ELECTRICAL DISTRIBUTION SYSTEM HAVING SPECIALLY FORMED AND INSULATED BUS BARS.
    51.
    发明公开
    ELECTRICAL DISTRIBUTION SYSTEM HAVING SPECIALLY FORMED AND INSULATED BUS BARS. 失效
    与特别设计的和孤立的TRACKS配电系统。

    公开(公告)号:EP0194304A4

    公开(公告)日:1987-01-22

    申请号:EP85904738

    申请日:1985-09-13

    申请人: SQUARE D CO

    发明人: SLICER ALLAN E

    摘要: An electrical distribution system having specially formed and insulated bus bars (40) in back to back, stacked relationship with each other along the length of the busway and spaced apart where tap-off or other connection may be made (34). The bus bars are formed to be interchangeable, to the extent possible, within a busway section (32). For example, in a four bar plug-in section, the two inner bus bars are identically formed and interchangeable by rotating the bars 180o. Similarly, the two outer bus bars are also identically formed and interchangeable. The electrical insulation between bus bars is provided by the use of insulating tubes comprising one layer of varnished glass cloth between two layers of polyethylene therephthalate. Each bar (40) is provided with a hump (54) located for tap-off connection along the length of the busway. The insulating tubes are spaced apart from each other on each bus bar (40) to provide a tap-off contact surface (238) on each hump (54). Each tube is provided with notched out segments (236) which overlie the edge of the bus bar (40) at a transition portion of the hump (54). A hump insulator (240) is placed longitudinally along the length of the bus bar (40) on the top and bottom of the hump (54) between opposing plug-in bases and hump edge insulators (242) are placed on the edges of the plug-in bars in overlying relationship with the respective notched out segments (236) on the tubes.

    High capacitive multilayer conductive bars
    53.
    发明公开
    High capacitive multilayer conductive bars 失效
    多层导电轨高容量。

    公开(公告)号:EP0131265A2

    公开(公告)日:1985-01-16

    申请号:EP84107859.5

    申请日:1984-07-05

    申请人: Mecondor S.p.A.

    发明人: Tosti, Giorgio

    IPC分类号: H02G5/00

    摘要: A method for manufacturing high capacitive multilayer conductive bars is described. It comprises at least two conductive elements (14, 16), one capacitive element (12) between them, and further innerand/orouter dielectric elements (13,113,18,20). The electrical connection between the capacitive element (12) and the conductive element (14, 16) is realized by a solder alloy material (30), preferably in the form of a soldering alloy material.
    The mechanical connection between the outer (18, 20) respectively the inner dielectric elements (13, 113) and the conductive elements (14, 16) is established by a non- conductive bonding material (13'.113', 22, 24). Mechanical as well as electrical connection is made in the same operation step. The multilayer conductive bar has a great reliability. It is used for power and/or signal distribution in electronics, for example printed circuits and other high density components.

    Liaison conductrice destinée au transport d'impulsions de forte puissance et son procédé de fabrication
    54.
    发明公开
    Liaison conductrice destinée au transport d'impulsions de forte puissance et son procédé de fabrication 失效
    导电连接到的脉冲强的性能和它的制造方法的运输。

    公开(公告)号:EP0050547A1

    公开(公告)日:1982-04-28

    申请号:EP81401546.7

    申请日:1981-10-06

    申请人: THOMSON-CSF

    发明人: Chesnel, André

    IPC分类号: H01B7/08 H02G5/00

    CPC分类号: H02G5/005 H01B7/0838

    摘要: Une liaison suivant l'invention comporte un empilement de feuilles conductrices (31) et de feuilles isolantes (21) dont certaines au moins sont de largeur supérieure à celle des feuilles conductrices, les feuilles extérieures (21') de l'empilement étant isolantes. Les bords des feuilles isolantes (21) qui dépassent des feuilles conductrices (31) sont solidarisées les unes aux autres (en 26).
    Un procédé de fabrication d'une liaison selon l'invention comporte les étapes de réaliser un empilement de feuilles conductrices et de feuilles isolantes dont certaines au moins sont de largeur supérieure à celle des feuilles conductrices, les feuilles extérieures de l'empilement étant isolantes, et de solidariser les bords des feuilles isolantes qui dépassent des feuilles conductrices.

    摘要翻译: 雅丁本发明的链路包括导电片材(31)和绝缘片(21)的堆叠,一些其中至少抵制比导电片材,所述叠层是绝缘的的外片(21“)。 绝缘片(21)延伸超过所述导电片材(31)的边缘一体地接合到彼此(在26处)。 一种用于制造雅丁链接到本发明方法包括以下步骤的制造导电板和绝缘片的叠层,一些其中至少抵制比导电片材,所述叠层的外片是绝缘的,并为整体地接合的 延伸超出导电片材的绝缘片的边缘。

    High capacitance multilayer bus bar and method of manufacture thereof
    55.
    发明公开
    High capacitance multilayer bus bar and method of manufacture thereof 失效
    一种多层母线高容量和它们的制备方法。

    公开(公告)号:EP0022968A1

    公开(公告)日:1981-01-28

    申请号:EP80103840.7

    申请日:1980-07-05

    申请人: MEKTRON N.V.

    IPC分类号: H01B7/08 H01G4/38

    摘要: A high capacitance bus bar is presented having at least two separated conductive plates (12, 14) between which a plurality of capacitive ceramic dielectric chips (20) are positioned and adhered. The outer surfaces of the dielectric chips are metalized (22) and have a roughened or coarse finish to provide contact between the dielectric chips (20) and the conductive plates (12, 14), thereby permitting use of nonconductive adhesive (18) to bond the parts of the assembly together.

    SHIELDED BUSBAR
    56.
    发明公开
    SHIELDED BUSBAR 审中-公开

    公开(公告)号:EP4418480A1

    公开(公告)日:2024-08-21

    申请号:EP24158245.1

    申请日:2024-02-16

    IPC分类号: H02G5/06 H02G5/00

    CPC分类号: H02G5/06 H02G5/005

    摘要: Shielded busbar comprising a casing (100) having a duct housing a conductor pack (250) including three or more conductors (200) arranged side by side, wherein each conductor (200) extends along a longitudinal axis and has a rectangular cross-section, thereby each conductor (200) has two primary lateral surfaces (210), which are opposite to each other, and two secondary lateral surfaces (220), which are opposite to each other, wherein each pair of adjacent conductors (200) of the conductor pack (250) are arranged side by side along respective primary lateral surfaces (210), wherein the shielded busbar further comprises two or more shielding elements (300; 400; 500; 600) extending along said longitudinal axis and made of magnetically shielding material, wherein each one of said two or more shielding elements (300; 400; 500; 600) comprises or consists of a primary plate (310; 410; 510; 610) that entirely overlaps a primary lateral surface (210) of one or two of said three or more conductors (200), and wherein not more than one shielding element (300; 400; 500; 600) of said two or more shielding elements (300; 400; 500; 600) has a C-shaped cross-section.

    Busbar for power conversion applications

    公开(公告)号:EP2493043B1

    公开(公告)日:2018-09-12

    申请号:EP12156821.6

    申请日:2012-02-24

    CPC分类号: H02G5/005 H02M7/003

    摘要: A busbar (10) for power conversion applications that includes two planar conductors (20, 30) that have terminal locations (22, 32); a first planar insulator (40) located between the planar conductors (20, 30); two impedances elements (24, 34) that are electrically connected to each of the planar conductors (20, 30), wherein the impedance elements (24, 34) each extend in a plane that is non-coplanar from the planar conductors (20, 30), further wherein the impedance elements (24, 34) are configured so as to defme a gap (50) between them; and a second planar insulator (45) is located in the gap (50). The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.

    REINFORCED LAMINATED MULTI-PHASE BUSBAR AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:EP3336991A1

    公开(公告)日:2018-06-20

    申请号:EP16205023.1

    申请日:2016-12-19

    申请人: ABB Schweiz AG

    IPC分类号: H02G5/00 H05K1/02 H05K3/46

    摘要: A laminated multi-phase busbar (1) for conducting electric energy, comprising a base layer (2) of an electrically insulating material, a first conducting layer (4a) of an electrically conducting material which is arranged on and mechanically connected to said base layer (2), a first intermediate insulating layer (6a) of an electrically insulating material which is arranged on and mechanically connected to said first conducting layer (4a), a second conducting layer (4b) of an electrically conducting material which is arranged on and mechanically connected to said first intermediate layer (6) and a cover layer (8) of an electrically insulating material which is arranged on said second conducting layer (4b), wherein said electrically insulating material of said base layer (2), said first intermediate insulating layer (6a) and said cover layer (8) is a sheet molding compound including a thermosetting resin and reinforcing fibers, and that the material of said first conducting layer (4a) and said second conducting layer (4b) is a sheet metal which is mechanically connected to the first intermediate insulating layer (6a) by said thermally cured thermosetting resin, is characterized in that said first conducting layer (4a) comprises at least one first through-hole (10a) which is filled with thermosetting resin and reinforcing fibers, said thermosetting resin and reinforcing fibers in said first through-hole (10a) forming a material bridge (12a) bonding said base layer (2) to said first intermediate insulating layer (6a).