OPTICAL SYSTEM FOR HIGH-SPEED THREE-DIMENSIONAL IMAGING
    6.
    发明公开
    OPTICAL SYSTEM FOR HIGH-SPEED THREE-DIMENSIONAL IMAGING 审中-公开
    用于高速三维成像的光学系统

    公开(公告)号:EP3273285A1

    公开(公告)日:2018-01-24

    申请号:EP15885016.4

    申请日:2015-03-18

    IPC分类号: G02B21/00

    摘要: The present invention discloses an optical system for detecting a sample include a light source, one beam shaper, at least one lens, an image detecting module wherein the light source, one beam shaper, at least one lens are sequentially configured along a light path, wherein one beam shaper moves the focus along the light path back and forth so the light focused on the sample by the light source through one lens is focused onto different depths inside the sample, wherein the light source and the sample are placed at both sides of at least one lens. The image detection module is configured on a light path, and the sample is placed between at least one lens and the image detection module to capture images of different depths inside the sample.

    摘要翻译: 本发明公开了一种用于检测样本的光学系统,包括光源,一个光束整形器,至少一个透镜,图像检测模块,其中光源,一个光束整形器,至少一个透镜沿光路顺序配置, 其中一个光束整形器使所述焦点沿所述光路来回移动,使得所述光源通过一个透镜聚焦在所述样本上的光被聚焦到所述样本内部的不同深度处,其中所述光源和所述样本被放置在所述样本的两侧 至少有一个镜头。 图像检测模块被配置在光路上,并且样品被放置在至少一个透镜和图像检测模块之间以捕获样品内部的不同深度的图像。

    NON-PLANAR CHIP ASSEMBLY
    7.
    发明公开
    NON-PLANAR CHIP ASSEMBLY 审中-公开
    非平面芯片组装

    公开(公告)号:EP2705536A1

    公开(公告)日:2014-03-12

    申请号:EP11865237.9

    申请日:2011-12-08

    发明人: FAN, Long-Sheng

    IPC分类号: H01L29/06 H01L29/04 A61F2/14

    摘要: Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation. A non-planner integrated circuit device comprising a flexible structure and at least one fixture structure bonded to the flexible structure is also described. The flexible structure may be curved in a desired deformation. A plurality of contact areas may be included in the flexible structure. Circuitry may be embedded within the flexible structure to perform processing operations.

    摘要翻译: 描述了用于组装基于弯曲芯片的非平面装置的方法和设备。 槽可以被形成为芯片中的纵向开口以减少弯曲应力以增加芯片的容许变形程度。 芯片可以通过狭槽在允许的变形程度内变形到期望的变形。 可以在芯片的至少一部分上提供保持约束,以允许芯片根据期望的变形保持弯曲。 还描述了包括柔性结构和结合到柔性结构的至少一个固定结构的非规划器集成电路器件。 柔性结构可以以期望的变形弯曲。 柔性结构中可以包括多个接触区域。 电路可嵌入在柔性结构内以执行处理操作。

    Microfluidic chip device and method of making the same
    8.
    发明公开
    Microfluidic chip device and method of making the same 审中-公开
    Mikrofluidische Chipvorrichtung und Herstellungsverfahrendafür

    公开(公告)号:EP2375071A1

    公开(公告)日:2011-10-12

    申请号:EP10175179.0

    申请日:2010-09-03

    IPC分类号: F04B19/00 F04B43/04

    摘要: 11 microfluidic chip device includes a substrate layer (2) and a microfluidic layer (3) . The substrate layer (2) is made from a shape memory polymer, and includes a transformative portion (21) that can change in volume when changing in shape between a memory shape and a temporary shape. The microfluidic layer (3) is laminated with the substrate layer (2) and has a microchannel (31) that is in fluid communication with the transformative portion (21) . The transformative portion (21) produces a fluid driving pressure within the microchannel (31) when changing between the memory shape and the temporary shape. A method of making the microfluidic chip device is also disclosed.

    摘要翻译: 11微流体芯片器件包括衬底层(2)和微流体层(3)。 衬底层(2)由形状记忆聚合物制成,并且包括当存储器形状和临时形状之间形状变化时体积变化的变形部分(21)。 微流体层(3)与基底层(2)层压,并具有与变形部分(21)流体连通的微通道(31)。 当在存储器形状和临时形状之间变化时,变换部分(21)在微通道(31)内产生流体驱动压力。 还公开了制造微流控芯片器件的方法。

    Transmitter, receiver, multi-class multimedia broadcast/multicast service system and modulation method thereof
    9.
    发明公开
    Transmitter, receiver, multi-class multimedia broadcast/multicast service system and modulation method thereof 审中-公开
    发送者,Empfänger,Mehrklassen-Multimedia-Broadcast / Multicast-Dienstsystem和Modulationsverfahrendafür

    公开(公告)号:EP2320589A2

    公开(公告)日:2011-05-11

    申请号:EP10075713.7

    申请日:2010-10-14

    IPC分类号: H04L1/00

    摘要: A multi-class multimedia broadcast/ multicast service (MBMS) system includes a transmitter and at least one receiver. The transmitter transmits N primary signals by N primary channels and an auxiliary signal by an auxiliary channel, wherein a resolution of the auxiliary signal is identical to a resolution of the primary signal with the highest resolution and the constellation mappings of the auxiliary signal and the primary signal with the highest resolution on the corresponding modulation constellations can be coupled. The receiver couples the primary signal with the corresponding auxiliary/virtual auxiliary signal to obtain a lower-resolution virtual auxiliary signal, which can also be coupled with the primary signal having the same resolution. Therefore, receiving quality of each resolution is improved by combining the primary signal and the corresponding auxiliary/virtual auxiliary signal.

    摘要翻译: 多类多媒体广播/多播服务(MBMS)系统包括发射机和至少一个接收机。 发射机通过N个主信道发送N个主信号和辅助信道的辅助信号,其中辅助信号的分辨率与具有最高分辨率的主信号的分辨率和辅助信号和主要信号的星座映射相同 可以耦合在相应的调制星座上具有最高分辨率的信号。 接收器将主信号与相应的辅助/虚拟辅助信号耦合以获得较低分辨率的虚拟辅助信号,其也可与具有相同分辨率的主信号耦合。 因此,通过组合主信号和相应的辅助/虚拟辅助信号来提高每个分辨率的接收质量。

    Organic light emitting diode with nano-dots and fabrication method thereof
    10.
    发明公开
    Organic light emitting diode with nano-dots and fabrication method thereof 审中-公开
    具有它们的制备纳米点和处理的有机发光二极管

    公开(公告)号:EP2180030A3

    公开(公告)日:2010-10-06

    申请号:EP09012884.4

    申请日:2009-10-12

    IPC分类号: C09K11/06 H05B33/14

    CPC分类号: H05B33/14 C09K11/06

    摘要: An organic light emitting diode (OLED) with nano-dots and a fabrication method thereof are disclosed. The OLED apparatus comprises a substrate (76, 88, 94), a first electrically conductive layer (77, 89, 95), a first emission-auxiliary layer (78, 90, 96), an emissive layer (79, 91, 97), a second emission-auxiliary layer (80, 92, 98) and a second electrically conductive layer (81, 93, 99). Its fabrication method is described below. Nano-dots with functional groups on the surface are incorporated into the emissive layer (79, 91, 97), the first emission-auxiliary layer (78, 90, 96) or the second emission-auxiliary layer (80, 92, 98) to form a layered electro-luminescent structure. By using the fabrication method, the resultant efficiency of the OLEDs can be markedly enhanced.