TREATMENT FOR ELECTROPLATING RACKS TO AVOID RACK METALLIZATION
    7.
    发明公开
    TREATMENT FOR ELECTROPLATING RACKS TO AVOID RACK METALLIZATION 审中-公开
    电镀支架防止支架金属化的处理

    公开(公告)号:EP3186416A1

    公开(公告)日:2017-07-05

    申请号:EP15830311.5

    申请日:2015-08-04

    IPC分类号: C25D5/54 C25D5/56 C25D17/08

    摘要: A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

    摘要翻译: 一种在电镀过程中涂覆用于支撑非导电基板的电镀机架的方法。 所述方法包括以下步骤:使电镀架的至少一部分与塑料溶胶组合物接触,所述塑料溶胶组合物中分散有有效量的具有以下结构的添加剂:其中R,R',R“和R”'是 相同或独立地选自苄基,取代的苄基,苯基或取代的苯基; 或其中R,R',R“和R”'相同或独立地选自C 1 -C 10烷基(直链或支链),苄基,取代的苄基,苯基或取代的苯基,M是二价金属 阳离子,优选选自镍,铜和锌; 并将其上具有增塑溶胶组合物的电镀架加热到合适的温度并持续足够的时间以固化塑料溶胶并在电镀架上形成固体绝缘涂层。 涂覆的电镀架然后可以用于安装不导电的基板用于随后的金属化步骤。