摘要:
An abnormality detection circuit for a resolver outputs a rotation angle signal 101 corresponding to a rotation angle of a rotor from a resolver winding 102. In the abnormality detection circuit, the resolver abnormality detection circuit applies a specified signal to one terminal of the resolver winding 102, determines whether the specified signal is superimposed on the rotation angle signal 101 outputted by an other terminal of the resolver winding 102, and detects abnormalities of the resolver based on results of the determination.
摘要:
A switching state detecting apparatus capable of preventing output voltage hunting caused by mechanical switch contacts bouncing when changing state and creating voltage fluctuation (chatter) comprises a passive filter (510) connected to the switches (S1 - Sn) and a comparator (507) for comparing the output value of the RC filter with a threshold level to then output a voltage value. The comparator changes the threshold level when the output voltage of the comparator is inverted, thereby preventing the apparatus from hunting. The output of the comparator is potentially divided and the divided output potential is superposed onto an initial threshold level to provide a second threshold level exceeding the voltage chatter level of said switches.
摘要:
An electronic circuits (11, 12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.
摘要:
An electronic circuits (11, 12) are mounted on a metal base (13). The metal base is covered by a mold resin case (16) at the peripheral portion thereof. A projected portion (29) is formed along all the peripheral edge portion of the metal base. A step portion is formed to the metal base next to the projected portion of the metal base. A groove (28) is formed along all the peripheral portion of the bottom surface of the mold resin case. The projected portion is engaged to the groove which is filled with a bonding material (33). The bottom surface of the step portion is also covered by the bonding material when the projected portion is thrust into the groove of the mold resin case.
摘要:
An ignition system for an internal combustion engine comprising a semiconductor power switching device (2) which is controlled by a control unit (1) is disclosed. In response to an output from a device (5) for detecting a shorting breakdown or a heat generation of the power switching device (2), the power switching device (2) and the ignition coil (3) are separated from a power supply (Vg) by a current cut-off device (8, 8ʹ). Even when the power switching device (2) breaks down by shorting, the power generation due to the continuous energization of the ignition coil (3) is prevented thereby to prevent the ignition coil (3) from being heated abnormally.
摘要:
An ignition system for an internal combustion engine comprising a semiconductor power switching device (2) which is controlled by a control unit (1) is disclosed. In response to an output from a device (5) for detecting a shorting breakdown or a heat generation of the power switching device (2), the power switching device (2) and the ignition coil (3) are separated from a power supply (Vg) by a current cut-off device (8, 8ʹ). Even when the power switching device (2) breaks down by shorting, the power generation due to the continuous energization of the ignition coil (3) is prevented thereby to prevent the ignition coil (3) from being heated abnormally.
摘要:
In an integrated pressure sensor, a silicon chip (10) for pressure detection and a substrate (22) for supporting the silicon chip are made of the same material, the silicon chip (10) has a thin diaphragm portion (14) and a peripheral fixed portion (12) thicker than the diaphragm portion (14), and the silicon chip (10) is bonded to the substrate (22) through a thin insulating film (20).