-
公开(公告)号：EP4386208A1
公开(公告)日：2024-06-19
申请号：EP22855895.3
申请日：2022-08-10
申请人： NTN Corporation
发明人： YASUDA, Ken
摘要： To provide a piston ring that has low content of a sulfur atom, eliminates the need for a special exposing device and a strict safety measure, and is low in cost. A piston ring 1 is used in a reciprocating compressor that compresses gas and is formed of a resin composition containing at least polyetheretherketone resin or thermoplastic polyimide resin as a main component. The resin composition contains carbon material in which the content of a sulfur atom is 200 ppm or less. The carbon material is at least one of carbon fiber, graphite, and coke powder. The resin composition contains total 5-35 vol% of the carbon material relative to the whole of the resin composition.
-
公开(公告)号：EP3514194B1
公开(公告)日：2024-03-20
申请号：EP17850980.8
申请日：2017-09-14
发明人： OHTOMO Shinji , SHODA Yoshio
-
公开(公告)号：EP4324874A1
公开(公告)日：2024-02-21
申请号：EP22787931.9
申请日：2022-03-16
发明人： YAMANISHI Keisuke
摘要： A resin composition comprises a polyether ether ketone, an aromatic polysulfone, a polyetherimide, and a fibrous filler.
-
公开(公告)号：EP4215568A1
公开(公告)日：2023-07-26
申请号：EP21875441.4
申请日：2021-09-24
摘要： Provided is a composition for three-dimensional printing capable of producing a three-dimensionally printed article having excellent mechanical strength, as well as excellent flexibility and excellent toughness. The composition for three-dimensional printing contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The composition satisfies a ratio r2/r1 of 1.60 or lower, wherein r1 represents an average dispersed particle size of the fluorine-containing copolymer (II) and r2 represents an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380°C and a load of 5000 g with 5-minute pre-heating in conformity with ASTM D1238.
-
5.发明公开
公开(公告)号：EP4194487A1
公开(公告)日：2023-06-14
申请号：EP21852926.1
申请日：2021-07-30
摘要： Provided are a film having excellent flexibility, excellent bending resistance, and excellently low dielectricity while maintaining the properties of the aromatic polyetherketone resin (I), as well as a wrapping electric wire coating material, a film for a flexible printed circuit board, and a laminate each including the former film. The film contains a resin composition containing an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II). The fluorine-containing copolymer (II) defines a dispersed phase at an average dispersed particle size of 5 um or smaller. The aromatic polyetherketone resin (I) has a crystallinity of lower than 6%.
-
公开(公告)号：EP3728401B1
公开(公告)日：2022-02-09
申请号：EP18822085.9
申请日：2018-12-20
-
7.发明公开
公开(公告)号：EP3904457A1
公开(公告)日：2021-11-03
申请号：EP19904058.5
申请日：2019-12-23
发明人： MUKUDAI, Jun , ANDOH, Hideki , TAKAHASHI, Hiroyuki
摘要： Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass% and a proportion of the polyamide resin (B) is 10 to 50 mass% relative to a total amount of 100 mass% of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1) which is calculated from a tensile modulus (M) at 80°C relative to a tensile modulus (Mo) at 23°C is 50% or more, with the dumbbell test piece being obtained by subjecting the thermoplastic resin composition to injection molding, and a molded article manufactured therefrom is also provided. Tensile modulus retention rate % = M tensile modulus MPa at 80 ° C / Mo tensile modulus MPa at 23 ° C × 100 .
-
8.发明公开
公开(公告)号：EP3805293A1
公开(公告)日：2021-04-14
申请号：EP19811496.9
申请日：2019-05-31
IPC分类号： C08G73/00 , B32B15/082 , B32B25/14 , B32B27/04 , B32B27/30 , C08J5/24 , C08K3/013 , C08K5/315 , C08K5/3415 , C08L25/04 , C08L53/02 , C08L71/10 , C08L79/00 , H05K1/03
摘要： Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).
-
公开(公告)号：EP3447081B1
公开(公告)日：2021-03-31
申请号：EP17785803.2
申请日：2017-04-05
-
-
-
-
-
-
-
-
-
搜索结果
265 条记录 (耗时 0.031 秒)
