公开(公告)号：EP1388566A1

公开(公告)日：2004-02-11

申请号：EP02255304.4

申请日：2002-07-30

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Talibuddin, Sapna Halim

IPC: C08K11/00 ,  G02B5/00

CPC classification number: C23C14/20 ,  C08K3/01 ,  C08K3/08 ,  C08K5/0083 ,  C08K2201/013 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L67/02

Abstract: A metallized molded resin article, consisting essentially of from about 80 to about 99.9 weight percent, based on the total weight of the resin composition, of a crystallizable polyester resin derived from aliphatic or cycloaliphatic diols, or mixtures thereof, containing 2 to 10 carbon atoms and at least one aromatic dicarboxylic acid wherein the aromatic group is a C 6 to C 20 aryl radical, and the remaining amount consisting essentially of one or more nucleating agents and less than about 5 % by weight additional ingredients based on the total weight of the resin composition, a portion of the surface of said article being metallized.

Abstract translation: 金属化模制树脂制品，其基本上由基于树脂组合物的总重量的约80至约99.9重量％的衍生自含有2至10个碳原子的脂族或脂环族二醇或其混合物的可结晶聚酯树脂 和至少一种芳族二羧酸，其中芳基为C 6至C 20芳基，其余量基本上由一种或多种成核剂组成，并且基于树脂组合物的总重量小于约5重量％ ，所述制品的表面的一部分被金属化。

公开(公告)号：EP1366111A2

公开(公告)日：2003-12-03

申请号：EP02719706.0

申请日：2002-01-18

Applicant: BASF AKTIENGESELLSCHAFT

Inventor： DANIEL, Thomas ,  RIEGEL, Ulrich ,  WEISMANTEL, Matthias

IPC: C08K3/32 ,  A61L15/60

CPC classification number: C08K3/32 ,  A61L15/18 ,  A61L15/60 ,  C08K2201/013

Abstract: The invention relates to a water-absorbing agent containing particles of a water-absorbing polymer whose surface is associated with a water-insoluble metal phosphate. The agent has an improved characteristics profile with higher absorption capacity, improved liquid transport performance and faster swelling speed.

公开(公告)号：EP1053277A1

公开(公告)日：2000-11-22

申请号：EP99903747.6

申请日：1999-02-12

Applicant: RHODIA CHIMIE

Inventor： DUPUIS, Dominique ,  REEB, Roland

IPC: C08J3/21 ,  A61K7/00

CPC classification number: A61K8/11 ,  A61K8/8117 ,  A61K9/1635 ,  A61K9/501 ,  A61K2800/412 ,  A61Q17/04 ,  C08J3/21 ,  C08K3/22 ,  C08K9/02 ,  C08K2201/013

Abstract: The invention concerns composite particles based on a polymer core and containing an active substance, a coating comprising at least an aluminium, silicon, zirconium and/or a transition metal oxide and/or hydroxide, and an intermediate layer based on an alkaline-earth salt, and the methods for preparing them. The invention also concerns the use of said particles in food, pharmaceutical, cosmetic and phytosanitary products.

公开(公告)号：EP1035160A1

公开(公告)日：2000-09-13

申请号：EP97954964.9

申请日：1997-11-25

Applicant: Bratkova, Ljubov

Inventor： BRATKOVA, Ljubov Robertovna ,  SCHELOKOV, Robert Nikolaevich

IPC: C08K3/00 ,  C08K13/02

CPC classification number: C08K3/34 ,  C08K3/01 ,  C08K2201/013

Abstract: The present invention relates to a material comprising a matrix, apatite and at least one europium complex compound of the general formula Me x m Eu 3 y R n z , wherein mx + 3y = nz , Me m   x = Me m'   x' + Me m''   x'' + ... , R n   z = R n'   z' + R n''   z'' + ... , mx = m'x' + m''x'' + ... , nz = n'z' + n''z'' +... , x≥ 1.0≥ y≥ 0.01.
Me represents yttrium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, dysprosium, holmium, erbium, ytterbium, aluminum, bismuth, tin, titanium, manganese, calcium, barium, zinc, cadmium, sodium, potassium, rubidium, cesium, R represents oxygen, sulfur, fluorine, bromine, phosphorus, boron, vanadium, molybdenum, tungsten, germanium or compounds thereof, m and n represent the charge of a Me or R ion, respectively.
The composition for the production of the material comprises (wt. % ) apatite 0.01-10.0; complex compound, 0.01-10.0, the balance is a matrix-forming agent, such as, a polymer, a fiber, a glass-forming composition, or lacquer/adhesive-forming substance

Abstract translation: 本发明涉及一种材料，其包含基质，磷灰石和至少一种通式为>> Eu> y z​​ z z ium ium ium ium z z z z z z z z z z z = x x x x = = = = = = = = = = = = Me

公开(公告)号：EP1020488A2

公开(公告)日：2000-07-19

申请号：EP00100909.1

申请日：2000-01-18

Applicant: Kabushiki Kaisha Toshiba ,  JSR Corporation

Inventor： Yano, Hiroyuki, c/o Kabushiki Kaisha Toshiba ,  Minamihaba, Gaku, c/o Kabushiki Kaisha Toshiba ,  Matsui, Yukiteru, c/o Kabushiki Kaisha Toshiba ,  Okumura, Katsuya, c/o Kabushiki Kaisha Toshiba ,  Motonari, Masayuki, c/o JSR Corporation ,  Hattori, Masayuki, c/o JSR Corporation ,  Iio, Akira, c/o JSR Corporation

IPC: C08J3/205 ,  C08G83/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/02

CPC classification number: C09K3/1463 ,  C08G83/001 ,  C08J3/128 ,  C08K3/36 ,  C08K5/057 ,  C08K2201/013 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/31053 ,  H01L21/3212

Abstract: The present invention provides composite particles with sufficient strength and hardness and excellent heat resistance, a production process thereof, an aqueous dispersion containing the composite particles, a CMP slurry which is suitable for manufacture of semiconductor devices, and a process for manufacture of semiconductor devices that employs it. The composite particles are prepared by bonding a silane coupling agent and the like, to divinylbenzene polymer particles and then reacting a specific metal alkoxide, colloidal metal oxide and colloidal silica therewith to form a metal compound section and the like, consisting of a metalloxane bond-containing section or metal oxide particle section on at least one of the interior and surface of the polymer particles. The metal compound section, and the like. can also be formed without using a silane coupling agent. The metalloxane bond-containing section, metal oxide particle section and the like, are preferably bonded by chemical bonding and/or non-chemical bonding to the polymer particles via a silane coupling agent and the like, or directly, but they may also be sequestered without bonding. CMP slurries containing these particles can be advantageously utilized for manufacture of various semiconductor devices, and particularly for polishing of wafer surfaces.

公开(公告)号：EP0823450A4

公开(公告)日：1999-05-19

申请号：EP96912235

申请日：1996-04-25

Applicant: MITSUBISHI RAYON CO

Inventor： WATANABE HIROYUKI ,  IGE HITOSHI ,  YANAGASE AKIRA

IPC: B29B9/16 ,  C08J3/215 ,  C08K3/36 ,  C08J3/16 ,  B29B11/14

CPC classification number: C08J3/215 ,  B29B9/16 ,  B29K2105/16 ,  C08K3/36 ,  C08K2201/013

Abstract: A composite material having a structure in which negatively charged colloidal silica having an average particle diameter of not greater than 50 nm and remaining substantially in the form of primary particles is attached to the outer surfaces of negatively charged polymer particles. By using this composite material, there can be obtained molded articles wherein colloidal silica is dispersed in a resin while remaining substantially in the form of primary particles.