公开(公告)号：EP3821788A1

公开(公告)日：2021-05-19

申请号：EP19834399.8

申请日：2019-06-28

申请人： FUJIFILM Corporation

发明人： NAKAI, Yoshihiro ,  FURUKAWA, Kazushi

IPC分类号： A61B1/005 ,  A61B1/00 ,  C08G59/24 ,  C08G59/50 ,  C09J11/06 ,  C09J163/02 ,  G02B23/24

摘要： Provided are an adhesive for an endoscope, a cured product of the adhesive for an endoscope, an endoscope produced using the adhesive for an endoscope, and a method for producing an endoscope. The adhesive for an endoscope includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, a polyamine compound (B), and a specific compound (C) having an epoxy group.

公开(公告)号：EP3611241B1

公开(公告)日：2021-04-14

申请号：EP18874352.0

申请日：2018-11-01

发明人： PARK, Hang Ah ,  JO, Jung Ho ,  YOON, Jun Young ,  YUN, Hyeong Seuk

IPC分类号： C09K19/56 ,  G02F1/1337 ,  C08L79/08 ,  C08K5/205 ,  C08G73/02 ,  C08L79/02 ,  C08L63/00 ,  C08G59/24 ,  C08K5/00 ,  C09K19/54 ,  C09K19/52 ,  C08G73/10 ,  C09D179/08

公开(公告)号：EP3504283B1

公开(公告)日：2021-04-07

申请号：EP18779755.0

申请日：2018-08-16

发明人： PETERS, Edward Norman ,  PAL, Jaykisor ,  SISTA, Prakash

IPC分类号： C09D163/00 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C09D163/04

公开(公告)号：EP3371241B1

公开(公告)日：2021-01-06

申请号：EP16862969.9

申请日：2016-11-03

发明人： EVANS, Richard, H. ,  WEBSTER, Benjamin, J. ,  O'BRIEN, Robert, M. ,  NIEDERST, Jeffrey

IPC分类号： C08G59/18 ,  C08G59/62 ,  C08L63/00 ,  C08G59/06 ,  C08G59/24 ,  C09D163/00 ,  C08G59/02

公开(公告)号：EP3611209B1

公开(公告)日：2020-12-02

申请号：EP18838002.6

申请日：2018-07-19

申请人： Daicel Corporation

发明人： MIZUTA, Tomoya ,  INOUE, Keizo

IPC分类号： C08G59/24 ,  C08G59/38 ,  C08G65/26 ,  C09D11/30 ,  C08G65/18 ,  C08L63/00

公开(公告)号：EP3717544A1

公开(公告)日：2020-10-07

申请号：EP18807103.9

申请日：2018-11-28

申请人： Essilor International

发明人： ZHENG, Haipeng ,  FREEMAN, Matthew

IPC分类号： C08G59/24 ,  C08G59/30 ,  C08G59/32 ,  C08G59/36 ,  C08G59/38 ,  G02B1/10

公开(公告)号：EP3486286B1

公开(公告)日：2020-05-13

申请号：EP18202212.9

申请日：2014-12-19

申请人： Daicel Corporation

发明人： FUJIKAWA, Takeshi ,  KUBO, Takashi

IPC分类号： C08L63/00 ,  C08G59/24 ,  G02B1/04 ,  G02B3/08 ,  C08G59/02

公开(公告)号：EP3640275A1

公开(公告)日：2020-04-22

申请号：EP19202938.7

申请日：2019-10-14

申请人： SABIC Global Technologies B.V.

发明人： PRAKASH, SISTA ,  WANG, YANWAN ,  BAJAJ, DEVENDRA

IPC分类号： C08G59/18 ,  C08G59/24 ,  C08G59/26 ,  C08G59/38 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C09D163/00 ,  C09J163/00 ,  C08L63/00

摘要： A curable high heat epoxy composition, comprising: 40 to 95 weight percent (wt%), preferably 50 to 90 wt%, more preferably 55 to 80 wt% of at least one high heat diepoxy compound of formulas (I) to (X), wherein R 1 , R 2 , R 13 , R 14 , R a , R b , R g , p, q, c, and t are as provided herein; 1 to 40 weight percent, preferably 5 to 30 wt%, more preferably 8 to 20 wt%of an auxiliary polyepoxide; 0.01 to 12 wt%, preferably 0.1 to 10 wt%, more preferably 1 to 8 wt% of a core-shell particle comprising an elastomer core and a rigid shell; and a hardener.

公开(公告)号：EP2812404B1

公开(公告)日：2019-11-06

申请号：EP13746877.3

申请日：2013-02-06

申请人： SWIMC LLC

发明人： NIEDERST, Jeffrey ,  EVANS, Richard H. ,  ROMAGNOLI, Kevin ,  O'BRIEN, Robert M. ,  VON MAIER, Mark S. ,  KILLILEA, T. Howard

IPC分类号： C09D171/00 ,  C23C2/00 ,  C08L71/00 ,  C08G59/06 ,  A47J47/02 ,  B65D25/14 ,  C08G59/14 ,  C08G59/24

公开(公告)号：EP3532526A1

公开(公告)日：2019-09-04

申请号：EP17794695.1

申请日：2017-10-24

申请人： Reichhold AS

发明人： GEHRINGER, Lionel ,  YU, Miran ,  HENNINGSEN, Michael ,  ZWECKER, Joachim

IPC分类号： C08G59/40 ,  C08J5/24 ,  C08G59/50 ,  C08G59/56 ,  C08G59/24

摘要： The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one aminoalkylimidazole compound, at least one diazabicycloalkylen compound and at least one latent hardener. In said epoxy-resin composition, the amount of the aminoalkylimidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC.