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公开(公告)号：EP2872552A4
公开(公告)日：2016-03-09
申请号：EP13816902
申请日：2013-07-10
IPC分类号： C08J9/32 , B01J4/00 , B29C44/34 , C08J3/18 , C08J3/20 , C08J9/00 , C08K7/22 , C08L91/00 , C08L91/06 , C09J201/00
CPC分类号： C08J9/32 , B01J4/002 , B01J2204/002 , B01J2204/007 , B29C44/3446 , C08J3/18 , C08J3/201 , C08J2203/22 , C08J2300/00 , C08J2333/20 , C08K7/22 , C08L91/00 , C08L91/06 , C09J9/00 , C09J201/00 , C09J2201/61
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公开(公告)号：EP1720793A1
公开(公告)日：2006-11-15
申请号：EP05712784.7
申请日：2005-02-07
发明人： RICHARD, A., Belanger, Adhesive Technologies, INC. , MELENDY, Peter S., Adhesive Technologies, Inc
IPC分类号： B67D5/63
CPC分类号： B05C17/0116 , B05C17/00523 , B05C17/01
摘要： A dispenser for a fluid material includes a handle portion and a cartridge having the material to be dispensed. The cartridge is easily mounted to the handle portion or removed, whereby the handle portion may be used with a variety of cartridges, each of which may contain a selected material. The handle portion includes a plunger that is moved linearly by actuation of a trigger mechanism, which is engaged by a user's finger. The trigger mechanism is configured to release pressure applied to the plunger quickly upon release of pressure on the trigger and to allow the plunger to move away from the cartridge to ensure release of pressure in the material to be dispensed to prevent dripping.
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公开(公告)号：EP3895811A1
公开(公告)日：2021-10-20
申请号：EP21162511.6
申请日：2021-03-15
发明人： Belanger, Richard A.
IPC分类号： B05C17/005 , B05C17/01
摘要： A hand-held hot melt glue gun having a melt chamber 8, a needle 12 and a nozzle 14 that is movable with respect to the needle to open or close a discharge port 26 in fluid communication with the melt chamber 8. A spring closure 30 urges the needle 12 and nozzle 14 toward relative positions to close the discharge port 26. An opening element 34 moves the nozzle 14 with respect to the needle 12 to open the discharge port 26, and a trigger mechanism 40, 50, 52 is provided for advancing solid glue 6 into the melt chamber 8 and for operating the opening element 34. A time delay mechanism 53, 56 provides a time delay between the opening of the discharge port 26 and advancement of glue 6 into the melt chamber 8.
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公开(公告)号：EP2872552A2
公开(公告)日：2015-05-20
申请号：EP13816902.4
申请日：2013-07-10
CPC分类号： C08J9/32 , B01J4/002 , B01J2204/002 , B01J2204/007 , B29C44/3446 , C08J3/18 , C08J3/201 , C08J2203/22 , C08J2300/00 , C08J2333/20 , C08K7/22 , C08L91/00 , C08L91/06 , C09J9/00 , C09J201/00 , C09J2201/61
摘要： A system for applying a melted polymer/hot melt adhesive includes structure for adding one or more components to the polymer/hot melt stream at selected locations of the stream depending on the desired final characteristics of the polymer/hot melt adhesive, the heat histories of the polymer/hot melt adhesive and the modifying component, and the physical or chemical characteristics of the modifying component. The modifying component can be supplied in a fluid carrier.
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公开(公告)号：EP1720793A4
公开(公告)日：2009-03-04
申请号：EP05712784
申请日：2005-02-07
IPC分类号： B67D7/80 , B05C17/005 , B05C17/01 , B67D7/60 , B67D7/82
CPC分类号： B05C17/0116 , B05C17/00523 , B05C17/01
摘要： A dispenser for a fluid material includes a handle portion and a cartridge having the material to be dispensed. The cartridge is easily mounted to the handle portion or removed, whereby the handle portion may be used with a variety of cartridges, each of which may contain a selected material. The handle portion includes a plunger that is moved linearly by actuation of a trigger mechanism, which is engaged by a user's finger. The trigger mechanism is configured to release pressure applied to the plunger quickly upon release of pressure on the trigger and to allow the plunger to move away from the cartridge to ensure release of pressure in the material to be dispensed to prevent dripping.
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公开(公告)号：EP0353048A3
公开(公告)日：1991-11-06
申请号：EP89307601.8
申请日：1989-07-26
IPC分类号： C09J123/04
CPC分类号： C09J123/04 , C08L2666/02 , C09J123/08
摘要： Hot melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280° F. and preferably at temperatures of at most 250°F. The adhesive compositions have a heat resistance of at least 125°F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.
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公开(公告)号：EP0353048A2
公开(公告)日：1990-01-31
申请号：EP89307601.8
申请日：1989-07-26
IPC分类号： C09J123/04
CPC分类号： C09J123/04 , C08L2666/02 , C09J123/08
摘要： Hot melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280° F. and preferably at temperatures of at most 250°F. The adhesive compositions have a heat resistance of at least 125°F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.
摘要翻译： 用于胶罐和胶枪应用的热熔粘合剂被配制成使其可以在不高于280°F，优选在至多250°F的温度下使用。粘合剂组合物具有热 电阻至少为125°F，并且易于成型为胶棒，用于胶枪。 用于热熔粘合剂组合物的粘合剂适合与增粘树脂和/或蜡复合。 所得到的组合物具有尖锐的粘度分布，其易于实现，例如通过使用高熔体指数粘合剂聚合物作为必需组分。
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