SURFACE ABRASIVE TREATMENT OF SMALL OBJECTS
    31.
    发明授权
    SURFACE ABRASIVE TREATMENT OF SMALL OBJECTS 失效
    削面小物件的处理

    公开(公告)号:EP0515358B1

    公开(公告)日:1996-11-06

    申请号:EP90903025.6

    申请日:1990-02-12

    IPC分类号: B02B3/00

    CPC分类号: B02B3/00

    摘要: Apparatus is disclosed for use in the abrasion of small objects, e.g. rice grains, to remove surface material, e.g. bran, therefrom. A chamber (1) has a bottom formed by an abrasive endless belt (7) which passes under a transverse wall (4) of the chamber. An inlet (12) is provided for objects to be abraded. An outlet (14, 32) is provided for abraded objects. In use, objects recirculate in the chamber and material removed from said objects passes under the transverse wall. The chamber has a top (11), opposed to the bottom. The top is sufficiently close to the bottom that, in use, pressure is exerted on the recirculating objects to press the lowest objects against the moving belt.

    Refining process for semiraw rice
    33.
    发明公开
    Refining process for semiraw rice 失效
    Raffinationsverfahrenfürhalbrohen Reis。

    公开(公告)号:EP0592373A1

    公开(公告)日:1994-04-13

    申请号:EP93830141.3

    申请日:1993-04-02

    IPC分类号: B02B3/00 B02B3/04 B02B3/06

    CPC分类号: B02B3/04 B02B3/00 B02B3/06

    摘要: A refining process for semiraw rice comprises a first step (A) in which surface cuts are carried out in the rice grains by rubbing of the grains against an abrasive surface, a second step (B) in which the surface-cut grains are submitted to mutual rubbing for removal of the cortical layers therefrom and a third step (C) in which said cortical layers are separated from the rice by sieving.

    摘要翻译: 半干米的精制方法包括:第一步骤(A),其中通过将磨粒磨擦在研磨表面上在米粒中进行表面切割;第二步骤(B),其中将表面切割谷物送至 用于从其中除去皮质层的相互摩擦和通过筛分将所述皮质层与米分离的第三步骤(C)。

    Processes for dehusking psyllium seeds
    36.
    发明公开
    Processes for dehusking psyllium seeds 失效
    去除豆类种子的方法

    公开(公告)号:EP0405651A3

    公开(公告)日:1991-07-24

    申请号:EP90201595.7

    申请日:1990-06-19

    IPC分类号: B02B3/00

    CPC分类号: B02B3/00

    摘要: Processes for dehusking psyllium seeds to obtain high yields of high purity psyllium seed husk. These processes comprise milling intact psyllium seeds in a mill which causes the husk to be fragmented by collision under conditions whereby the husk is fractured and separated from the non-husk portion of the psyllium seed without substantial breakage and size reduction of the non-husk portion. Preferred milling utilizes impact speeds within the range of from about 5m/sec to about 40m/sec.

    Grain husking and polishing machine
    37.
    发明公开
    Grain husking and polishing machine 失效
    Schäl-und PoliermaschinefürGetreidekörner。

    公开(公告)号:EP0427504A2

    公开(公告)日:1991-05-15

    申请号:EP90312124.2

    申请日:1990-11-06

    IPC分类号: B02B3/00

    CPC分类号: B02B3/00 B02B3/04

    摘要: A grain husking and polishing machine includes a grain treatment chamber 50 defined by an abrasive rotor mounted on a hollow rotating shaft 13 and a screen assembly 44 surrounding the rotor 45. The screen 44 is mounted on a movable annular plate 25 actuated by a sidewardly movable mechanism 62-65 capable of changing the eccentricity of the screen assembly 44 with respect to the rotor 45. This arrangement improves the versatility of the machine in that it can be adjusted to treat different types of grain as required; the adjustment can take place while the machine is running.
    In addition, a more efficient combined husking and polishing action is accomplished by providing the rotor with a plurality of cam-like abrasive discs 47 spaced apart by a corresponding plurality of spacer rings 79 having a diameter smaller than that of the discs so as to form grain expansion chambers therebetween, whereby an energetic husking action followed by a moderate abrading polishing action are effected along the treatment chamber.

    摘要翻译: 谷粒脱粒机包括由安装在中空旋转轴13上的研磨转子和围绕转子45的筛组件44所限定的谷物处理室50.筛44安装在可动的环形板25上, 机构62-65能够改变筛网组件44相对于转子45的偏心度。这种布置改善了机器的通用性,因为它可以根据需要调节以处理不同类型的颗粒; 调整可以在机器运行时进行。 另外,通过为转子提供多个凸轮状研磨盘47来实现更有效的组合脱壳和抛光动作,所述多个凸轮状研磨盘47被相应的多个间隔环79间隔开,该间隔环79的直径小于圆盘的直径,从而形成 在其间的晶粒膨胀室,由此沿着处理室进行能量脱壳作用,随后进行适度的研磨抛光作用。

    Process of and system for flouring grains
    38.
    发明公开
    Process of and system for flouring grains 失效
    烧烤谷物的过程和系统

    公开(公告)号:EP0339577A3

    公开(公告)日:1990-09-19

    申请号:EP89107477.5

    申请日:1989-04-25

    发明人: Satake, Toshihiko

    IPC分类号: B02C9/04 B02B3/00

    CPC分类号: B02B3/00 B02C9/04

    摘要: a grain flouring system includes a polishing machine for polishing grains, and roll mills and sifters for repeatedly mill and sift the polished grains to provide a flour having a desired mesh size. A moisture adding device is provided for adding moisture to the grains milled in at least one of the roll mills, thereby maintaining the grains in a suitably moistured condition during the milling operation.

    Method and apparatus for the treatment of wheat kernels
    40.
    发明公开
    Method and apparatus for the treatment of wheat kernels 失效
    Verfahren und Apparat zur Behandlung vonWeizenkörnern。

    公开(公告)号:EP0295774A2

    公开(公告)日:1988-12-21

    申请号:EP88303769.9

    申请日:1988-04-27

    发明人: Tkac, Joseph John

    IPC分类号: B02B3/04 B02B3/00

    CPC分类号: B02B3/00 B02B1/08

    摘要: Significant improvements to the milling of wheat kernels are possible by sequentially removing the bran layers of the kernels prior to processing in general accordance with conventional milling principles. The wheat kernels are preprocessed by means of a number of friction and abrasion operations to peel or strip the various layers of bran from the kernels. A series of friction machines (208,215,218) followed by abrasion machines (224,230) progressively remove the bran layers and separate the same into generally pre-identified bran layer mixtures. Up to about 75% of the bran can be removed with the remaining bran being essentially confined to the kernel crease and removed during the conventional milling operation. Such preprocessed kernels, when milled in the conventional manner, have higher yields due to less bran contamination. This selective removal of the bran layers also facilitates low cost production of speciality bran products or selective reintroduction of bran layers to flour after, or during, further milling.

    摘要翻译: 通常可以根据常规的研磨原理在加工之前依次除去籽粒的麸皮层,从而可以显着改善小麦籽粒的研磨。 通过大量摩擦和磨损操作对小麦籽粒进行预处理,以从谷粒剥离或剥离各层的麸皮。 一系列摩擦机(208,215,218),随后是磨耗机(224,230),逐渐去除麸皮层,并将其分离成通常预先确定的麸皮层混合物。 高达约75%的麸皮可以被除去,其余的麸基本上被限制在蕊纹和在常规碾磨操作中被去除。 当以常规方式研磨时,这种预处理的颗粒由于较少的麸皮污染而具有较高的收率。 这种选择性除去麸皮层还有助于特制糠麸产品的低成本生产或在进一步研磨之后或之后选择性地重新引入麸皮面粉。