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公开(公告)号:EP3257888B1
公开(公告)日:2019-09-04
申请号:EP16749466.5
申请日:2016-02-11
发明人: YANG, Jong Won , JUNG, Hak Gee
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72.
公开(公告)号:EP3530700A1
公开(公告)日:2019-08-28
申请号:EP18157924.4
申请日:2018-02-21
IPC分类号: C08L79/08
摘要: A polymer blend including 5 to 95 weight percent of a poly(ester-carbonate-carbonate) comprising 40 to 95 mole percent of ester units comprising low heat bisphenol groups and high heat bisphenol groups, wherein the ester units comprise 20 to 80 mole percent of the low heat bisphenol groups and 20 to 80 mole percent of the high heat bisphenol groups, based on the total moles of ester units in the poly(ester-carbonate-carbonate), and 5 to 60 mole percent of carbonate units comprising the low heat bisphenol groups and the high heat bisphenol groups, wherein the carbonate units comprise 20 to 80 mole percent of the low heat bisphenol groups and 20 to 80 mole percent of the high heat bisphenol groups, based on the total moles of carbonate units in the poly(ester-carbonate-carbonate); and 5 to 95 weight percent of a poly(etherimide), wherein the weight percent of each polymer is based on the total weight of the polymers in the blend, and a molded 0.125-inch thick ASTM tensile bar comprising the polymer blend has a haze value of less than 25% as determined according to ASTM D1003 using the color space CIE1931 (Illuminant C and a 2° observer).
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公开(公告)号:EP3368607B1
公开(公告)日:2019-08-14
申请号:EP16794463.6
申请日:2016-10-19
发明人: CHAKRAVARTI, Shreyas , YANG, Yuzhen , ZHOU, Hao
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74.
公开(公告)号:EP3514869A1
公开(公告)日:2019-07-24
申请号:EP18849275.5
申请日:2018-08-06
申请人: UBE Industries, Ltd.
摘要: The present invention relates to a binder resin for electrodes consisting of a polyimide-based resin having a melting point of 300°C or lower. The present invention also relates to an electrode mixture paste comprising the binder resin for electrodes, an electrode active material, and a solvent; and an electrode comprising an electrode mixture layer comprising the binder resin for electrodes and an electrode active material; and a method for producing the electrode.
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公开(公告)号:EP3489284A1
公开(公告)日:2019-05-29
申请号:EP17831042.1
申请日:2017-07-19
发明人: DAITO, Aoi , SEKIGUCHI, Shinji
摘要: A method for producing a polyimide resin film, including: a coating step of forming a coated film by coating a polyimide resin composition containing a polyimide resin, an antioxidant, and a solvent on a substrate; and a drying step of drying the coated film in air at 180°C or more, the antioxidant being a phenol-based antioxidant, and a content of the phenol-based antioxidant being 0.05 part by mass or more per 100 parts by mass of the polyimide resin.
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76.
公开(公告)号:EP3262117B1
公开(公告)日:2019-05-08
申请号:EP16708866.5
申请日:2016-02-22
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77.
公开(公告)号:EP3184573B1
公开(公告)日:2019-04-24
申请号:EP17156189.7
申请日:2014-10-03
IPC分类号: C08G63/685 , C08J5/18 , C08G73/16 , C08L79/08 , D01F6/84 , C09D179/08
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公开(公告)号:EP3467041A1
公开(公告)日:2019-04-10
申请号:EP17806906.8
申请日:2017-05-16
申请人: LG Chem, Ltd.
发明人: YUN, Cheolmin , SUH, Jun Sik , KIM, Kyungjun
摘要: The present invention provides a polyamidimide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamidimide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPC), tapes, touch panels and protective films for optical disks.
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公开(公告)号:EP3464424A1
公开(公告)日:2019-04-10
申请号:EP17810800.7
申请日:2017-06-05
申请人: Cymer-Dayton, LLC
IPC分类号: C08G73/14 , C08L79/08 , C09D7/00 , C09D179/08
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公开(公告)号:EP3457813A1
公开(公告)日:2019-03-20
申请号:EP18180308.1
申请日:2009-04-21
摘要: The present invention provides an integrated thick film heating element on a substrate made from high temperature melt-flowable thermoplastic polymer/powder additive formulations which form an electrically insulating thermoplastic dielectric coating on the substrate, and electrically resistive lead free films and electrically conductive film formulations that are deposited and fired to form an integrated thick film heating element on a substrate at a processing temperature well below 600°C. This thick film heating element is formed on a substrate material coated first with the electrically insulating, filled melt flowable high temperature thermoplastic polymer/powder composite layer on which is deposited the electrically resistive lead free thick film that is capable of operating over a wide range of power densities for consumer and industrial heating element applications, with suitable electrical insulation properties under temperature cycling to for example 250°C.
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