.1〜0.8质量％的Cr，0.01〜0.5质量％的合金成分组成的组中的至少一种选自附加的合金元素组1和附加的合金元素组2 其余为铜和不可避免的杂质，其中在电子背散射衍射分析中的卷面的晶体取向分析中，具有偏离立方体{001} <100的取向的晶粒的面积比 > 15°以下，3％以上，晶界的重合晶界3的比例为20％以上：附加合金元素组1：选自Mg，Ti和 总量为0.01〜0.5质量％的Zr; 和另外的合金元素组2：选自Zn，Fe，Sn，Ag，Si和P中的至少一种，其总量为0.005〜0.5质量％。

    CU-NI-SI COPPER ALLOY PLATE WITH EXCELLENT DEEP-DRAW CHARACTERISTICS AND PRODUCTION METHOD THEREOF
    27.
    发明公开
    CU-NI-SI COPPER ALLOY PLATE WITH EXCELLENT DEEP-DRAW CHARACTERISTICS AND PRODUCTION METHOD THEREOF 有权
    板由Cu-Ni-Si系铜合金中的优秀表现热成型性能和工艺

    公开(公告)号：EP2592164A1

    公开(公告)日：2013-05-15

    申请号：EP10854423.0

    申请日：2010-07-07

    申请人： Mitsubishi Shindoh Co., Ltd.

    发明人： SAKURAI, Takeshi ,  ABE, Yoshio ,  Saito Akira ,  KAMEYAMA, Yoshihiro

    IPC分类号： C22C9/06 ,  C22C9/04 ,  C22F1/08 ,  H01B1/02 ,  H01B13/00 ,  C22F1/00

    CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  H01B1/026

    摘要： Provided are a Cu-Ni-Si-based copper alloy which has balanced characteristics of deep drawing workability, plating resistance to heat separation and spring bending elastic limit, particularly has an excellent deep drawing workability, and is used in electrical and electronic members, and a method of manufacturing the same.
    The Cu-Ni-Si-based copper alloy plate contains 1.0 mass% to 3.0 mass% of Ni, and Si at a concentration of 1/6 to 1/4 of the mass% concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains, which is measured through an EBSD method using a scanning electron microscope equipped with an electron backscatter diffraction image system, is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm 2 to 600 N/mm 2 , the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150°C for 1000 hours.

    摘要翻译： 本发明提供了其中有深冲加工性的平衡特性，镀覆耐热性分离和弹簧弯曲弹性极限，特别是具有优良的深冲加工性，并且在电子和电气部件时，的Cu-Ni-Si系铜合金和 制造的方法。 该Cu-Ni-Si系铜合金板中含有的Ni的1.0质量％〜3.0质量％，和Si的Ni的质量浓度的1.6至4.1％与Cu和不可避免的杂质的剩余部分的浓度 在其中，当高宽比的平均值在合金结构中的每个晶粒的（晶粒/晶粒的长轴的短轴）为0.4〜0.6，GOS中的所有晶粒的平均值 ，所有这是使用电子背散射衍射图像系统上配备有扫描电子显微镜通过测量基于EBSD法，是1.2°〜1.5°，并且比率特殊晶界的总特殊晶界长度La到的（LA / L） 晶界的总晶界长度L为60％〜70％时​​，弹弯弹性极限变为450 N / mm 2到600N / mm 2，则焊料耐热性分离是有利的和深冲加工性优良的 150℃下1000小时。