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2666 条记录 (耗时 0.022 秒)

    TIME-INTERLEAVED ANALOG-TO-DIGITAL CONVERTER DEVICE AND ASSOCIATED CONTROL METHOD
    82.
    发明公开
    TIME-INTERLEAVED ANALOG-TO-DIGITAL CONVERTER DEVICE AND ASSOCIATED CONTROL METHOD 审中-公开

    公开(公告)号：EP3734841A1

    公开(公告)日：2020-11-04

    申请号：EP20169931.1

    申请日：2020-04-16

    申请人： MediaTek Inc.

    发明人： WU, Su-Hao ,  WENG, Chan-Hsiang

    IPC分类号： H03M1/06 ,  H03M1/12

    摘要： The present invention provides a time-interleaved analog-to-digital converter device, wherein the time-interleaved analog-to-digital converter device includes a random number generator, a plurality of ADCs and an output circuit. The random number generator is configured to generate a random number sequence. The plurality of ADCs are configured to receive an analog input signal to generate a plurality of digital signals, respectively, and each ADC is further configured to generate a selection signal according to the random number sequence. The output circuit is configured to select one of the digital signals according to the selection signals generated by the ADCs, to generate a digital output signal.

    LOW-NOISE DIFFERENTIAL TO SINGLE-ENDED CONVERTER
    85.
    发明公开
    LOW-NOISE DIFFERENTIAL TO SINGLE-ENDED CONVERTER 审中-公开

    公开(公告)号：EP3713084A1

    公开(公告)日：2020-09-23

    申请号：EP20162713.0

    申请日：2020-03-12

    申请人： MediaTek Inc.

    发明人： LEE, Fong-Wen ,  LIN, Yu-Hsin

    IPC分类号： H03F3/45 ,  H03F1/26 ,  H03F1/32 ,  H03F1/34

    摘要： The present invention provides a differential to single-ended converter including a first input node, a second input node, an operational amplifier (110) and a feedback circuit (120). The operational amplifier has a first terminal and a second terminal, wherein the first terminal of the operational amplifier (110) receives a first signal from the first input terminal, and the second terminal of the operational amplifier (110) receives a second signal from the second input terminal. The feedback circuit (120) is configured to receive an output signal of the operational amplifier (110) and generate a first feedback signal to the first terminal of the operational amplifier (110) to reduce a swing of the first signal, and generate a second feedback signal to the second terminal of the operational amplifier (110) to balance noises induced by the feedback circuit (120) and inputted to the first terminal and the second terminal.

    SEMICONDUCTOR PACKAGE STRUCTURE
    88.
    发明公开
    SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开

    公开(公告)号：EP3709344A1

    公开(公告)日：2020-09-16

    申请号：EP20162559.7

    申请日：2020-03-12

    申请人： MediaTek Inc.

    发明人： LIN, Tzu-Hung ,  LIU, Yuan-Chin

    IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L23/66

    摘要： A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.

    METHOD FOR ASSEMBLING A SENSOR
    89.
    发明公开
    METHOD FOR ASSEMBLING A SENSOR 审中-公开

    公开(公告)号：EP3708966A1

    公开(公告)日：2020-09-16

    申请号：EP20167042.9

    申请日：2017-02-22

    申请人： MediaTek Inc.

    发明人： Muratov, Vladimr A. ,  Shiu, Da-shan

    IPC分类号： G01D5/20 ,  G01B7/00

    摘要： A sensor includes a ferromagnetic shield, at least one sensor coil disposed around an exterior of the ferromagnetic shield, and an electronics module within the ferromagnetic shield. The electronics module is configured to determine the position and/or orientation of the sensor based at least in part on a measurement of a signal induced in the at least one sensor coil.