公开(公告)号：EP2494084A1

公开(公告)日：2012-09-05

申请号：EP10826043.1

申请日：2010-10-14

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHANG, Faliang ,  JIAN, Yongxi

IPC: C22C45/10 ,  C22C1/02

CPC classification number: C22C45/10 ,  B22D27/003 ,  B22D27/15 ,  C22C1/002 ,  C22C1/02 ,  C22C16/00

Abstract: Alloys and methods for preparing the same are provided. The alloys are represented by the general formula of ZraAlbCucNid)100-e-fYeMf, wherein a, b, c, and d are atomic fractions, in which: 0.472≦̸a≦̸0.568; 0.09≦̸b≦̸0.11; 0.27≦̸c≦̸0.33; 0.072≦̸d≦̸0.088; the sum of a, b, c, and d equals 1; e and f are atomic numbers of elements Y and M respectively, in which 0≦̸e≦̸5 and 0.01≦̸f≦̸5; and M is selected from the group consisting of Nb, Ta, Sc, and combinations thereof.

Abstract translation: 提供了合金及其制备方法。 所述合金由通式Z a Al b Cu c N e d）100 -e-f Y e M f表示，其中a，b，c和d是原子分数，其中：0.472＆nE; a 1E 1; 0.568; 0.09＆NLE; B＆NLE; 0.11; 0.27＆NLE; C＆NLE; 0.33; 0.072＆NLE; d＆NLE; 0.088; a，b，c和d的和等于1; e和f分别是元素Y和M的原子序数，其中0和nEE和nEE分别为5和0.01 nEE; M选自Nb，Ta，Sc及其组合。

公开(公告)号：EP2035602B1

公开(公告)日：2012-03-21

申请号：EP07721283.5

申请日：2007-05-28

Applicant: Byd Company Limited

Inventor： CHEN, Liang ,  GONG, Qing ,  YI, Yunbo ,  LIU, Fang

IPC: C25D5/10 ,  C25D15/02 ,  C23C18/16 ,  C25D5/12

CPC classification number: C25D5/10 ,  C25D5/12 ,  C25D15/02 ,  Y10T428/12903

Abstract: Disclosed is an electroplated product, comprising a base material and an electroplated metal layer including a copper layer on the surface of the base material, wherein the electroplated metal layer further includes a nickel substitute metal layer on the copper layer and the nickel substitute metal is Cu-Sn alloy, Ru, Rh, Pd, or an alloy composed of 2, 3, or 4 elements selected from Ru, Rh, Pd, and Co. A method for preparing the same is also disclosed. The metal electroplated layer of said electroplated product is free of nickel, and therefore will not cause nickel irritation on skin. Furthermore, the electroplated layer also has the advantages of nickel coating, including good smoothness, brightness, wearing resistance, corrosion resistance, and thermal shock resistance, etc.

公开(公告)号：EP2379772A1

公开(公告)日：2011-10-26

申请号：EP10827682.5

申请日：2010-04-22

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Liang ,  MIAO, Weifeng ,  ZHANG, Xiong

IPC: C23C18/54 ,  C23C18/20 ,  C23C18/31

CPC classification number: C23C18/1608 ,  B01J23/80 ,  B01J37/0201 ,  B01J37/34 ,  B01J37/349 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/182 ,  C23C18/204 ,  C23C18/36 ,  C23C18/405 ,  Y10T428/12569

Abstract: Disclosed is a method for metallizing a plastic surface. The method may comprise the steps: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, disclosed are a method for preparing a plastic article and a plastic article as manufactured by the method as described.

公开(公告)号：EP2089776A1

公开(公告)日：2009-08-19

申请号：EP07846027.6

申请日：2007-12-05

Applicant: Byd Company Limited

Inventor： WU, Bo ,  JIN, Qiming ,  GONG, Qing

IPC: G03H1/22 ,  B44C1/175

CPC classification number: G03H1/028 ,  B44C1/175 ,  G03H1/0248 ,  G03H1/18 ,  G03H1/182 ,  G03H2001/0296 ,  G03H2250/12 ,  G03H2250/36 ,  G03H2270/21

Abstract: A method for forming an embossed holographic pattern comprises the following steps: A. recording the required pattern onto a photo-sensitive plate by means of laser holography to produce an optical mask plate for the holographic pattern; B. duplicating the laser holographic information on the optical mask plate onto a metal plate, to produce a metal plate for the holographic pattern; C. transferring the laser holographic pattern on the metal plate onto an information layer on a water soluble film, to form an embossed holographic water transfer printing film; D. carrying out a cubic water transfer printing on the surface of a base material by using the embossed holographic water transfer printing film, to form the holographic pattern on the surface of the base material. With the method for forming the embossed holographic pattern according to the present invention, a holographic pattern can be formed on the surface of work-piece having a complex shape.

公开(公告)号：EP2035602A1

公开(公告)日：2009-03-18

申请号：EP07721283.5

申请日：2007-05-28

Applicant: Byd Company Limited

Inventor： CHEN, Liang ,  GONG, Qing ,  YI, Yunbo ,  LIU, Fang

IPC: C25D5/10 ,  C25D5/54 ,  C25D15/02

CPC classification number: C25D5/10 ,  C25D5/12 ,  C25D15/02 ,  Y10T428/12903

Abstract: Disclosed is an electroplated product, comprising a base material and an electroplated metal layer including a copper layer on the surface of the base material, wherein the electroplated metal layer further includes a nickel substitute metal layer on the copper layer and the nickel substitute metal is Cu-Sn alloy, Ru, Rh, Pd, or an alloy composed of 2, 3, or 4 elements selected from Ru, Rh, Pd, and Co. A method for preparing the same is also disclosed. The metal electroplated layer of said electroplated product is free of nickel, and therefore will not cause nickel irritation on skin. Furthermore, the electroplated layer also has the advantages of nickel coating, including good smoothness, brightness, wearing resistance, corrosion resistance, and thermal shock resistance, etc.