公开(公告)号：EP2806242B1

公开(公告)日：2019-12-11

申请号：EP12865722.8

申请日：2012-01-19

Applicant: Acmecools Tech. Ltd.

Inventor： CHIN, Chite

IPC: F28D15/02 ,  H01L23/427 ,  B23P15/00 ,  F28F3/02 ,  B21D53/02 ,  F28D15/04

公开(公告)号：EP2977676A1

公开(公告)日：2016-01-27

申请号：EP13877354.4

申请日：2013-03-08

Applicant: Acmecools Tech. Ltd.

Inventor： CHIN, Chi-Te

IPC: F21V29/00 ,  F21W131/10

CPC classification number: F21V29/83 ,  F21K9/20 ,  F21K9/60 ,  F21V1/00 ,  F21V29/51 ,  F21V29/81 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2115/10

Abstract: A LED lamp (10)(50) having a good heat-dissipating function includes a thermal radiator (11)(51) of solid metal including a top surface (12) downwardly sloping from a peak point (121) thereof to the border, a plurality of granular bumps (13)(53) raised from the top surface (12) and defining a plurality of flow paths (14)(54) thereamong, a recess (161)(561) curved inwardly from a bottom surface (16) thereof, an eave (17) surrounding the recess (161)(561) and an inner slope located at the inner side of the eave (17) and obliquely upwardly extended from the lowest edge of the eave (17) to the recess (161)(561), a vapor chamber (21)(61) bonded with the top surface (12) thereof to the bottom surface of the recess (161)(561), a circuit module (31)(71) bonded with the top surface (12) thereof to the bottom surface of the vapor chamber (21)(61), and a LED unit (41)(81) mounted at the bottom surface of the circuit module (31)(71).

Abstract translation: 具有良好的散热功能的LED灯（10）（50）包括：固体金属的散热器（11）（51），其包括从其顶点（121）向边缘向下倾斜的顶表面（12） 多个从所述顶表面（12）升起并在其上形成多个流动通道（14）（54）的颗粒状凸起（13），从底面（16）向内弯曲的凹部（161） ），围绕所述凹部（161）（561）的檐部（17）和位于所述檐部（17）的内侧并且从所述檐部（17）的最下边缘向所述凹部（17）倾斜向上延伸的内斜面 161）（561），与上表面（12）接合到凹部（161）（561）的底面的蒸气室（21）（61），电阻模块（31）（71） 顶表面（12）到蒸气室（21）（61）的底表面，以及安装在电路模块（31）（71）的底表面处的LED单元（41）（81）。

公开(公告)号：EP2806242A1

公开(公告)日：2014-11-26

申请号：EP12865722.8

申请日：2012-01-19

Applicant: Acmecools Tech. Ltd.

Inventor： CHIN, Chite

IPC: F28D15/02 ,  H01L23/427 ,  B23P15/00

CPC classification number: F28D15/046 ,  B21D53/02 ,  F28D15/0283 ,  F28D15/04 ,  F28F3/027 ,  F28F2225/00 ,  F28F2240/00 ,  F28F2255/18 ,  F28F2275/067 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method.

Abstract translation: 一种制造散热装置没有注入管和目的是通过该方法制造的方法。 该方法包括的步骤：a）在上壳体和下壳体提供，worin在上壳体和下壳体之间限定的容纳空间中; b）将一毛细管和在接收空间中的支架，焊上壳体和以下述方式下壳体以密封的接缝有气密地之间，并保留一个缝隙; c）中烧结; D）将液体从工作石缝到接收空间介质; 和e）将所述上壳体的组合和在真空环境下壳体到其中的液体工作介质已经在步骤d被注射）和快速焊接缝隙以密封缝隙。 而不喷射管有效地散热的暴露散热装置是由所述的方法制造。

公开(公告)号：EP2977676B1

公开(公告)日：2018-05-09

申请号：EP13877354.4

申请日：2013-03-08

Applicant: Acmecools Tech. Ltd.

Inventor： CHIN, Chi-Te

IPC: F21V29/00 ,  F21W131/10 ,  F21V29/51 ,  F21Y115/10

CPC classification number: F21V29/83 ,  F21K9/20 ,  F21K9/60 ,  F21V1/00 ,  F21V29/51 ,  F21V29/81 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2115/10

Abstract: A LED lamp (10)(50) having a good heat-dissipating function includes a thermal radiator (11)(51) of solid metal including a top surface (12) downwardly sloping from a peak point (121) thereof to the border, a plurality of granular bumps (13)(53) raised from the top surface (12) and defining a plurality of flow paths (14)(54) thereamong, a recess (161)(561) curved inwardly from a bottom surface (16) thereof, an eave (17) surrounding the recess (161)(561) and an inner slope located at the inner side of the eave (17) and obliquely upwardly extended from the lowest edge of the eave (17) to the recess (161)(561), a vapor chamber (21)(61) bonded with the top surface (12) thereof to the bottom surface of the recess (161)(561), a circuit module (31)(71) bonded with the top surface (12) thereof to the bottom surface of the vapor chamber (21)(61), and a LED unit (41)(81) mounted at the bottom surface of the circuit module (31)(71).

公开(公告)号：EP2977676A4

公开(公告)日：2016-08-24

申请号：EP13877354

申请日：2013-03-08

Applicant: ACMECOOLS TECH LTD

Inventor： CHIN CHI-TE

IPC: F21V29/00 ,  F21V29/51 ,  F21W107/10 ,  F21W131/10 ,  F21Y115/10

CPC classification number: F21V29/83 ,  F21K9/20 ,  F21K9/60 ,  F21V1/00 ,  F21V29/51 ,  F21V29/81 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2115/10

Abstract: A LED lamp (10)(50) having a good heat-dissipating function includes a thermal radiator (11)(51) of solid metal including a top surface (12) downwardly sloping from a peak point (121) thereof to the border, a plurality of granular bumps (13)(53) raised from the top surface (12) and defining a plurality of flow paths (14)(54) thereamong, a recess (161)(561) curved inwardly from a bottom surface (16) thereof, an eave (17) surrounding the recess (161)(561) and an inner slope located at the inner side of the eave (17) and obliquely upwardly extended from the lowest edge of the eave (17) to the recess (161)(561), a vapor chamber (21)(61) bonded with the top surface (12) thereof to the bottom surface of the recess (161)(561), a circuit module (31)(71) bonded with the top surface (12) thereof to the bottom surface of the vapor chamber (21)(61), and a LED unit (41)(81) mounted at the bottom surface of the circuit module (31)(71).

公开(公告)号：EP2806242A4

公开(公告)日：2015-10-21

申请号：EP12865722

申请日：2012-01-19

Applicant: ACMECOOLS TECH LTD

Inventor： CHIN CHITE

IPC: F28D15/02 ,  B21D53/02 ,  B23P15/00 ,  F28D15/04 ,  F28F3/02 ,  H01L23/427

CPC classification number: F28D15/046 ,  B21D53/02 ,  F28D15/0283 ,  F28D15/04 ,  F28F3/027 ,  F28F2225/00 ,  F28F2240/00 ,  F28F2255/18 ,  F28F2275/067 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method.