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132 条记录 (耗时 0.011 秒)

    Cool melt glue
    71.
    发明公开
    Cool melt glue 失效
    冷凝胶

    公开(公告)号：EP0353048A3

    公开(公告)日：1991-11-06

    申请号：EP89307601.8

    申请日：1989-07-26

    申请人： ADHESIVE TECHNOLOGIES, INC.

    发明人： Ornsteen, Robert L. ,  Melendy, Peter S. ,  Fitzmeyer, Dennis J.

    IPC分类号： C09J123/04

    CPC分类号： C09J123/04 ,  C08L2666/02 ,  C09J123/08

    摘要： Hot melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280° F. and preferably at temperatures of at most 250°F. The adhesive compositions have a heat resistance of at least 125°F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.

    Cool melt glue
    72.
    发明公开
    Cool melt glue 失效
    北制冰箱温泉安东贝尔Heissschmelzklebstoff。

    公开(公告)号：EP0353048A2

    公开(公告)日：1990-01-31

    申请号：EP89307601.8

    申请日：1989-07-26

    申请人： ADHESIVE TECHNOLOGIES, INC.

    发明人： Ornsteen, Robert L. ,  Melendy, Peter S. ,  Fitzmeyer, Dennis J.

    IPC分类号： C09J123/04

    CPC分类号： C09J123/04 ,  C08L2666/02 ,  C09J123/08

    摘要： Hot melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280° F. and preferably at temperatures of at most 250°F. The adhesive compositions have a heat resistance of at least 125°F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.

    摘要翻译： 用于胶罐和胶枪应用的热熔粘合剂被配制成使其可以在不高于280°F，优选在至多250°F的温度下使用。粘合剂组合物具有热 电阻至少为125°F，并且易于成型为胶棒，用于胶枪。 用于热熔粘合剂组合物的粘合剂适合与增粘树脂和/或蜡复合。 所得到的组合物具有尖锐的粘度分布，其易于实现，例如通过使用高熔体指数粘合剂聚合物作为必需组分。

    Hot melt adhesive that has good open time at room temperature and can form cree-resistant bonds
    73.
    发明公开
    Hot melt adhesive that has good open time at room temperature and can form cree-resistant bonds 失效
    Bei Zimmertemperatur kriechfester Schmelzklebstoff mit ausreichender Versieglungszeit。

    公开(公告)号：EP0340990A2

    公开(公告)日：1989-11-08

    申请号：EP89304326.5

    申请日：1989-04-28

    申请人： MINNESOTA MINING AND MANUFACTURING COMPANY

    发明人： Hansen, Dennis D. c/o Minnesota Mining and

    IPC分类号： C09J123/04 ,  C08L23/08 ,  C08L57/02

    CPC分类号： C09J9/005 ,  C08L2666/02 ,  C09J123/08 ,  Y10T428/264 ,  Y10T428/2852

    摘要： A hot-melt adhesive of ethylene/vinyl acetate copolymer and tackifying resin can be spread into a thin layer that remains tacky for more than 5 seconds, after which a bond can be made without applying heat or more than hand pressure. Within a short period of time, the adhesive crystallizes so that the bond becomes creep-resistant. The temperature at which this hot-melt adhesive can be spread into thin layers is significantly lower than could be used with prior hot-melt adhesives that develop creep resistance.

    摘要翻译： 可以将乙烯/乙酸乙烯酯共聚物和增粘树脂的热熔粘合剂铺展成保持粘性超过5秒的薄层，然后可以在不施加热量或超过手压的情况下进行粘合。 在短时间内，粘合剂结晶，使得粘结变得抗蠕变。 该热熔粘合剂可以扩散到薄层中的温度显着低于可以用于产生抗蠕变性的现有热熔粘合剂使用的温度。