公开(公告)号：EP1183109A1

公开(公告)日：2002-03-06

申请号：EP00930611.9

申请日：2000-05-11

申请人： Muhr-Sweeney, Audrey

发明人： Muhr-Sweeney, Audrey

IPC分类号： B08B7/00

CPC分类号： B32B7/12 ,  B08B1/00 ,  B08B7/0028 ,  B32B3/02 ,  B32B7/045 ,  B32B27/06 ,  B32B2432/00 ,  B41J29/17 ,  G03G15/65 ,  G03G2215/00531 ,  G06K7/0013 ,  G06K13/0893 ,  G11B5/41 ,  G11B23/0327 ,  G11B23/049 ,  G11B23/50 ,  H04N1/00 ,  H04N1/00127 ,  H04N1/00909 ,  Y10T428/1495 ,  Y10T428/28 ,  Y10T428/2848

摘要： A cleaning apparatus (10) and method for cleaning and decontaminating the internal working components of electronic equipment includes a base material (12) having first (13) and second (15) surfaces. The apparatus also includes a cleaning substrate (14) disposed on the first surface and an adhesive substrate (16) disposed on one of the first and second surfaces. The method includes inserting the cleaning apparatus (10) into the electronic equipment along a predetermined path (A) and moving the base material (12) through the predetermined path such that the cleaning substrate (14) cleans and polishes at least one internal working component (50a, 50b, 60a, 60b, 75) and the adhesive substrate decontaminates at least one working component.

公开(公告)号：EP1183109A4

公开(公告)日：2005-06-01

申请号：EP00930611

申请日：2000-05-11

申请人： MUHR-SWEENEY AUDREY

发明人： MUHR-SWEENEY AUDREY

IPC分类号： B08B1/00 ,  B08B7/00 ,  B32B7/12 ,  B32B27/06 ,  G03G15/00 ,  G06K7/00 ,  G11B5/41 ,  G11B23/03 ,  G11B23/04 ,  G11B23/50 ,  H04N1/00

CPC分类号： B32B7/12 ,  B08B1/00 ,  B08B7/0028 ,  B32B3/02 ,  B32B7/045 ,  B32B27/06 ,  B32B2432/00 ,  B41J29/17 ,  G03G15/65 ,  G03G2215/00531 ,  G06K7/0013 ,  G06K13/0893 ,  G11B5/41 ,  G11B23/0327 ,  G11B23/049 ,  G11B23/50 ,  H04N1/00 ,  H04N1/00127 ,  H04N1/00909 ,  Y10T428/1495 ,  Y10T428/28 ,  Y10T428/2848

摘要： A cleaning apparatus (10) and method for cleaning and decontaminating the internal working components of electronic equipment includes a base material (12) having first (13) and second (15) surfaces. The apparatus also includes a cleaning substrate (14) disposed on the first surface and an adhesive substrate (16) disposed on one of the first and second surfaces. The method includes inserting the cleaning apparatus (10) into the electronic equipment along a predetermined path (A) and moving the base material (12) through the predetermined path such that the cleaning substrate (14) cleans and polishes at least one internal working component (50a, 50b, 60a, 60b, 75) and the adhesive substrate decontaminates at least one working component.