公开(公告)号：EP0521735A1

公开(公告)日：1993-01-07

申请号：EP92306179.0

申请日：1992-07-03

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Kimura, Masatoshi, c/o Mitsubishi Denki K. K.

IPC: H05K3/36 ,  H05K1/00 ,  H05K1/14

CPC classification number: H05K5/026 ,  H01L23/5387 ,  H01L25/0652 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A semiconductor memory control device comprises a flexible board 7 which is folded in such a manner as to form a stack; a plurality of semiconductor elements 10 mounted on the flexible board; and a package main body 6, 8, 9 which encloses and seals the flexible board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density comprises the steps of: mounting a plurality of semiconductor elements on a flexible board; forming an internally mounted module by bending the flexible board in such a manner as to be stacked in multiple layers; and sealing the internally mounted module in a package's main body.

Abstract translation: 半导体存储器控制装置包括以形成堆叠的方式折叠的柔性板7; 安装在柔性板上的多个半导体元件10; 以及封装主体6,8,9，其包围并密封柔性板和多个半导体元件。 以高密度安装半导体存储器控制装置的方法包括以下步骤：将多个半导体元件安装在柔性板上; 通过弯曲所述柔性板以多层堆叠的方式形成内部安装的模块; 并将内部安装的模块密封在包装的主体中。