摘要:
A challenge of the present invention is to develop a method for repeatedly forming a reverse transferred pattern in a simple and efficient manner onto the surfaces of Zr based, Ti based, Cu based, Ni based and Fe based metallic glass that have supercooled liquid temperatures of not lower than 400°C and are also required to be molded at not lower than 400°C. (a) An image pattern is converted into bitmap data being mirror reversed with respect to a real image, (b) high energy density light 15 is repeatedly flashed, and the surface of a mold 20 is scanned while one of dot holes 24 is formed by one-time irradiation, to form an image pattern as dots assembled pattern 21 onto the surface of the mold 20 in accordance with the bitmap data, and (c) the dots assembled pattern 21 is reverse-transfer molded onto a metallic glass 1 within a supercooled liquid temperature range Tg-Tx by means of the mold 20 which is for dots assembled pattern formation.